MY187765A - Tape for electronic device packaging - Google Patents

Tape for electronic device packaging

Info

Publication number
MY187765A
MY187765A MYPI2018702989A MYPI2018702989A MY187765A MY 187765 A MY187765 A MY 187765A MY PI2018702989 A MYPI2018702989 A MY PI2018702989A MY PI2018702989 A MYPI2018702989 A MY PI2018702989A MY 187765 A MY187765 A MY 187765A
Authority
MY
Malaysia
Prior art keywords
tape
pressure
electronic device
adhesive layer
sensitive adhesive
Prior art date
Application number
MYPI2018702989A
Inventor
Masami Aoyama
Kunihiko Ishiguro
Toru Sano
Jirou Sugiyama
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of MY187765A publication Critical patent/MY187765A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/453—Leadframes comprising flexible metallic tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass

Landscapes

  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Packages (AREA)

Abstract

Provided is a tape for electronic device packaging, which can suppress the generation of pin marks occurring as a result of deformation of the metal layer caused by the pressure applied by pins of a pick-up apparatus when an adhesive layer-attached metal layer is picked up from a pressure-sensitive adhesive tape, and can suppress the generation of voids between the adhesive layer and an adherend. The tape for electronic device packaging 1 of the invention includes a pressure-sensitive adhesive tape 5 having a base film 51 and a pressure-sensitive adhesive layer 52; and a laminate of an adhesive layer 4 and a metal layer 3 provided by laminating on a surface of the pressure-sensitive adhesive layer 52, the surface being on the opposite side of the base film 51, in which the metal layer 3 has a tensile strength of 350 MPa or higher.
MYPI2018702989A 2016-03-31 2016-11-25 Tape for electronic device packaging MY187765A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016072251A JP6429824B2 (en) 2016-03-31 2016-03-31 Electronic device packaging tape

Publications (1)

Publication Number Publication Date
MY187765A true MY187765A (en) 2021-10-20

Family

ID=59963823

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2018702989A MY187765A (en) 2016-03-31 2016-11-25 Tape for electronic device packaging

Country Status (7)

Country Link
JP (1) JP6429824B2 (en)
KR (2) KR20250065418A (en)
CN (1) CN108885980B (en)
MY (1) MY187765A (en)
SG (1) SG11201807407SA (en)
TW (1) TWI624885B (en)
WO (1) WO2017168827A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6440657B2 (en) * 2016-07-27 2018-12-19 古河電気工業株式会社 Tape for electronic devices
JP6535118B1 (en) * 2018-03-28 2019-06-26 古河電気工業株式会社 Semiconductor processing tape
JP6535138B1 (en) * 2018-03-28 2019-06-26 古河電気工業株式会社 Semiconductor processing tape
KR102789194B1 (en) * 2020-05-12 2025-03-28 삼성전자주식회사 A semiconductor chip mounting tape and a method of manufacturing semiconductor package using the tape

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4954569B2 (en) * 2006-02-16 2012-06-20 日東電工株式会社 Manufacturing method of semiconductor device
JP2007235022A (en) 2006-03-03 2007-09-13 Mitsui Chemicals Inc Adhesive film
JP4157898B2 (en) * 2006-10-02 2008-10-01 株式会社神戸製鋼所 Copper alloy sheet for electrical and electronic parts with excellent press punchability
JP2008124141A (en) * 2006-11-09 2008-05-29 Shin Etsu Chem Co Ltd Adhesive film for dicing and die bonding
JP2010120239A (en) * 2008-11-19 2010-06-03 Nippon Steel Chem Co Ltd Metal-clad laminate and its production method
JP5487847B2 (en) 2009-09-25 2014-05-14 日本電気株式会社 Electronic device package, manufacturing method thereof, and electronic apparatus
PH12012501010A1 (en) * 2009-11-30 2017-08-23 Denki Kagaku Kogyo Kk Adhesive sheet and electronic component
JP5419226B2 (en) 2010-07-29 2014-02-19 日東電工株式会社 Flip chip type film for semiconductor back surface and use thereof
CN103260873B (en) * 2010-12-17 2015-09-23 3M创新有限公司 For packing heat-sealing film and the clad strip of electronic unit
JP5294358B2 (en) * 2012-01-06 2013-09-18 古河電気工業株式会社 Wafer processing tape and semiconductor device manufacturing method using the same
JP6418756B2 (en) * 2013-02-28 2018-11-07 善治 堀田 Method for producing aluminum alloy conductor and method for producing electric wire using aluminum alloy conductor
US10418601B2 (en) * 2014-07-22 2019-09-17 Nippon Steel Corporation Steel foil for power storage device container, power storage device container, power storage device, and manufacturing method of steel foil for power storage device container

Also Published As

Publication number Publication date
CN108885980A (en) 2018-11-23
CN108885980B (en) 2023-04-07
KR20250065418A (en) 2025-05-12
TW201737369A (en) 2017-10-16
KR20180129789A (en) 2018-12-05
JP2017183641A (en) 2017-10-05
SG11201807407SA (en) 2018-09-27
KR102984079B1 (en) 2026-07-01
WO2017168827A1 (en) 2017-10-05
JP6429824B2 (en) 2018-11-28
TWI624885B (en) 2018-05-21

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