MY188629A - Release film - Google Patents

Release film

Info

Publication number
MY188629A
MY188629A MYPI2018002035A MYPI2018002035A MY188629A MY 188629 A MY188629 A MY 188629A MY PI2018002035 A MYPI2018002035 A MY PI2018002035A MY PI2018002035 A MYPI2018002035 A MY PI2018002035A MY 188629 A MY188629 A MY 188629A
Authority
MY
Malaysia
Prior art keywords
release film
release layer
filler
substrate
release
Prior art date
Application number
MYPI2018002035A
Inventor
Shuichi Mori
Ryo Tamura
Takeo Otomo
Waka Sasaki
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=60326238&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=MY188629(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of MY188629A publication Critical patent/MY188629A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/68—Release sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/748—Releasability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2398/00—Unspecified macromolecular compounds
    • B32B2398/10—Thermosetting resins

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

A release film (10) includes a substrate (1) and a release layer (2) formed on the substrate (1), the release layer (2) including a resin component and a filler, wherein a ratio (A/B) of a volume average particle diameter A (?m) of the filler to a mass B (g/m2) per 1 m2 of the release layer (2) is 1 or less. (Figure 1)
MYPI2018002035A 2016-05-20 2017-05-19 Release film MY188629A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016101820 2016-05-20
PCT/JP2017/018930 WO2017200102A1 (en) 2016-05-20 2017-05-19 Mold release film

Publications (1)

Publication Number Publication Date
MY188629A true MY188629A (en) 2021-12-22

Family

ID=60326238

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2018002035A MY188629A (en) 2016-05-20 2017-05-19 Release film

Country Status (7)

Country Link
JP (1) JP6414345B2 (en)
KR (1) KR102340703B1 (en)
CN (1) CN109153155B (en)
MY (1) MY188629A (en)
SG (1) SG11201810343TA (en)
TW (2) TW202237368A (en)
WO (1) WO2017200102A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112292263A (en) 2018-06-22 2021-01-29 小林股份有限公司 Release film and method for producing release film
MY208460A (en) 2018-06-22 2025-05-10 Kobayashi & Co Ltd Release film and method of manufacturing release film
JP6863523B2 (en) * 2018-08-24 2021-04-21 住友ベークライト株式会社 Manufacturing method of release film and molded product
JP6667836B1 (en) 2019-03-20 2020-03-18 株式会社コバヤシ Combination of mold and release film, release film, mold, and method of producing molded article
CN114599495B (en) * 2019-10-24 2024-04-02 株式会社力森诺科 Mold release film and method for manufacturing semiconductor package
CN111016017B (en) * 2019-12-31 2021-10-22 上海凯陆高分子材料有限公司 Material for surface treatment of vulcanization mold and preparation method and application thereof
TWI724765B (en) * 2020-01-21 2021-04-11 達興材料股份有限公司 Laser-debondable composition, laminate thereof, and laser-debonding method
WO2022038712A1 (en) * 2020-08-19 2022-02-24 昭和電工マテリアルズ株式会社 Release film and electronic component device manufacturing method
JP6870775B1 (en) * 2020-10-21 2021-05-12 住友ベークライト株式会社 Manufacturing method of release film and molded product
JP7815867B2 (en) * 2022-03-07 2026-02-18 株式会社レゾナック Release film for semiconductor molding and method for manufacturing semiconductor device

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001038850A (en) * 1999-07-28 2001-02-13 Oji Paper Co Ltd Release sheet for electron beam curing process
JP2002158242A (en) 1999-11-30 2002-05-31 Hitachi Chem Co Ltd Method for manufacturing release sheet for semiconductor mold and resin-encapsulated semiconductor device
JP2004200467A (en) * 2002-12-19 2004-07-15 Hitachi Chem Co Ltd Release sheet for semiconductor mould
JP4183558B2 (en) * 2003-05-26 2008-11-19 ヤマウチ株式会社 Heat press sheet
US8790767B2 (en) * 2004-07-13 2014-07-29 Lintec Corporation Release sheet and formed article obtained by using such release sheet
JP2007287937A (en) 2006-04-17 2007-11-01 Kyocera Chemical Corp Resin-sealed semiconductor device and manufacturing method thereof
JP2008018679A (en) * 2006-07-14 2008-01-31 Dainippon Printing Co Ltd Release film
CN101842236B (en) * 2007-10-31 2013-06-26 尤尼吉可株式会社 Release polyester film
JP5080232B2 (en) * 2007-12-13 2012-11-21 帝人デュポンフィルム株式会社 Release film for green sheet molding and method for producing the same
WO2011068129A1 (en) * 2009-12-03 2011-06-09 旭硝子株式会社 Process for producing fluorocopolymer nanocomposite
ES2570137T3 (en) * 2010-02-15 2016-05-17 Asahi Glass Co Ltd Nonstick Agent Composition
JP5799893B2 (en) * 2012-05-25 2015-10-28 信越化学工業株式会社 Emulsion heavy release additive for release sheet, emulsion composition for release sheet, and release sheet
US10629457B2 (en) * 2012-06-08 2020-04-21 Hitachi Chemical Company, Ltd. Method for manufacturing semiconductor device
WO2014061410A1 (en) * 2012-10-19 2014-04-24 東レ株式会社 Biaxially oriented polyester film for mold release
JP6204051B2 (en) * 2013-04-19 2017-09-27 株式会社巴川製紙所 Mold release sheet
JP6284313B2 (en) * 2013-08-02 2018-02-28 ライオン・スペシャリティ・ケミカルズ株式会社 Release film production method and release film

Also Published As

Publication number Publication date
CN109153155B (en) 2020-11-10
TW202237368A (en) 2022-10-01
KR102340703B1 (en) 2021-12-16
KR20190008883A (en) 2019-01-25
TW201819141A (en) 2018-06-01
CN109153155A (en) 2019-01-04
SG11201810343TA (en) 2018-12-28
WO2017200102A1 (en) 2017-11-23
JPWO2017200102A1 (en) 2018-05-31
JP6414345B2 (en) 2018-10-31

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