MY190638A - Wafer plate and mask arrangement for substrate fabrication - Google Patents

Wafer plate and mask arrangement for substrate fabrication

Info

Publication number
MY190638A
MY190638A MYPI2018701283A MYPI2018701283A MY190638A MY 190638 A MY190638 A MY 190638A MY PI2018701283 A MYPI2018701283 A MY PI2018701283A MY PI2018701283 A MYPI2018701283 A MY PI2018701283A MY 190638 A MY190638 A MY 190638A
Authority
MY
Malaysia
Prior art keywords
wafer
carrier
opening
carriers
wafers
Prior art date
Application number
MYPI2018701283A
Inventor
Terry Bluck
Aaron Zanetto
Terry Pederson
Jr William Eugene Runstadler
Original Assignee
Intevac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intevac Inc filed Critical Intevac Inc
Publication of MY190638A publication Critical patent/MY190638A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/57—Mask-wafer alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

A system (100) for processing wafers (220) in a vacuum processing chamber (400, 600). Carrier (200, 311, 313, 316, 317, 318, 319, 424, 503, 505, 700, 705, 1105, 1205, 1600, 1605) comprising a frame (205) having a plurality of openings (422, 1602), each opening configured to accommodate one wafer. A transport mechanism configured to transport the plurality of carriers throughout the system. A plurality of wafer plates (1610) configured for supporting wafers. An attachment mechanism for attaching a plurality of wafer plates to each of the carriers, wherein each of the wafer plates is attached to a corresponding position at an underside of a corresponding carrier, such that each of the wafers positioned on one of the wafer carriers is positioned within one of the plurality of opening in the carrier. Mask attached over front side of one of the plurality of opening in the carrier. Alignment stage (1664) supports wafer plate under the opening in the carrier. A camera (1670) positioned to simultaneously image the mask and the wafer. Fig. 16D
MYPI2018701283A 2015-10-01 2016-09-30 Wafer plate and mask arrangement for substrate fabrication MY190638A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201562235898P 2015-10-01 2015-10-01
PCT/US2016/055021 WO2017059373A1 (en) 2015-10-01 2016-09-30 Wafer plate and mask arrangement for substrate fabrication

Publications (1)

Publication Number Publication Date
MY190638A true MY190638A (en) 2022-04-29

Family

ID=58427960

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2018701283A MY190638A (en) 2015-10-01 2016-09-30 Wafer plate and mask arrangement for substrate fabrication

Country Status (8)

Country Link
JP (1) JP6816132B2 (en)
KR (1) KR102447219B1 (en)
CN (1) CN108290694B (en)
MY (1) MY190638A (en)
PH (1) PH12018500685A1 (en)
SG (1) SG10201906641WA (en)
TW (1) TWI611998B (en)
WO (1) WO2017059373A1 (en)

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US10328549B2 (en) 2013-12-11 2019-06-25 Taiwan Semiconductor Manufacturing Co., Ltd. Polishing head, chemical-mechanical polishing system and method for polishing substrate
KR101827313B1 (en) 2017-09-19 2018-02-08 주식회사 에이치비테크놀러지 AOI In-line stage with transport device capable of θ-axis alignment
JP6914600B2 (en) * 2017-10-24 2021-08-04 住重アテックス株式会社 Fixing device and ion irradiation method
WO2019225838A1 (en) 2018-05-25 2019-11-28 주식회사 엘지화학 Battery housing and battery module comprising same
DE102018006259A1 (en) * 2018-06-14 2019-12-19 Robert Bosch Gmbh Conveyor device for conveying at least one wafer
US11137675B2 (en) 2018-08-14 2021-10-05 Taiwan Semiconductor Manufacturing Co., Ltd. Mask and method for forming the same
US10916464B1 (en) 2019-07-26 2021-02-09 Applied Materials, Inc. Method of pre aligning carrier, wafer and carrier-wafer combination for throughput efficiency
US11196360B2 (en) 2019-07-26 2021-12-07 Applied Materials, Inc. System and method for electrostatically chucking a substrate to a carrier
US11756816B2 (en) 2019-07-26 2023-09-12 Applied Materials, Inc. Carrier FOUP and a method of placing a carrier
KR102874237B1 (en) * 2019-12-24 2025-10-20 캐논 톡키 가부시키가이샤 Rotation driving apparatus, film-forming system including the same, manufacturing method of electronic device and carrier for carrying subjectto be carried used in the film-forming apparatus
US12002696B2 (en) * 2020-06-30 2024-06-04 Brooks Automation Us, Llc Substrate mapping apparatus and method therefor
WO2022002385A1 (en) * 2020-07-01 2022-01-06 Applied Materials, Inc. Apparatus for moving a substrate, deposition apparatus, and processing system
CN111710639B (en) * 2020-07-20 2025-06-03 北京航空航天大学杭州创新研究院 Alignment device for preparing non-silicon-based thin film devices with high-density array structures
TWI730862B (en) * 2020-08-03 2021-06-11 國立陽明交通大學 Method of fabricating a thin film with a varying thickness
CN116195045A (en) * 2020-10-02 2023-05-30 应用材料公司 Assembled Grid Tray
CN111933557B (en) * 2020-10-19 2021-02-09 晶芯成(北京)科技有限公司 Method and system for correcting center of wafer
US12397951B2 (en) * 2022-11-29 2025-08-26 Jabil Inc. Reticle compact box opener
CN117976510B (en) * 2024-04-02 2024-06-25 浙江求是创芯半导体设备有限公司 Wafer driving structure and workpiece taking and adjusting method
CN119527800B (en) * 2025-01-23 2025-05-09 天津金海通半导体设备股份有限公司 Linkage travelling bogie based on IGBT module and equipment for dynamic and static test thereof

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US3498711A (en) * 1967-10-18 1970-03-03 Texas Instruments Inc Step and repeat camera
US7191512B2 (en) * 1998-09-29 2007-03-20 Applied Kinetics, Inc. Tray system for holding and positioning components
US6716656B2 (en) * 2001-09-04 2004-04-06 The Trustees Of Princeton University Self-aligned hybrid deposition
JP2004012598A (en) * 2002-06-04 2004-01-15 Adtec Engineeng Co Ltd Projection aligner
US7234584B2 (en) * 2002-08-31 2007-06-26 Applied Materials, Inc. System for transporting substrate carriers
WO2006025386A1 (en) 2004-08-31 2006-03-09 Nikon Corporation Aligning method, processing system, substrate loading repeatability measuring method, position measuring method, exposure method, substrate processing apparatus, measuring method and measuring apparatus
WO2009155119A2 (en) * 2008-05-30 2009-12-23 Alta Devices, Inc. Methods and apparatus for a chemical vapor deposition reactor
KR101375097B1 (en) 2010-08-31 2014-03-18 가부시키가이샤 아드반테스트 Wafer tray, semiconductor wafer testing apparatus, and semiconductor wafer testing method
JP6158091B2 (en) * 2010-12-14 2017-07-05 マッパー・リソグラフィー・アイピー・ビー．ブイ． Lithographic system and method for processing a substrate in such a lithographic system
JP5704402B2 (en) * 2011-08-30 2015-04-22 日新イオン機器株式会社 Substrate holding member and method for adjusting position of semiconductor substrate attached to semiconductor holding member
MY175007A (en) * 2011-11-08 2020-06-02 Intevac Inc Substrate processing system and method
CN104685095B (en) * 2012-04-19 2017-12-29 因特瓦克公司 For manufacturing the dual masks device of solar cell
US10062600B2 (en) * 2012-04-26 2018-08-28 Intevac, Inc. System and method for bi-facial processing of substrates
KR102072872B1 (en) * 2012-04-26 2020-02-03 인테벡, 인코포레이티드 System architecture for vacuum processing
CN203185174U (en) * 2013-03-30 2013-09-11 歌尔声学股份有限公司 Vacuum absorption fixing platform
JP6133128B2 (en) * 2013-05-23 2017-05-24 株式会社アルバック Vacuum processing equipment, vibration control equipment
MY181905A (en) * 2014-02-20 2021-01-13 Intevac Inc System and method for bi-facial processing of substrates

Also Published As

Publication number Publication date
PH12018500685A1 (en) 2018-10-15
SG10201906641WA (en) 2019-09-27
WO2017059373A1 (en) 2017-04-06
KR102447219B1 (en) 2022-09-23
CN108290694B (en) 2021-05-04
KR20180059804A (en) 2018-06-05
TWI611998B (en) 2018-01-21
TW201722822A (en) 2017-07-01
CN108290694A (en) 2018-07-17
JP6816132B2 (en) 2021-01-20
JP2018531510A (en) 2018-10-25

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