MY192250A - Tape for semiconductor processing - Google Patents
Tape for semiconductor processingInfo
- Publication number
- MY192250A MY192250A MYPI2017001596A MYPI2017001596A MY192250A MY 192250 A MY192250 A MY 192250A MY PI2017001596 A MYPI2017001596 A MY PI2017001596A MY PI2017001596 A MYPI2017001596 A MY PI2017001596A MY 192250 A MY192250 A MY 192250A
- Authority
- MY
- Malaysia
- Prior art keywords
- tape
- metal layer
- semiconductor processing
- adhesive layer
- semiconductor
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/28—Metal sheet
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/10—Arrangements for heating
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Dicing (AREA)
- Adhesive Tapes (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015255313 | 2015-12-25 | ||
| PCT/JP2016/079627 WO2017110203A1 (ja) | 2015-12-25 | 2016-10-05 | 半導体加工用テープ |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY192250A true MY192250A (en) | 2022-08-11 |
Family
ID=59089994
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI2017001596A MY192250A (en) | 2015-12-25 | 2016-10-05 | Tape for semiconductor processing |
Country Status (7)
| Country | Link |
|---|---|
| JP (1) | JP6800167B2 (ko) |
| KR (1) | KR102513252B1 (ko) |
| CN (1) | CN107960133B (ko) |
| MY (1) | MY192250A (ko) |
| SG (1) | SG11201708735SA (ko) |
| TW (1) | TWI696683B (ko) |
| WO (1) | WO2017110203A1 (ko) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI649398B (zh) * | 2017-09-11 | 2019-02-01 | 達邁科技股份有限公司 | 熱硬化型黏著組成物以及黏著片 |
| US10947417B2 (en) | 2017-09-29 | 2021-03-16 | Taimide Tech. Inc. | Thermal-curable adhesive composition and adhesive sheet |
| JP7154809B2 (ja) * | 2018-04-20 | 2022-10-18 | 株式会社ディスコ | ウエーハの加工方法 |
| JP7111562B2 (ja) * | 2018-08-31 | 2022-08-02 | 株式会社ディスコ | 加工方法 |
| US11541691B2 (en) | 2018-12-19 | 2023-01-03 | The Goodyear Tire & Rubber Company | Composite tread with targeted stiffness gradient and method of making |
| US11993110B2 (en) | 2018-12-19 | 2024-05-28 | The Goodyear Tire & Rubber Company | Reinforced tread and method of forming |
| US20200198414A1 (en) * | 2018-12-19 | 2020-06-25 | The Goodyear Tire & Rubber Company | Method and apparatus for forming a composite tread with microchimneys |
| JP7321639B2 (ja) * | 2019-02-15 | 2023-08-07 | 株式会社ディスコ | ウェーハの加工方法 |
| JP7258421B2 (ja) * | 2019-02-15 | 2023-04-17 | 株式会社ディスコ | ウェーハの加工方法 |
| JP7379829B2 (ja) * | 2019-02-21 | 2023-11-15 | 味の素株式会社 | プリント配線板の製造方法 |
| CN114097073B (zh) * | 2019-11-28 | 2025-12-23 | 积水化学工业株式会社 | 半导体装置的制造方法及半导体加工用层叠体 |
| TWI710288B (zh) * | 2020-01-22 | 2020-11-11 | 頎邦科技股份有限公司 | 電路板的散熱片貼合方法及其貼合裝置 |
| TWI887672B (zh) * | 2023-06-06 | 2025-06-21 | 萬潤科技股份有限公司 | 貼合方法、貼合模組、貼合裝置及貼合設備 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1167699A (ja) * | 1997-08-13 | 1999-03-09 | Texas Instr Japan Ltd | 半導体装置の製造方法 |
| JP4865312B2 (ja) | 2005-12-05 | 2012-02-01 | 古河電気工業株式会社 | チップ用保護膜形成用シート |
| JP2007235022A (ja) | 2006-03-03 | 2007-09-13 | Mitsui Chemicals Inc | 接着フィルム |
| JP4849993B2 (ja) * | 2006-08-14 | 2012-01-11 | 日東電工株式会社 | 粘着シート、その製造方法および積層セラミックシートの切断方法 |
| JP5026832B2 (ja) * | 2007-03-22 | 2012-09-19 | 古河電気工業株式会社 | 半導体デバイス加工用粘着テープ |
| JP5534690B2 (ja) * | 2009-03-23 | 2014-07-02 | 古河電気工業株式会社 | ダイシングテープ |
| JP5681374B2 (ja) * | 2010-04-19 | 2015-03-04 | 日東電工株式会社 | ダイシングテープ一体型半導体裏面用フィルム |
| JP5419226B2 (ja) * | 2010-07-29 | 2014-02-19 | 日東電工株式会社 | フリップチップ型半導体裏面用フィルム及びその用途 |
-
2016
- 2016-10-05 WO PCT/JP2016/079627 patent/WO2017110203A1/ja not_active Ceased
- 2016-10-05 CN CN201680025557.8A patent/CN107960133B/zh active Active
- 2016-10-05 KR KR1020177031446A patent/KR102513252B1/ko active Active
- 2016-10-05 MY MYPI2017001596A patent/MY192250A/en unknown
- 2016-10-05 SG SG11201708735SA patent/SG11201708735SA/en unknown
- 2016-10-05 JP JP2017557751A patent/JP6800167B2/ja active Active
- 2016-12-22 TW TW105142786A patent/TWI696683B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| JP6800167B2 (ja) | 2020-12-16 |
| JPWO2017110203A1 (ja) | 2018-10-18 |
| KR102513252B1 (ko) | 2023-03-24 |
| CN107960133A (zh) | 2018-04-24 |
| TWI696683B (zh) | 2020-06-21 |
| CN107960133B (zh) | 2021-10-26 |
| TW201722711A (zh) | 2017-07-01 |
| SG11201708735SA (en) | 2018-07-30 |
| KR20180098125A (ko) | 2018-09-03 |
| WO2017110203A1 (ja) | 2017-06-29 |
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