MY193375A - Conductive paste for forming external electrode of multilayer ceramic electronic component - Google Patents

Conductive paste for forming external electrode of multilayer ceramic electronic component

Info

Publication number
MY193375A
MY193375A MYPI2021000470A MYPI2021000470A MY193375A MY 193375 A MY193375 A MY 193375A MY PI2021000470 A MYPI2021000470 A MY PI2021000470A MY PI2021000470 A MYPI2021000470 A MY PI2021000470A MY 193375 A MY193375 A MY 193375A
Authority
MY
Malaysia
Prior art keywords
conductive paste
electronic component
external electrode
multilayer ceramic
ceramic electronic
Prior art date
Application number
MYPI2021000470A
Inventor
Soichiro ESAKI
Nobuo Nishioka
Hayato TATENO
Original Assignee
Shoei Chemical Ind Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shoei Chemical Ind Co filed Critical Shoei Chemical Ind Co
Publication of MY193375A publication Critical patent/MY193375A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Conductive Materials (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

The conductive paste of the present invention includes a metal powder containing copper, a glass composition and an organic vehicle, in which the glass composition contains sulfur (S) and the content of the sulfur (S) is 10 ppm or more and 370 ppm or less with respect to the metal powder. According to the present invention, it is possible to provide a conductive paste that has a wide firing window and is less likely to cause problems such as voids and glass floating after firing as a result of appropriately controlling the firing behavior of the single metal powder containing copper.
MYPI2021000470A 2018-08-23 2019-08-20 Conductive paste for forming external electrode of multilayer ceramic electronic component MY193375A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018156627 2018-08-23
PCT/JP2019/032446 WO2020040138A1 (en) 2018-08-23 2019-08-20 Electroconductive paste

Publications (1)

Publication Number Publication Date
MY193375A true MY193375A (en) 2022-10-07

Family

ID=69593293

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2021000470A MY193375A (en) 2018-08-23 2019-08-20 Conductive paste for forming external electrode of multilayer ceramic electronic component

Country Status (6)

Country Link
JP (1) JP6950833B2 (en)
KR (1) KR102441705B1 (en)
CN (1) CN112602158B (en)
MY (1) MY193375A (en)
TW (1) TWI772671B (en)
WO (1) WO2020040138A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102545056B1 (en) * 2021-07-13 2023-06-21 (주)창성 Cupper paste having branch shape and the ceramic product using thereof
WO2023085264A1 (en) * 2021-11-10 2023-05-19 株式会社村田製作所 Layered ceramic capacitor and paste for manufacturing bumps
JP7434407B2 (en) * 2022-04-25 2024-02-20 株式会社ノリタケカンパニーリミテド Paste for external electrodes
WO2024203522A1 (en) * 2023-03-30 2024-10-03 株式会社村田製作所 Multilayer ceramic electronic component
JPWO2025009348A1 (en) * 2023-07-03 2025-01-09
JPWO2025009335A1 (en) * 2023-07-04 2025-01-09
WO2025028125A1 (en) * 2023-07-28 2025-02-06 株式会社村田製作所 External electrode paste
WO2025192599A1 (en) * 2024-03-13 2025-09-18 株式会社村田製作所 Multilayer ceramic electronic component

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63308803A (en) * 1987-01-09 1988-12-16 Hitachi Ltd Conductive paste, electronic circuit components using the same, and manufacturing method thereof
JPH05242725A (en) * 1992-02-27 1993-09-21 Taiyo Yuden Co Ltd Conductive paste
JP3206496B2 (en) * 1997-06-02 2001-09-10 昭栄化学工業株式会社 Metal powder and method for producing the same
JP4789392B2 (en) * 2002-11-22 2011-10-12 京セラ株式会社 Manufacturing method of ceramic laminate
JP4291857B2 (en) * 2007-01-24 2009-07-08 三ツ星ベルト株式会社 Copper conductor paste, conductor circuit board and electronic components
JP4807581B2 (en) * 2007-03-12 2011-11-02 昭栄化学工業株式会社 Nickel powder, method for producing the same, conductor paste, and multilayer ceramic electronic component using the same
TWI421882B (en) * 2009-06-08 2014-01-01 Daiken Chemical Co Ltd Barium titanate powder, nickel paste, preparation method and laminated ceramic capacitors
WO2013018408A1 (en) * 2011-07-29 2013-02-07 株式会社ノリタケカンパニーリミテド Conductive paste composition for solar cells
JP2013072091A (en) * 2011-09-26 2013-04-22 Hitachi Cable Ltd Metal microparticle and method for producing the same, metal paste containing the metal microparticle, and metal coat made of the metal paste
JP5958749B2 (en) 2012-06-22 2016-08-02 株式会社村田製作所 Method for producing metal powder
JP5937904B2 (en) * 2012-06-26 2016-06-22 株式会社ノリタケカンパニーリミテド Paste composition for solar cell electrode
JP6324253B2 (en) 2014-07-30 2018-05-16 Ｊｘ金属株式会社 Conductive paste and manufacturing method thereof
JP2016115448A (en) * 2014-12-11 2016-06-23 株式会社村田製作所 Conductive paste and ceramic electronic component
JP6354970B2 (en) * 2015-10-01 2018-07-11 昭栄化学工業株式会社 Method for forming terminal electrode of conductive paste and multilayer ceramic component
CN106024095B (en) * 2016-05-25 2018-05-15 苏州晶银新材料股份有限公司 A kind of solar cell anaerobic glass electrocondution slurry

Also Published As

Publication number Publication date
KR102441705B1 (en) 2022-09-07
CN112602158A (en) 2021-04-02
JPWO2020040138A1 (en) 2021-06-03
TWI772671B (en) 2022-08-01
JP6950833B2 (en) 2021-10-13
KR20210048503A (en) 2021-05-03
TW202020895A (en) 2020-06-01
CN112602158B (en) 2023-11-28
WO2020040138A1 (en) 2020-02-27

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