MY196457A - Low-Halogen Underfill, Preparation Method And Use Thereof - Google Patents

Low-Halogen Underfill, Preparation Method And Use Thereof

Info

Publication number
MY196457A
MY196457A MYPI2021001952A MYPI2021001952A MY196457A MY 196457 A MY196457 A MY 196457A MY PI2021001952 A MYPI2021001952 A MY PI2021001952A MY PI2021001952 A MYPI2021001952 A MY PI2021001952A MY 196457 A MY196457 A MY 196457A
Authority
MY
Malaysia
Prior art keywords
underfill
low
halogen
ppm
halogen content
Prior art date
Application number
MYPI2021001952A
Inventor
Yi Wei
Hebin Luo
Wanshuang Liu
Original Assignee
Bluesive Shanghai Electronic Mat Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bluesive Shanghai Electronic Mat Co Ltd filed Critical Bluesive Shanghai Electronic Mat Co Ltd
Publication of MY196457A publication Critical patent/MY196457A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)

Abstract

The present invention provides a low-halogen underfill, wherein the components of the underfill comprise silica-modified epoxy resin, or comprise silica-modified epoxy resin and acrylic monomer; and the halogen content of the underfill is not more than 100 ppm; preferably the halogen content of the underfill is not more than 80 ppm; more preferably the halogen content of the underfill is not more than 40 ppm. The low-halogen underfill provided by the invention has the advantages of low viscosity, low halogen content, good mechanical properties, good heat resistance, low thermal expansion coefficient, etc., and has a wider application prospect.
MYPI2021001952A 2018-10-11 2019-08-26 Low-Halogen Underfill, Preparation Method And Use Thereof MY196457A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201811183623.1A CN109233651A (en) 2018-10-11 2018-10-11 A kind of low halogen underfill and its preparation method and application
PCT/CN2019/102499 WO2020073747A1 (en) 2018-10-11 2019-08-26 Low-halogen underfiller, preparation method therefor and application thereof

Publications (1)

Publication Number Publication Date
MY196457A true MY196457A (en) 2023-04-12

Family

ID=65052683

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2021001952A MY196457A (en) 2018-10-11 2019-08-26 Low-Halogen Underfill, Preparation Method And Use Thereof

Country Status (4)

Country Link
CN (1) CN109233651A (en)
MY (1) MY196457A (en)
SG (1) SG11202103677PA (en)
WO (1) WO2020073747A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108384191B (en) * 2018-02-02 2022-08-09 浙江百合航太复合材料有限公司 Low-viscosity high-heat-resistance toughened epoxy resin composition
CN109233651A (en) * 2018-10-11 2019-01-18 北京蓝海黑石科技有限公司 A kind of low halogen underfill and its preparation method and application
CN110272686B (en) * 2019-05-22 2021-10-26 北京蓝海黑石科技有限公司 Low-halogen fast-curing conductive adhesive composition and preparation method thereof
CN115074080B (en) * 2022-07-21 2024-02-13 广州集泰化工股份有限公司 Anti-sedimentation organic silicon pouring sealant and preparation method thereof
CN115305022B (en) * 2022-08-30 2024-03-26 华烁科技股份有限公司 Epoxy resin electronic pouring sealant and preparation method and application thereof
CN115785868B (en) * 2022-12-02 2024-05-17 深圳先进电子材料国际创新研究院 Underfill with low thermal resistance and high thermal conductivity and preparation method thereof
CN116875252B (en) * 2023-08-11 2024-04-12 有行鲨鱼（上海）科技股份有限公司 Low-temperature curing flip chip filling adhesive and preparation method thereof
CN119039915B (en) * 2024-10-29 2025-01-28 武汉市三选科技有限公司 A bottom filling adhesive with reworkability, preparation method and application thereof
CN121379514A (en) * 2025-12-24 2026-01-23 杭州得力科技股份有限公司 An epoxy filler for semiconductor packaging and its preparation method

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102010686B (en) * 2010-09-30 2013-04-17 烟台德邦科技有限公司 Double-solidification system fast-flowing underfill and preparation method thereof
CN102127384B (en) * 2010-12-27 2014-01-01 广东风华高新科技股份有限公司 A kind of anti-shock and light attenuation crystal-bonding insulating adhesive and preparation method thereof
CN103725240A (en) * 2013-12-27 2014-04-16 烟台德邦科技有限公司 Underfill adhesive with storage stability and fast mobility and preparation method of underfill adhesive
CN103937433B (en) * 2014-04-01 2015-09-02 烟台德邦科技有限公司 A kind of high reliability environment-friendly type underfill and preparation method thereof
CN104119644B (en) * 2014-06-09 2016-09-07 中山市盈兴电子有限公司 Encapsulating material for transformer
WO2016172911A1 (en) * 2015-04-30 2016-11-03 Henkel Ag & Co. Kgaa A one-part curable adhesive compositionand the use thereof
CN106590320A (en) * 2015-10-16 2017-04-26 中兴通讯股份有限公司 Aluminum alloy die casting defect mending agent and preparation method thereof
CN106566450A (en) * 2016-11-10 2017-04-19 烟台德邦科技有限公司 Flowing type chip-scale bottom filling adhesive and preparation method thereof
CN107474773B (en) * 2017-09-09 2020-08-14 烟台德邦科技有限公司 Smart card chip adhesive and preparation method thereof
CN109233651A (en) * 2018-10-11 2019-01-18 北京蓝海黑石科技有限公司 A kind of low halogen underfill and its preparation method and application

Also Published As

Publication number Publication date
WO2020073747A1 (en) 2020-04-16
SG11202103677PA (en) 2021-05-28
CN109233651A (en) 2019-01-18

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