MY199516A - Flux and solder paste - Google Patents

Flux and solder paste

Info

Publication number
MY199516A
MY199516A MYPI2019004173A MYPI2019004173A MY199516A MY 199516 A MY199516 A MY 199516A MY PI2019004173 A MYPI2019004173 A MY PI2019004173A MY PI2019004173 A MYPI2019004173 A MY PI2019004173A MY 199516 A MY199516 A MY 199516A
Authority
MY
Malaysia
Prior art keywords
flux
solder paste
present
metal deactivator
hydrazide
Prior art date
Application number
MYPI2019004173A
Inventor
Ryuichi Tsuda
Masato Shiratori
Yoshinori Takagi
Hiroyoshi Kawasaki
Yutaka Hashimoto
Kazuya Kitazawa
Original Assignee
Senju Metal Industry Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co filed Critical Senju Metal Industry Co
Publication of MY199516A publication Critical patent/MY199516A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

An object of the present invention is to provide a flux and a solder paste capable of improving a thickening-suppressing effect. A flux of the present invention contains a metal deactivator, and the metal deactivator contains a hydrazide-based nitrogen compound.
MYPI2019004173A 2018-07-20 2019-07-19 Flux and solder paste MY199516A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018136633A JP6903037B2 (en) 2018-07-20 2018-07-20 Solder paste

Publications (1)

Publication Number Publication Date
MY199516A true MY199516A (en) 2023-11-02

Family

ID=69169274

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2019004173A MY199516A (en) 2018-07-20 2019-07-19 Flux and solder paste

Country Status (3)

Country Link
JP (1) JP6903037B2 (en)
CN (1) CN110732806B (en)
MY (1) MY199516A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20250256362A1 (en) * 2022-07-22 2025-08-14 Senju Metal Industry Co., Ltd. Flux and solder paste

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020116611A (en) * 2019-01-24 2020-08-06 株式会社弘輝 Flux and solder paste
JP7822588B2 (en) * 2020-07-10 2026-03-03 株式会社弘輝 Flux and solder paste
JP7161510B2 (en) * 2020-09-15 2022-10-26 株式会社タムラ製作所 Solder composition and electronic substrate
CN116140857B (en) * 2023-02-01 2026-04-21 深圳市汉尔信电子科技有限公司 A low-temperature solder paste for reflow soldering, its preparation method and application
CN116921916A (en) * 2023-08-07 2023-10-24 苏州诺而达电子材料有限公司 High-temperature lead-free halogen-free solder paste and preparation method thereof

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59141393A (en) * 1983-01-31 1984-08-14 Mitsui Eng & Shipbuild Co Ltd Brazing filler material
JPH0615483A (en) * 1992-07-02 1994-01-25 Shikoku Chem Corp Flux for soldering and solder paste composition
ATE400395T1 (en) * 2000-11-29 2008-07-15 Senju Metal Industry Co SOLDER PASTES
JP4718369B2 (en) * 2006-05-08 2011-07-06 本田技研工業株式会社 Solder alloy
CN101670500B (en) * 2009-09-25 2011-09-07 广州有色金属研究院 Aqueous nickel welding paste for stainless steel brazing
JP5730353B2 (en) * 2013-07-17 2015-06-10 ハリマ化成株式会社 Solder composition, solder paste and electronic circuit board
JP6717559B2 (en) * 2013-10-16 2020-07-01 三井金属鉱業株式会社 Solder alloy and solder powder
JP5887330B2 (en) * 2013-12-26 2016-03-16 株式会社タムラ製作所 Solder composition and printed wiring board using the same
CN108044259B (en) * 2017-12-01 2020-04-03 温州宏丰电工合金股份有限公司 Preparation method of flow resisting agent for stainless steel vacuum brazing

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20250256362A1 (en) * 2022-07-22 2025-08-14 Senju Metal Industry Co., Ltd. Flux and solder paste
US12479051B2 (en) * 2022-07-22 2025-11-25 Senju Metal Industry Co., Ltd. Flux and solder paste

Also Published As

Publication number Publication date
JP6903037B2 (en) 2021-07-14
JP2020011283A (en) 2020-01-23
CN110732806A (en) 2020-01-31
CN110732806B (en) 2021-12-03

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