MY209813A - Flux and solder paste - Google Patents

Flux and solder paste

Info

Publication number
MY209813A
MY209813A MYPI2021007671A MYPI2021007671A MY209813A MY 209813 A MY209813 A MY 209813A MY PI2021007671 A MYPI2021007671 A MY PI2021007671A MY PI2021007671 A MYPI2021007671 A MY PI2021007671A MY 209813 A MY209813 A MY 209813A
Authority
MY
Malaysia
Prior art keywords
flux
solder paste
fatty acid
imidazole compound
flux including
Prior art date
Application number
MYPI2021007671A
Inventor
Yuki Yamamoto
Mitsuyasu Furusawa
Original Assignee
Koki Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koki Kk filed Critical Koki Kk
Publication of MY209813A publication Critical patent/MY209813A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

Provided is a flux including a fatty acid and an imidazole compound.
MYPI2021007671A 2019-06-27 2020-06-26 Flux and solder paste MY209813A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019119983A JP7517669B2 (en) 2019-06-27 2019-06-27 Flux and solder paste
PCT/JP2020/025288 WO2020262631A1 (en) 2019-06-27 2020-06-26 Flux and solder paste

Publications (1)

Publication Number Publication Date
MY209813A true MY209813A (en) 2025-08-06

Family

ID=74061787

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2021007671A MY209813A (en) 2019-06-27 2020-06-26 Flux and solder paste

Country Status (5)

Country Link
JP (1) JP7517669B2 (en)
CN (1) CN113993657A (en)
MY (1) MY209813A (en)
TW (1) TW202106890A (en)
WO (1) WO2020262631A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7252504B1 (en) * 2022-08-26 2023-04-05 千住金属工業株式会社 Manufacturing method of flux and electronic parts

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03124395A (en) * 1989-10-03 1991-05-27 Hideyuki Kawai Preflux for soldering
JP3449778B2 (en) * 1993-04-05 2003-09-22 株式会社日本スペリア社 Flux for soldering
EP0619162A3 (en) * 1993-04-05 1995-12-27 Takeda Chemical Industries Ltd Soldering flux.
JP2719311B2 (en) * 1994-12-07 1998-02-25 双葉電子工業株式会社 No-cleaning flux for soldering
JP2001179487A (en) * 1999-12-17 2001-07-03 Tdk Corp Flux for soldering
CN101934437A (en) * 2010-09-30 2011-01-05 常州市亚太微电子材料有限公司 Unleaded solder paste and preparation method thereof
JP5667101B2 (en) * 2012-02-20 2015-02-12 株式会社タムラ製作所 Solder composition, method for producing the same, and printed wiring board
JP5951339B2 (en) * 2012-04-19 2016-07-13 旭化成株式会社 Solder paste using thermosetting resin composition
JP6405920B2 (en) * 2014-11-12 2018-10-17 千住金属工業株式会社 Solder paste flux, solder paste and solder joint
JP6130418B2 (en) * 2015-03-10 2017-05-17 株式会社タムラ製作所 Electronic component joining method, and solder composition and pretreatment agent used in the method
JP6444953B2 (en) * 2015-09-30 2018-12-26 株式会社タムラ製作所 Flux composition and solder paste
JP6229813B1 (en) * 2017-07-12 2017-11-15 千住金属工業株式会社 Soldering flux and solder paste
CN108274155A (en) * 2018-04-17 2018-07-13 深圳市博士达焊锡制品有限公司 A kind of solder scaling powder and preparation method thereof and a kind of solder(ing) paste
JP6458894B1 (en) * 2018-04-26 2019-01-30 千住金属工業株式会社 Flux and solder paste

Also Published As

Publication number Publication date
CN113993657A (en) 2022-01-28
JP7517669B2 (en) 2024-07-17
WO2020262631A1 (en) 2020-12-30
JP2021003730A (en) 2021-01-14
TW202106890A (en) 2021-02-16

Similar Documents

Publication Publication Date Title
PH12020551553A1 (en) Solder paste
MY183244A (en) Solder paste and solder joint
EP4130312A4 (en) Flux and solder paste
MY201457A (en) Flux and solder paste
MY199516A (en) Flux and solder paste
MX2021015457A (en) FORMULATIONS OF DIHYDROMYRICETIN AND A PERMEABILIZER.
MX2020012706A (en) Flux for solder paste and solder paste.
WO2016113493A3 (en) System for monitoring the peak power for an rf power amplification and associated method of calculating peak value and of selecting supply voltage
MX2022000230A (en) Flux, resin flux cored solder using flux, flux coated solder using flux, and soldering method.
EP4083243A4 (en) Flux and solder paste
PT4190484T (en) Flux and solder paste
HUE071020T2 (en) Flux and solder paste
EP3954796A4 (en) Flux, solder paste, and electronic circuit board
EP3987646A4 (en) Combined converter circuit
EP4306593A4 (en) Magnetic paste
EP4275816A4 (en) Copper paste
EP4335941A4 (en) LEAD-FREE SOLDER PASTE
PL3834980T3 (en) Solder paste
EP4000168A4 (en) Power electronic converter
EP3950983A4 (en) RESIN COMPOSITION FOR SOLDERING, WELDING COMPOSITION AS WELL AS RESIN FLUX CORE SOLDER, AND FLUX AND SOLDER PASTE
HUE066495T2 (en) Flux and solder paste
TH2501000390A (en) Solder flux and solder paste.
TH2501000386A (en) Solder flux and solder paste.
PH12021552243A1 (en) Flux
GB202018797D0 (en) Power flux