MY200011A - Bonding head for mounting components and die bonder with such a bonding head - Google Patents

Bonding head for mounting components and die bonder with such a bonding head

Info

Publication number
MY200011A
MY200011A MYPI2018704163A MYPI2018704163A MY200011A MY 200011 A MY200011 A MY 200011A MY PI2018704163 A MYPI2018704163 A MY PI2018704163A MY PI2018704163 A MYPI2018704163 A MY PI2018704163A MY 200011 A MY200011 A MY 200011A
Authority
MY
Malaysia
Prior art keywords
shaft
bonding head
axis
mounting components
longitudinal direction
Prior art date
Application number
MYPI2018704163A
Inventor
Rene Kroehnert
Original Assignee
Besi Switzerland Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Besi Switzerland Ag filed Critical Besi Switzerland Ag
Publication of MY200011A publication Critical patent/MY200011A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0406—Drive mechanisms for pick-and-place heads, e.g. details relating to power transmission, motors or vibration damping
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K1/00—Details of the magnetic circuit
    • H02K1/06—Details of the magnetic circuit characterised by the shape, form or construction
    • H02K1/22—Rotating parts of the magnetic circuit
    • H02K1/27—Rotor cores with permanent magnets
    • H02K1/2706—Inner rotors
    • H02K1/272—Inner rotors the magnetisation axis of the magnets being perpendicular to the rotor axis
    • H02K1/274—Inner rotors the magnetisation axis of the magnets being perpendicular to the rotor axis the rotor consisting of two or more circumferentially positioned magnets
    • H02K1/2753—Inner rotors the magnetisation axis of the magnets being perpendicular to the rotor axis the rotor consisting of two or more circumferentially positioned magnets the rotor consisting of magnets or groups of magnets arranged with alternating polarity
    • H02K1/276—Magnets embedded in the magnetic core, e.g. interior permanent magnets [IPM]
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
    • H02K11/20—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection for measuring, monitoring, testing, protecting or switching
    • H02K11/21—Devices for sensing speed or position, or actuated thereby
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
    • H02K11/20—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection for measuring, monitoring, testing, protecting or switching
    • H02K11/25—Devices for sensing temperature, or actuated thereby
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K7/00—Arrangements for handling mechanical energy structurally associated with dynamo-electric machines, e.g. structural association with mechanical driving motors or auxiliary dynamo-electric machines
    • H02K7/10—Structural association with clutches, brakes, gears, pulleys or mechanical starters
    • H02K7/116—Structural association with clutches, brakes, gears, pulleys or mechanical starters with gears
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07178—Means for aligning

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Wire Bonding (AREA)
  • Reciprocating, Oscillating Or Vibrating Motors (AREA)

Abstract

Bonding head for mounting components and Die Bonder with such a bonding head ABSTRACT A bonding head (1) for mounting components comprises a shaft (2) and a housing part (3) in which the shaft (2) is supported. The bearing of the shaft (2) enables a rotation of the shaft (2) about an axis (6) and a displacement of the shaft (2) in the longitudinal direction of the axis (6) by a predetermined stroke H. The bonding head (1) further comprises an electric motor with a stator attached to the housing part (3) and a rotor attached to the shaft (2), an encoder for measuring the rotational position of the shaft (2), and a force generator for applying a force to the shaft (2). The stator comprises coils (7) to which currents can be applied, the rotor comprises a plurality of permanent magnets (8). A length of the permanent magnets (8) measured in the longitudinal direction of the axis (6) is shorter or longer than an effective length of the coils (7) measured in the longitudinal direction of the axis (6) by at least the stroke H. Fig. 6
MYPI2018704163A 2017-11-17 2018-11-08 Bonding head for mounting components and die bonder with such a bonding head MY200011A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH01396/17A CH714351A1 (en) 2017-11-17 2017-11-17 Bonding head for the assembly of components.
CH00957/18A CH714384A2 (en) 2017-11-17 2018-08-06 Bonding head for the assembly of components and die bonders with such a bonding head.

Publications (1)

Publication Number Publication Date
MY200011A true MY200011A (en) 2023-12-04

Family

ID=66646772

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2018704163A MY200011A (en) 2017-11-17 2018-11-08 Bonding head for mounting components and die bonder with such a bonding head

Country Status (6)

Country Link
JP (1) JP7398191B2 (en)
KR (1) KR102661560B1 (en)
CN (1) CN110011439B (en)
CH (2) CH714351A1 (en)
MY (1) MY200011A (en)
TW (1) TWI848919B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3975664B1 (en) 2019-05-23 2025-11-12 Nippon Steel Corporation Secondary coil module, traverse hardening apparatus, and traverse hardening method
GB2591132A (en) * 2020-01-17 2021-07-21 Asm Assembly Systems Singapore Pte Ltd Tooling pin placement system
JP2024080318A (en) 2022-12-02 2024-06-13 三星電子株式会社 Mounting device and mounting method

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2979772B2 (en) * 1991-09-13 1999-11-15 松下電器産業株式会社 Die bonding equipment
JP2998467B2 (en) * 1992-12-04 2000-01-11 松下電器産業株式会社 Head for mounting electronic components
US5952744A (en) * 1996-03-28 1999-09-14 Anoiad Corporation Rotary-linear actuator
JP3800126B2 (en) 2002-04-23 2006-07-26 松下電器産業株式会社 Working head
DE60320596T2 (en) * 2003-08-25 2009-06-10 Husky Injection Molding Systems Ltd., Bolton INJECTION UNIT WITH A DRIVE ARRANGEMENT FOR TURNING AND TRANSLATORY MOVEMENT OF A SHAFT
JP5068571B2 (en) 2007-03-29 2012-11-07 芝浦メカトロニクス株式会社 Electronic component mounting equipment
JP2008288473A (en) 2007-05-21 2008-11-27 Panasonic Corp Wire bonding method and wire bonding apparatus
US8651159B2 (en) * 2009-06-12 2014-02-18 Asm Assembly Automation Ltd Die bonder providing a large bonding force
KR20110137602A (en) * 2010-06-17 2011-12-23 한미반도체 주식회사 Bond head of die bonding device
CH707378A1 (en) * 2012-12-21 2014-06-30 Besi Switzerland Ag Thermocompression method and apparatus for mounting semiconductor chips on a substrate.
CH707480B1 (en) * 2013-01-21 2016-08-31 Besi Switzerland Ag Bonding head with a heating and cooling suction device.
CH707934B1 (en) * 2013-04-19 2017-04-28 Besi Switzerland Ag Method for mounting electronic or optical components on a substrate.
US9726204B2 (en) * 2013-12-09 2017-08-08 Samsung Electronics Co., Ltd. Fluid pressure actuator
JP6372031B2 (en) * 2013-12-09 2018-08-15 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． Fluid pressure actuator
JP6573813B2 (en) * 2015-09-30 2019-09-11 ファスフォードテクノロジ株式会社 Die bonder and semiconductor device manufacturing method
JP6664986B2 (en) * 2016-02-17 2020-03-13 株式会社ディスコ Processing equipment

Also Published As

Publication number Publication date
CN110011439A (en) 2019-07-12
CH714351A1 (en) 2019-05-31
JP2019096867A (en) 2019-06-20
KR102661560B1 (en) 2024-04-26
TW201923940A (en) 2019-06-16
KR20190056985A (en) 2019-05-27
JP7398191B2 (en) 2023-12-14
TWI848919B (en) 2024-07-21
CH714384A2 (en) 2019-05-31
CN110011439B (en) 2023-10-17

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