TW201923940A - Bonding head for mounting components and die bonder with such a bonding head - Google Patents
Bonding head for mounting components and die bonder with such a bonding head Download PDFInfo
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- TW201923940A TW201923940A TW107139446A TW107139446A TW201923940A TW 201923940 A TW201923940 A TW 201923940A TW 107139446 A TW107139446 A TW 107139446A TW 107139446 A TW107139446 A TW 107139446A TW 201923940 A TW201923940 A TW 201923940A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0406—Drive mechanisms for pick-and-place heads, e.g. details relating to power transmission, motors or vibration damping
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K1/00—Details of the magnetic circuit
- H02K1/06—Details of the magnetic circuit characterised by the shape, form or construction
- H02K1/22—Rotating parts of the magnetic circuit
- H02K1/27—Rotor cores with permanent magnets
- H02K1/2706—Inner rotors
- H02K1/272—Inner rotors the magnetisation axis of the magnets being perpendicular to the rotor axis
- H02K1/274—Inner rotors the magnetisation axis of the magnets being perpendicular to the rotor axis the rotor consisting of two or more circumferentially positioned magnets
- H02K1/2753—Inner rotors the magnetisation axis of the magnets being perpendicular to the rotor axis the rotor consisting of two or more circumferentially positioned magnets the rotor consisting of magnets or groups of magnets arranged with alternating polarity
- H02K1/276—Magnets embedded in the magnetic core, e.g. interior permanent magnets [IPM]
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
- H02K11/20—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection for measuring, monitoring, testing, protecting or switching
- H02K11/21—Devices for sensing speed or position, or actuated thereby
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
- H02K11/20—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection for measuring, monitoring, testing, protecting or switching
- H02K11/25—Devices for sensing temperature, or actuated thereby
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K7/00—Arrangements for handling mechanical energy structurally associated with dynamo-electric machines, e.g. structural association with mechanical driving motors or auxiliary dynamo-electric machines
- H02K7/10—Structural association with clutches, brakes, gears, pulleys or mechanical starters
- H02K7/116—Structural association with clutches, brakes, gears, pulleys or mechanical starters with gears
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
- H10P72/0602—Temperature monitoring
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07178—Means for aligning
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Die Bonding (AREA)
- Wire Bonding (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Reciprocating, Oscillating Or Vibrating Motors (AREA)
Abstract
本發明涉及用於安裝組件的接合頭和具有這種接合頭的接合機,該接合頭(1)包括軸(2)和該軸(2)被支撐在其中的殼體部(3)。軸(2)的軸承使得軸(2)繞軸線(6)旋轉並且使軸(2)在軸線(6)的縱向方向上位移預定的行程(H)。接合頭進一步包括:電動馬達,其具有被附接到殼體部(3)的定子和被附接到軸(2)的轉子;編碼器,其用於測量軸(2)的旋轉位置;和力產生器,其用於施加力至該軸(2)上。定子包括能夠被施加電流的線圈(7),轉子包括複數個永久磁鐵(8)。在軸線(6)的縱向方向上測量的永久磁鐵(8)的長度比在軸線(6)的縱向方向上測量的線圈(7)的有效長度短至少行程(H)或長至少行程(H)。 The invention relates to an engaging head for mounting a component and an engaging machine having such an engaging head, the engaging head (1) comprising a shaft (2) and a housing part (3) in which the shaft (2) is supported. The bearing of the shaft (2) rotates the shaft (2) about the axis (6) and displaces the shaft (2) by a predetermined stroke (H) in the longitudinal direction of the axis (6). The joint head further includes: an electric motor having a stator attached to the housing portion (3) and a rotor attached to the shaft (2); an encoder for measuring a rotational position of the shaft (2); and A force generator for applying a force to the shaft (2). The stator includes a coil (7) to which an electric current can be applied, and the rotor includes a plurality of permanent magnets (8). The length of the permanent magnet (8) measured in the longitudinal direction of the axis (6) is shorter than the effective length of the coil (7) measured in the longitudinal direction of the axis (6) by at least the stroke (H) or by at least the stroke (H) .
Description
本發明涉及一種用於將組件(通常是電子組件或光學組件,特別地是半導體晶片和倒裝晶片)安裝在基板上的接合頭。安裝過程也稱為接合過程或裝配過程。本發明還涉及一種具有這種接合頭的、在工業上被周知為晶粒接合機的半導體安裝設備。 The present invention relates to a bonding head for mounting a component (generally an electronic component or an optical component, particularly a semiconductor wafer and a flip chip) on a substrate. The installation process is also referred to as a joining process or an assembly process. The present invention also relates to a semiconductor mounting apparatus having such a bonding head and which is industrially known as a die bonding machine.
具有這種類型的接合頭的自動裝配機特別地被用於半導體工業中。這種自動裝配機的示例是晶粒接合機或拾取和放置機,這些機器被用於將半導體晶片、微型機械和微型光學組件等形式的組件放置和接合到基板(諸如引線架、印刷電路板、陶瓷等)上。由接合頭將在拾取位置處拾取,特別是吸入的組件,移動到基板的位置並且在精確地限定的位置處放置在基板上。該接合頭是拾取和放置系統的一部分,該拾取和放置系統允許接合頭在至少三個空間方向上的移動。 Automatic assembly machines with bonding heads of this type are used in particular in the semiconductor industry. Examples of such automated assembly machines are die bonders or pick and place machines that are used to place and bond components in the form of semiconductor wafers, micromechanics, and micro optical components to substrates such as lead frames, printed circuit boards , Ceramics, etc.). The pick-up position, in particular the suctioned component, is picked up by the bonding head, moved to the position of the substrate and placed on the substrate at a precisely defined position. The joint head is part of a pick and place system that allows movement of the joint head in at least three spatial directions.
該接合頭包括:軸,該軸能夠繞軸線旋轉並且能夠在該軸線的縱向方向上移動;驅動器,該驅動器 用於旋轉該軸;編碼器,該編碼器用於測量該軸的旋轉位置,和力產生器,該力產生器用於在該軸線的縱向方向上施加力至該軸上。該軸直接地拾取組件或被構造成用於拾取被構造成用於拾取組件的晶片夾持器,例如“晶片夾頭”。 The joint head includes: a shaft that can rotate about an axis and can move in a longitudinal direction of the axis; a driver that rotates the shaft; an encoder that measures a rotational position of the shaft, and a force A generator for applying a force to the shaft in a longitudinal direction of the axis. This shaft picks up the assembly directly or is configured for picking up a wafer holder, such as a "wafer chuck", configured for picking up the assembly.
由申請人使用的接合頭包括驅動器,該驅動器包括電動馬達和由兩個齒輪形成的齒輪組,該兩個齒輪中的一個齒輪被附接到該電動馬達的軸,並且另一個齒輪被附接到該接合頭的軸。 The joint head used by the applicant includes a driver including an electric motor and a gear set formed by two gears, one of the two gears is attached to a shaft of the electric motor, and the other gear is attached To the shaft of the joint head.
本發明的目的是開發一種接合頭,利用該接合頭,該軸的旋轉位置能夠以更高的角度精度定位,並且利用該接合頭,該軸能夠以盡可能小的力在該軸線的縱向方向上移動。 The object of the present invention is to develop a joint head with which the rotational position of the shaft can be positioned with higher angular accuracy, and with the joint head, the shaft can be oriented in the longitudinal direction of the axis with as little force as possible. Move up.
1‧‧‧接合頭 1‧‧‧ joint head
2‧‧‧軸 2‧‧‧ axis
3‧‧‧殼體部 3‧‧‧shell
4‧‧‧孔 4‧‧‧ hole
5‧‧‧軸的末端 5‧‧‧ end of shaft
6‧‧‧軸線 6‧‧‧ axis
7‧‧‧線圈 7‧‧‧coil
8‧‧‧永久磁鐵 8‧‧‧ permanent magnet
9‧‧‧圓盤 9‧‧‧ disc
10‧‧‧讀取頭 10‧‧‧Read head
11‧‧‧蓋 11‧‧‧ cover
12‧‧‧腔 12‧‧‧ cavity
13‧‧‧穿孔 13‧‧‧ perforation
14‧‧‧第一鑽孔 14‧‧‧ first drilling
15‧‧‧第二鑽孔 15‧‧‧second drilling
16‧‧‧管 16‧‧‧ tube
H‧‧‧行程 H‧‧‧ Itinerary
在併入本說明書中並構成本說明書的一部分的附圖例示出了本發明的一個以上的實施例,並且與詳細說明一起用於解釋本發明的原理和實施方式。該附圖不是按比例繪製的。 The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate one or more embodiments of the invention and, together with the detailed description, serve to explain the principles and embodiments of the invention. The drawing is not drawn to scale.
在附圖中:圖1示意性地並且在截面中示出了接合頭的第一實施例,圖2示出了用於該接合頭中的電動馬達的轉子的磁體佈置,圖3和圖4例示出了長度比, 圖5示意性地並且在截面中示出了具有氣動力產生器的接合頭,圖6示意性地並且在截面中示出了具有氣動力產生器和空氣軸承的接合頭,圖7示意性地並且在截面中示出了具有集成溫度控制裝置的接合頭,並且圖8示意性地示出了用於接合頭的驅動器。 In the drawings: Fig. 1 shows schematically and in section a first embodiment of a joint head, Fig. 2 shows a magnet arrangement for a rotor of an electric motor in the joint head, Figs. 3 and 4 The length ratio is exemplified, FIG. 5 shows the joint head with aerodynamic generator schematically and in section, and FIG. 6 shows the joint head with aerodynamic generator and air bearing schematically and in section. Fig. 7 shows schematically and in section a joint head with an integrated temperature control device, and Fig. 8 schematically shows a driver for the joint head.
圖1示意性地示出了該接合頭1的截面。該接合頭1包括軸2和殼體部3,該軸2被支撐在該殼體部3中。該軸2包含孔4,該孔4通向該軸2的末端5並且能夠被供應真空。該軸2的末端5被構造成接收組件或用於組件的晶片夾持器。該軸2的軸承允許軸2繞軸線6旋轉以及允許軸2在該軸線6的縱向方向上位移預定行程H(圖3)。該軸2的直徑在其長度上能夠具有不同的等級,如在圖1、圖5和圖6中所示。該接合頭1進一步包括:驅動器,該驅動器被構造成使該軸2繞該軸線6旋轉;編碼器,該編碼器被構造成測量該軸2的旋轉位置;和力產生器,該力產生器被構造成在該軸線6的縱向方向上施加力至該軸2上。該力例如是當拾取元件時的預定拾取力或當將組件安裝在基板上時預定的接合力。 FIG. 1 schematically shows a cross section of the joint head 1. The joint head 1 includes a shaft 2 and a housing portion 3, and the shaft 2 is supported in the housing portion 3. The shaft 2 contains a hole 4 which leads to the end 5 of the shaft 2 and can be supplied with a vacuum. The end 5 of the shaft 2 is configured to receive a component or a wafer holder for the component. The bearing of the shaft 2 allows the shaft 2 to rotate about the axis 6 and allows the shaft 2 to be displaced by a predetermined stroke H in the longitudinal direction of the axis 6 (FIG. 3). The diameter of this shaft 2 can have different grades in its length, as shown in FIGS. 1, 5 and 6. The joint head 1 further includes: a driver configured to rotate the shaft 2 about the axis 6; an encoder configured to measure a rotational position of the shaft 2; and a force generator, the force generator It is configured to apply a force to the shaft 2 in the longitudinal direction of the axis 6. The force is, for example, a predetermined pickup force when a component is picked up or a predetermined bonding force when a component is mounted on a substrate.
該驅動器是包括定子和轉子的電動馬達,該定子被附接到該殼體部3,並且該轉子被附接到該軸2。 該定子包括能夠被供應電流的線圈7,並且該轉子包括複數個永久磁鐵8。 The driver is an electric motor including a stator and a rotor, the stator is attached to the housing portion 3, and the rotor is attached to the shaft 2. The stator includes a coil 7 capable of being supplied with current, and the rotor includes a plurality of permanent magnets 8.
原則上,該電動馬達是市售的電動馬達,該市售的電動馬達為了本發明的目的而被改進,使得該等永久磁鐵8的長度縮短至少行程H。這一改進減小了扭矩,但是技術上是簡單的,並且具有這樣的優點,即同時轉子的質量變得更小,或能夠以扭矩為代價來減小甚至最小化。將該等線圈7的長度延長至少行程H的替代方案也是可能的,但是不是較佳的。如在圖2中所示,該等永久磁鐵8是扁平的平行六面體磁體,其中該等永久磁鐵8的兩個相對的最大表面被磁化為北極N和南極S。該等永久磁鐵8被佈置在圓上。該等永久磁鐵8的面向圓心的最大區域交替地是北極N和南極S。該等永久磁鐵8的背對圓心的最大區域則交替地是南極S和北極N。 In principle, the electric motor is a commercially available electric motor, which is improved for the purpose of the present invention, so that the length of the permanent magnets 8 is shortened by at least the stroke H. This improvement reduces torque, but is technically simple and has the advantage that at the same time the mass of the rotor becomes smaller, or can be reduced or even minimized at the expense of torque. Alternatives to extend the length of the coils 7 by at least the stroke H are also possible, but not preferred. As shown in FIG. 2, the permanent magnets 8 are flat parallelepiped magnets, in which two opposite largest surfaces of the permanent magnets 8 are magnetized into a north pole N and a south pole S. The permanent magnets 8 are arranged on a circle. The largest areas facing the center of the permanent magnets 8 are the north pole N and the south pole S alternately. The largest regions of the permanent magnets 8 facing away from the center of the circle are alternately the south pole S and the north pole N.
該電動馬達用於使該軸2繞該軸線6旋轉。由於該軸2必須能夠在軸線6的縱向方向上位移,所以該等永久磁鐵8的長度L1(圖3)比該等線圈7的有效長度L2短至少行程H或比該等線圈7的有效長度L2長行程H,使得由該等線圈7施加在該等永久磁鐵8上的力獨立於由該軸2沿著該軸線6的縱向方向佔據的位置。該線圈7在該軸線6的縱向方向上具有預定的機械長度L3。該有效長度L2表示在由流過線圈7的整體並使該等永久磁鐵8繞該軸線6旋轉的電流產生的磁場內的長度提供了作用在該等永久磁鐵8上的力的主要部分。因 此,該有效長度L2比該機械長度L3短。圖3例示出了該等永久磁鐵8的長度L1比該等線圈7的有效長度L2短行程H的情況,並且圖4例示出了該等永久磁鐵8的長度L1比線圈7的有效長度L2長行程H的情況。因此L1 L2-H或L1 L2+H The electric motor is used to rotate the shaft 2 about the axis 6. Since the shaft 2 must be able to be displaced in the longitudinal direction of the axis 6, the length L1 (FIG. 3) of the permanent magnets 8 is shorter than the effective length L2 of the coils 7 by at least the stroke H or longer than the effective length of the coils 7. L2 has a long stroke H such that the force exerted by the coils 7 on the permanent magnets 8 is independent of the position occupied by the shaft 2 along the longitudinal direction of the axis 6. The coil 7 has a predetermined mechanical length L3 in the longitudinal direction of the axis 6. The effective length L2 indicates that the length in the magnetic field generated by the current flowing through the whole of the coil 7 and rotating the permanent magnets 8 around the axis 6 provides a major part of the force acting on the permanent magnets 8. Therefore, the effective length L2 is shorter than the mechanical length L3. FIG. 3 illustrates a case where the length L1 of the permanent magnets 8 is shorter than the effective length L2 of the coil 7 by a stroke H, and FIG. 4 illustrates that the length L1 of the permanent magnets 8 is longer than the effective length L2 of the coil 7. In the case of stroke H. So L 1 L 2 -H or L 1 L 2 + H
在第一種情況中,即使在該軸2沿著該軸線6軸向位移期間,該等永久磁鐵8(並且因此該轉子)仍保留在該等線圈7的磁場中;在第二種情況中,該等永久磁鐵8在整個軸向位移期間延伸超過該等線圈7。在該軸2的軸向位移期間,在兩種情況中,最多出現沿著軸線6作用的非常小的力或力的變化。 In the first case, the permanent magnets 8 (and therefore the rotor) remain in the magnetic field of the coils 7 even during the axial displacement of the shaft 2 along the axis 6; in the second case The permanent magnets 8 extend beyond the coils 7 during the entire axial displacement. During the axial displacement of this shaft 2, in both cases a very small force or a change in force acting along the axis 6 occurs at most.
該編碼器被構造成測量該軸2的旋轉位置。該編碼器較佳地由圓盤9和編碼器讀取頭10形成,該圓盤9被附接到該軸2並且具有被附接到該圓盤9的邊緣的編碼器標尺,該編碼器讀取頭10被附接到該接合頭1,較佳地,被附接到該接合頭1的殼體部3。該編碼器標尺具有在該軸線6的縱向方向上延伸的短線。在該軸線6的縱向方向上測量的短線的長度和在軸線6的縱向方向上延伸的該編碼器讀取頭10的測量範圍相匹配,使得該短線在該軸2的整個行程H上位於該編碼器讀取頭10的測量範圍內。 The encoder is configured to measure the rotational position of the shaft 2. The encoder is preferably formed by a disc 9 and an encoder reading head 10 which is attached to the shaft 2 and has an encoder scale attached to the edge of the disc 9, the encoder The read head 10 is attached to the joint head 1, preferably, to the housing portion 3 of the joint head 1. The encoder scale has a short line extending in the longitudinal direction of the axis 6. The length of the short line measured in the longitudinal direction of the axis 6 matches the measurement range of the encoder reading head 10 extending in the longitudinal direction of the axis 6 so that the short line is located over the entire stroke H of the shaft 2 Within the measuring range of the encoder reading head 10.
角度感測器也能夠用作編碼器,例如磁角度感測器,該磁角度感測器基於由該等永久磁鐵8或光學角度感測器或任何其他角度感測器產生的磁場判定旋轉位置。 The angle sensor can also be used as an encoder, such as a magnetic angle sensor, which determines the rotation position based on the magnetic field generated by the permanent magnet 8 or the optical angle sensor or any other angle sensor .
力產生器被用於產生拾取力和接合力。例如,機械力產生器能夠被用作力產生器,特別是其中使用彈簧的力產生器,該彈簧作用在軸2上以產生作用在該軸線6的縱向方向上的力。氣動力產生器也能夠被用作力產生器,如在圖5和圖6中示意性並且在截面中示出的接合頭1的情況。這裏,該殼體部3和被放置在殼體部3上的蓋11與該軸2一起形成封閉的腔12,該封閉的腔12的體積在該軸2的縱向移動動期間改變。該蓋11包含穿孔13,該腔12能夠通過該穿孔13利用壓縮空氣被加壓。因此,該腔12形成壓力室,並且在該壓力室中占主導地位的壓力產生作用在該軸2上的力。該軸2在軸線6的縱向方向上的移動(即行程H)例如由止擋來限制。一方面,在空載狀態下,由該力產生器產生的力將軸2壓靠在該止擋上。另一方面,因為在拾取和接合期間該軸2被推離該止擋,所以當拾取組件時,該力作為拾取力作用在該組件上,並且當放下組件時,該力作為接合力。在這些處理步驟期間該軸2的移動是被動移動,這是由於當該軸2落在組件上時以及當組件落在基板上時,該軸2成為靜止的事實,而由驅動器17(圖8)驅動的該接合頭1進一步被降低,直到檢測到觸地,並且該驅動器17停止。 A force generator is used to generate picking and engaging forces. For example, a mechanical force generator can be used as a force generator, particularly a force generator in which a spring is used, which acts on the shaft 2 to generate a force acting in the longitudinal direction of the axis 6. Aerodynamic generators can also be used as force generators, as is the case with the joint head 1 schematically in FIGS. 5 and 6 and shown in section. Here, the housing part 3 and the cover 11 placed on the housing part 3 together with the shaft 2 form a closed cavity 12 whose volume changes during the longitudinal movement of the shaft 2. The cover 11 includes a perforation 13 through which the cavity 12 can be pressurized with compressed air. The cavity 12 thus forms a pressure chamber, and the pressure prevailing in the pressure chamber generates a force acting on the shaft 2. The movement of the shaft 2 in the longitudinal direction of the axis 6 (that is, the stroke H) is limited by, for example, a stop. On the one hand, in the no-load state, the force generated by the force generator presses the shaft 2 against the stop. On the other hand, since the shaft 2 is pushed away from the stop during picking and engaging, the force acts on the component as a picking force when the component is picked up, and as the engaging force when the component is lowered. The movement of the shaft 2 during these processing steps is a passive movement due to the fact that the shaft 2 becomes stationary when the shaft 2 falls on the component and when the component falls on the substrate, and is driven by the drive 17 (FIG. 8 The engagement head 1 driven by) is further lowered until a touchdown is detected, and the driver 17 stops.
在該殼體部3中該軸2的軸承可以例如是滑動軸承、滾珠軸承、空氣軸承或其他合適的軸承。在圖5中所示的示例性實施例中,該軸2由滑動軸承支撐在殼體部3中,在圖6中所示的示例性實施例中,該軸2 由空氣軸承支撐。在該空氣軸承的情況下,該殼體部3具有用於供應壓縮空氣的空氣進口。在該空氣軸承的較佳設計中,該殼體部3還具有用於從該空氣軸承中移除空氣的空氣出口。例如,該等空氣進口是第一鑽孔14,並且例如,該等空氣出口是第二鑽孔15。如果存在空氣進口和空氣出口,則該等空氣進口在該軸線6的縱向方向上位於出口中的一些出口之間。該等空氣出口能夠與環境相連接,使得該環境壓力被施加在該等空氣出口上,或真空能夠被施加到該等空氣出口,以便吸出通過該等空氣進口被迫進入空氣軸承的空氣。在該等空氣進口和該等空氣出口中的空氣的流動方向在圖6中由(橫向地偏移)箭頭示出。利用這種空氣進口被空氣出口圍繞的配置,防止了通過該等空氣進口壓入該軸2和該殼體部3之間的間隙的空氣的一部分到達該腔12,並且因此改變了在該軸線6的縱向方向上作用在軸2上的力。 The bearing of the shaft 2 in the housing portion 3 may be, for example, a plain bearing, a ball bearing, an air bearing, or another suitable bearing. In the exemplary embodiment shown in FIG. 5, the shaft 2 is supported in the housing portion 3 by a sliding bearing, and in the exemplary embodiment shown in FIG. 6, the shaft 2 is supported by an air bearing. In the case of the air bearing, the housing portion 3 has an air inlet for supplying compressed air. In a preferred design of the air bearing, the housing portion 3 also has an air outlet for removing air from the air bearing. For example, the air inlets are first holes 14 and, for example, the air outlets are second holes 15. If there are air inlets and air outlets, they are located between some of the outlets in the longitudinal direction of the axis 6. The air outlets can be connected to the environment such that the ambient pressure is applied to the air outlets, or a vacuum can be applied to the air outlets to suck out air forced into the air bearings through the air inlets. The flow direction of the air in the air inlets and the air outlets is shown by (laterally offset) arrows in FIG. 6. With this configuration in which the air inlet is surrounded by the air outlet, a part of the air that has been pressed into the gap between the shaft 2 and the housing portion 3 through the air inlets is prevented from reaching the cavity 12 and thus changed on the axis The force acting on the shaft 2 in the longitudinal direction of 6.
圖7示意性地並且在截面中示出了具有溫度控制裝置的接合頭。該溫度控制裝置用於將接合頭1的預定部件的溫度維持在預定值。該溫度控制裝置例如包括管16,該管16有利地集成到如圖所示的殼體部3中,並且該管16是閉合熱回路的一部分,流體通過該閉合熱回路流動,該流體的溫度在外部加熱或冷卻或加熱和冷卻裝置中被控制到預定值。該流體能夠是氣態的或液態的。在特定情況下,該溫度控制裝置是集成在該殼體部3中的電加熱電阻。該溫度控制裝置能夠與所有接合頭1一起使用。例如,在具有氣動力產生器的接合頭1上, 該溫度控制裝置能夠被用於將在壓力室中的溫度控制到預定值,使得由該力產生器產生的力獨立於環境溫度的變化。 Fig. 7 shows schematically and in section a joint head with a temperature control device. This temperature control device is used to maintain the temperature of a predetermined part of the bonding head 1 at a predetermined value. The temperature control device comprises, for example, a tube 16 which is advantageously integrated into the housing part 3 as shown, and which is part of a closed thermal circuit through which the fluid flows, the temperature of the fluid Controlled to a predetermined value in an external heating or cooling or heating and cooling device. The fluid can be gaseous or liquid. In a specific case, the temperature control device is an electric heating resistor integrated in the case portion 3. This temperature control device can be used with all joint heads 1. For example, on the joint head 1 having a pneumatic generator, the temperature control device can be used to control the temperature in the pressure chamber to a predetermined value so that the force generated by the force generator is independent of changes in the ambient temperature.
根據本發明的接合頭通常被用於在工業上被周知為晶粒接合機的半導體安裝設備中。這種半導體安裝設備包括驅動器17,該驅動器17被構造成使該接合頭1在該軸線6的縱向方向上移動。當拾取組件時和當接合組件時,該接合頭1由該驅動器17降低,由此該軸2被被動地攜帶。 The bonding head according to the present invention is generally used in a semiconductor mounting apparatus which is industrially known as a die bonding machine. This semiconductor mounting apparatus includes a driver 17 configured to move the joint head 1 in the longitudinal direction of the axis 6. When the assembly is picked up and when the assembly is engaged, the engagement head 1 is lowered by the driver 17, whereby the shaft 2 is passively carried.
該接合頭提供了幾個優點,即: The joint head offers several advantages, namely:
- 根據本發明之用於轉動該軸的驅動器是直接驅動器,並且因此是無遊隙驅動器,在該驅動器中,轉子被直接地附接到該軸,這使得能夠無游隙並且因此高精度地移動到軸的旋轉位置。這與已知之齒輪介於該驅動器和該軸之間的接合頭形成對比。 -The drive for rotating the shaft according to the present invention is a direct drive, and therefore a backlash-free drive, in which the rotor is directly attached to the shaft, which enables backlash-free and therefore high accuracy Move to the rotation position of the shaft. This is in contrast to known joints where the gear is interposed between the drive and the shaft.
- 該軸的旋轉位置的測量是直接的並且無遊隙的測量,因為該編碼器標尺被安裝在且被附接到該軸的圓盤上。 -The measurement of the rotational position of the shaft is direct and free of play because the encoder scale is mounted on and attached to the disc of the shaft.
- 在沒有齒輪和沒有齒形帶等的情況下,該軸的直接驅動是無磨損的並且不會產生任何磨耗。這在無塵室環境中是特別有利的,在該無塵室環境中,磨耗可能損壞積體電路(IC),導致半導體晶片被顆粒污染。 -In the absence of gears and toothed belts, the direct drive of the shaft is wear-free and does not cause any wear. This is particularly advantageous in a clean room environment where abrasion may damage the integrated circuit (IC) and cause semiconductor wafers to be contaminated with particles.
- 該軸的軸向位移,即該軸沿著其縱向軸線的位移基本上是沒有力的。這意味著在該拾取力或接合力的建立期間,該軸沿著縱向軸線的位移不會產生任何使由力產生 器產生的力增加或減小的附加力。這與已知的將齒輪或齒形帶插入在該驅動器和該軸之間的接合頭形成對比。 -The axial displacement of the shaft, i.e. the displacement of the shaft along its longitudinal axis is essentially forceless. This means that during the establishment of the picking or engaging force, the displacement of the shaft along the longitudinal axis does not produce any additional force that increases or decreases the force generated by the force generator. This is in contrast to known joints that insert a gear or toothed belt between the drive and the shaft.
- 該設計是節省空間的、緊密的,並且允許在較小的空間中和在較小的重量的情況下產生半導體組件的安裝所需的相對大的接合力。 -The design is space-saving, compact, and allows relatively large bonding forces required for the mounting of semiconductor components in a small space and with a small weight.
- 該包括轉子的軸之質量非常小。當該軸撞擊組件時,施加在該組件上的臨時力與動量成正比,即該軸的質量和速度的乘積,並且不得超過預定值,否則該組件可能被損壞。較小的質量允許更高的速度,並且因此導致更短的循環時間。 -The mass of the shaft including the rotor is very small. When the shaft hits a component, the temporary force exerted on the component is proportional to the momentum, that is, the product of the shaft's mass and speed, and must not exceed a predetermined value, otherwise the component may be damaged. The smaller mass allows higher speeds and therefore results in shorter cycle times.
- 具有空氣軸承的接合頭的設計允許了該軸的幾乎無摩擦的旋轉和位移。 -The design of the joint head with air bearing allows almost frictionless rotation and displacement of the shaft.
- 具有溫度控制裝置的接合頭的設計使得能夠最小化或消除環境的溫度波動對該接合頭的影響以及因此對接合過程的影響。 -The design of the bonding head with a temperature control device makes it possible to minimize or eliminate the influence of ambient temperature fluctuations on the bonding head and therefore the bonding process.
雖然已經示出並且描述了此發明的實施例和應用,但是對於那些受益於本公開的本領域技術人員來說顯而易見的是,在不脫離本文的發明構思的情況下,可以進行比上述更多的修改。因此,除了所附申請專利範圍及其均等物的精神之外,本發明不受限制。 Although embodiments and applications of this invention have been shown and described, it will be apparent to those skilled in the art having the benefit of this disclosure that more can be done than described above without departing from the inventive concepts herein. Modifications. Therefore, the present invention is not limited except by the scope of the appended patent applications and their equivalents.
Claims (10)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CH01396/17A CH714351A1 (en) | 2017-11-17 | 2017-11-17 | Bonding head for the assembly of components. |
| CH01396/17 | 2017-11-17 | ||
| CH00957/18A CH714384A2 (en) | 2017-11-17 | 2018-08-06 | Bonding head for the assembly of components and die bonders with such a bonding head. |
| CH00957/18 | 2018-08-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201923940A true TW201923940A (en) | 2019-06-16 |
| TWI848919B TWI848919B (en) | 2024-07-21 |
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| TW107139446A TWI848919B (en) | 2017-11-17 | 2018-11-07 | Bonding head for mounting components and die bonder with such a bonding head |
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| JP (1) | JP7398191B2 (en) |
| KR (1) | KR102661560B1 (en) |
| CH (2) | CH714351A1 (en) |
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| TW (1) | TWI848919B (en) |
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| WO2020235598A1 (en) | 2019-05-23 | 2020-11-26 | 日本製鉄株式会社 | Secondary coil module, traverse hardening apparatus, and traverse hardening method |
| JP2024080318A (en) | 2022-12-02 | 2024-06-13 | 三星電子株式会社 | Mounting device and mounting method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2998467B2 (en) * | 1992-12-04 | 2000-01-11 | 松下電器産業株式会社 | Head for mounting electronic components |
| US5952744A (en) * | 1996-03-28 | 1999-09-14 | Anoiad Corporation | Rotary-linear actuator |
| JP3800126B2 (en) * | 2002-04-23 | 2006-07-26 | 松下電器産業株式会社 | Working head |
| JP5068571B2 (en) * | 2007-03-29 | 2012-11-07 | 芝浦メカトロニクス株式会社 | Electronic component mounting equipment |
| JP2008288473A (en) * | 2007-05-21 | 2008-11-27 | Panasonic Corp | Wire bonding method and wire bonding apparatus |
| US8651159B2 (en) * | 2009-06-12 | 2014-02-18 | Asm Assembly Automation Ltd | Die bonder providing a large bonding force |
| KR20110137602A (en) * | 2010-06-17 | 2011-12-23 | 한미반도체 주식회사 | Bond head of die bonding device |
| CH707378A1 (en) * | 2012-12-21 | 2014-06-30 | Besi Switzerland Ag | Thermocompression method and apparatus for mounting semiconductor chips on a substrate. |
| CH707480B1 (en) * | 2013-01-21 | 2016-08-31 | Besi Switzerland Ag | Bonding head with a heating and cooling suction device. |
| CH707934B1 (en) * | 2013-04-19 | 2017-04-28 | Besi Switzerland Ag | Method for mounting electronic or optical components on a substrate. |
| JP6372031B2 (en) * | 2013-12-09 | 2018-08-15 | 三星電子株式会社Samsung Electronics Co.,Ltd. | Fluid pressure actuator |
| JP6573813B2 (en) * | 2015-09-30 | 2019-09-11 | ファスフォードテクノロジ株式会社 | Die bonder and semiconductor device manufacturing method |
| JP6664986B2 (en) * | 2016-02-17 | 2020-03-13 | 株式会社ディスコ | Processing equipment |
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2017
- 2017-11-17 CH CH01396/17A patent/CH714351A1/en not_active Application Discontinuation
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| MY200011A (en) | 2023-12-04 |
| JP2019096867A (en) | 2019-06-20 |
| KR20190056985A (en) | 2019-05-27 |
| KR102661560B1 (en) | 2024-04-26 |
| JP7398191B2 (en) | 2023-12-14 |
| TWI848919B (en) | 2024-07-21 |
| CH714351A1 (en) | 2019-05-31 |
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