MY200914A - Resin composition for printed wiring board, copper foil with resin, copper-clad laminate board, and printed wiring board - Google Patents

Resin composition for printed wiring board, copper foil with resin, copper-clad laminate board, and printed wiring board

Info

Publication number
MY200914A
MY200914A MYPI2020001548A MYPI2020001548A MY200914A MY 200914 A MY200914 A MY 200914A MY PI2020001548 A MYPI2020001548 A MY PI2020001548A MY PI2020001548 A MYPI2020001548 A MY PI2020001548A MY 200914 A MY200914 A MY 200914A
Authority
MY
Malaysia
Prior art keywords
printed wiring
resin
wiring board
copper
resin composition
Prior art date
Application number
MYPI2020001548A
Inventor
Yoshihiro Yoneda
Toshifumi Matsushima
Toshihiro Hosoi
Original Assignee
Mitsui Mining & Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co Ltd filed Critical Mitsui Mining & Smelting Co Ltd
Publication of MY200914A publication Critical patent/MY200914A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L35/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least one other carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/02—Polyamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

Provided is a resin composition for printed wiring boards that can have excellent dielectric properties (very low dielectric loss tangent) suitable for high frequency applications, and can exhibit superior interlayer adhesiveness and high heat resistance when incorporated into copper-clad laminates or printed wiring boards. The resin composition comprises a maleimide resin, a polyimide resin in an amount of 150 to 1200 parts by weight with respect to 100 parts by weight of the maleimide resin, and a polycarbodiimide resin in an amount of 15 to 120 parts by weight with respect to 100 parts by weight of the maleimide resin.
MYPI2020001548A 2017-10-10 2018-10-04 Resin composition for printed wiring board, copper foil with resin, copper-clad laminate board, and printed wiring board MY200914A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017196984 2017-10-10
PCT/JP2018/037165 WO2019073891A1 (en) 2017-10-10 2018-10-04 Resin composition for printed wiring board, copper foil with resin, copper-clad laminate board, and printed wiring board

Publications (1)

Publication Number Publication Date
MY200914A true MY200914A (en) 2024-01-23

Family

ID=66100760

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2020001548A MY200914A (en) 2017-10-10 2018-10-04 Resin composition for printed wiring board, copper foil with resin, copper-clad laminate board, and printed wiring board

Country Status (5)

Country Link
JP (1) JP7212626B2 (en)
CN (1) CN111201277B (en)
MY (1) MY200914A (en)
TW (1) TWI678396B (en)
WO (1) WO2019073891A1 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7575861B2 (en) * 2018-12-03 2024-10-30 味の素株式会社 Resin composition
WO2020184569A1 (en) * 2019-03-12 2020-09-17 出光興産株式会社 Circuit board and method for producing circuit board
JP7563912B2 (en) * 2019-08-01 2024-10-08 積水化学工業株式会社 Resin materials and multilayer printed wiring boards
JP7563913B2 (en) * 2019-08-01 2024-10-08 積水化学工業株式会社 Resin materials and multilayer printed wiring boards
JP7529392B2 (en) * 2019-10-29 2024-08-06 日鉄ケミカル＆マテリアル株式会社 Silica particles, resin composition, resin film and metal-clad laminate
JP7351201B2 (en) * 2019-11-29 2023-09-27 味の素株式会社 resin composition
US20230035382A1 (en) * 2019-12-23 2023-02-02 Shin-Etsu Polymer Co., Ltd. Adhesive composition
JP2024038791A (en) * 2022-09-08 2024-03-21 信越化学工業株式会社 Resin compositions, prepregs, copper clad laminates and printed wiring boards
JP7774943B2 (en) * 2023-01-18 2025-11-25 信越化学工業株式会社 Thermosetting maleimide resin composition, adhesive, primer, chip code agent and semiconductor device
JP2024139793A (en) * 2023-03-28 2024-10-10 日本化薬株式会社 Polyimide resin composition and cured product thereof
TW202523772A (en) * 2023-09-21 2025-06-16 日商日本化藥股份有限公司 Polyimide resin-containing composition and cured prodcut thereof
WO2025163932A1 (en) * 2024-01-31 2025-08-07 株式会社レゾナック Resin film, printed wiring board, and semiconductor package
CN118440498B (en) * 2024-05-28 2025-02-14 广东工业大学 A COFs nano/BD resin composite material and its preparation method and application

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3562109B2 (en) * 1996-02-19 2004-09-08 Ｊｓｒ株式会社 adhesive
JPH10279799A (en) * 1997-04-04 1998-10-20 Nitto Denko Corp Thermosetting resin composition
JP3923441B2 (en) * 2003-03-25 2007-05-30 三光株式会社 Flame retardant synthetic resin composition
JP4896533B2 (en) * 2006-01-25 2012-03-14 三菱瓦斯化学株式会社 Resin composite copper foil and method for producing the same
JP4911252B1 (en) * 2010-11-30 2012-04-04 東洋インキＳｃホールディングス株式会社 Thermosetting resin composition containing carboxyl group-containing modified ester resin
US20130040517A1 (en) * 2011-03-07 2013-02-14 Mitsubishi Gas Chemical Company, Inc. Resin composition for printed circuit board
JP6026095B2 (en) * 2011-10-31 2016-11-16 太陽インキ製造株式会社 Thermosetting resin composition, cured product thereof, and printed wiring board using the same
TWI519602B (en) * 2014-06-06 2016-02-01 Elite Material Co Ltd Low dielectric resin composition and the application of its resin film, semi-cured film and circuit board
JP2016079220A (en) * 2014-10-10 2016-05-16 日立化成株式会社 Compound having imide group and carbodiimide group in molecule, method for producing the compound, resin composition, prepreg, laminate and film
CN104910585B (en) * 2015-06-10 2018-03-30 苏州生益科技有限公司 Compositions of thermosetting resin and the prepreg and laminate using its making
JPWO2017168732A1 (en) 2016-03-31 2019-02-07 日立化成株式会社 Resin composition, prepreg, resin sheet and laminate
KR102370912B1 (en) * 2016-06-02 2022-03-07 미쓰이금속광업주식회사 Resin composition for printed wiring boards and resin sheet for printed wiring boards using same

Also Published As

Publication number Publication date
CN111201277B (en) 2021-12-03
CN111201277A (en) 2020-05-26
TW201922924A (en) 2019-06-16
JP7212626B2 (en) 2023-01-25
JPWO2019073891A1 (en) 2020-09-10
WO2019073891A1 (en) 2019-04-18
TWI678396B (en) 2019-12-01

Similar Documents

Publication Publication Date Title
MY200914A (en) Resin composition for printed wiring board, copper foil with resin, copper-clad laminate board, and printed wiring board
PH12017502362B1 (en) Roughened copper foil, copper-clad laminate and printed wiring board
EP3805316A4 (en) Resin composition, prepreg, metal foil-clad laminate, resin sheet and printed wiring board
MY180785A (en) Resin-clad copper foil, copper-clad laminated plate, and printed wiring board
PH12019000429A1 (en) Copper foil, copper-clad laminate board, method for producing printed wiring board, method for producing electronic apparatus, method for producing transmission channel, and method for producing antenna
MY186397A (en) Roughened copper foil, copper-clad laminate, and printed wiring board
EP4112294A4 (en) Resin composition, cured product, prepreg, metal foil-clad laminate board, resin sheet, and printed circuit board
PH12020551737A1 (en) Surface treated copper foil, copper clad laminate, and printed circuit board
SG11201900449YA (en) Resin composition, laminate sheet, and multilayer printed wiring board
MY186451A (en) Copper foil provided with carrier, laminate, printed wiring board, electronic device, and method for fabricating printed wiring board
MY186859A (en) Treated surface copper foil, copper foil with carrier as well as methods for manufacturing copper-clad laminate and printed circuit board using same
MY177771A (en) Carrier-attached copper foil, laminate, method for producing printed wiring board, and method for producing electronic device
MY169978A (en) Low dielectric loss thermoset resin system at high frequency for use in electrical components
SG11201502604RA (en) Resin composition, prepreg, laminate plate, metallic foil clad laminate, and printed circuit board
EP3660027A4 (en) Thermosetting resin composition, prepreg made therefrom, laminate clad with metal foil, and high-frequency circuit board
MY143997A (en) Resin composition, prepreg and their uses
EP3660026A4 (en) Thermosetting resin composition, prepreg made therefrom, laminate clad with metal foil, and high-frequency circuit board
TW200735730A (en) Resin composite copper foil, printed wiring board, and production process thereof
PH12014502195B1 (en) Surface-treated copper foil
EP2578613B8 (en) Epoxy resin composition and pre-preg, support-provided resin film, metallic foil clad laminate plate and multilayer printed circuit board utilizing said composition
TW200742520A (en) Resin composition, resin film, coverlay film, interlayer adhesive, metal clad laminate, and multilayer printer circuit board
MY181388A (en) Roughened copper foil, copper clad laminate, and printed circuit board
SG11202007290XA (en) Resin composition, copper foil with resin, dielectric layer, copper-clad laminate, capacitor element, and printed wiring board with built-in capacitor
EP4112298A4 (en) Resin composition, cured product, prepreg, metal foil-clad laminate board, resin sheet, and printed circuit board
EP3290453A4 (en) Epoxy resin composition, thermoconductive material precursor, b-stage sheet, prepreg, heat-dissipating material, laminated plate, metal substrate, and printed circuit board