MY201806A - Curable polysilsesquioxane compound, curable composition, cured product, and, method for using curable composition - Google Patents

Curable polysilsesquioxane compound, curable composition, cured product, and, method for using curable composition

Info

Publication number
MY201806A
MY201806A MYPI2021001101A MYPI2021001101A MY201806A MY 201806 A MY201806 A MY 201806A MY PI2021001101 A MYPI2021001101 A MY PI2021001101A MY PI2021001101 A MYPI2021001101 A MY PI2021001101A MY 201806 A MY201806 A MY 201806A
Authority
MY
Malaysia
Prior art keywords
curable composition
curable
formula
polysilsesquioxane compound
cured product
Prior art date
Application number
MYPI2021001101A
Inventor
Akiko Umeda
Manabu Miyawaki
Hidekazu Nakayama
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of MY201806A publication Critical patent/MY201806A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/24—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen halogen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/544—Silicon-containing compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C09J183/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Silicon Polymers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Sealing Material Composition (AREA)

Abstract

The present invention is: a curable polysilsesquioxane compound having a repeating unit represented by the formula (a-1), and characterized by satisfying a specified requirement relating to 29Si-NMR and having a mass average molecular weight (Mw) in a specified range; a curable composition comprising said curable polysilsesquioxane compound; a cured product obtained by curing the curable composition; and, a method for using the curable composition as an adhesive for an optical element fixation member or as a sealant for an optical element fixation member. The curable composition according to the present invention has excellent curing properties and a low refractive index. In formula (a-1), R1 represents a fluoroalkyl group represented by a composition formula: CmH(2m-n+1)Fn. m represents an integer of 1 to 10, and n represents an integer of at least 2 and up to (2m+1). D represents a linking group that connects R1 and Si (excluding an alkylene group) or a single bond. Formula (a-1): R1-D-SiO3/2
MYPI2021001101A 2018-09-28 2019-09-27 Curable polysilsesquioxane compound, curable composition, cured product, and, method for using curable composition MY201806A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018183181 2018-09-28
PCT/JP2019/038220 WO2020067451A1 (en) 2018-09-28 2019-09-27 Curable polysilsesquioxane compound, curable composition, cured product, and, method for using curable composition

Publications (1)

Publication Number Publication Date
MY201806A true MY201806A (en) 2024-03-19

Family

ID=69952791

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2021001101A MY201806A (en) 2018-09-28 2019-09-27 Curable polysilsesquioxane compound, curable composition, cured product, and, method for using curable composition

Country Status (6)

Country Link
JP (1) JP6830563B2 (en)
KR (1) KR102891164B1 (en)
CN (1) CN112739748B (en)
MY (1) MY201806A (en)
TW (1) TWI831839B (en)
WO (1) WO2020067451A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN120843056B (en) * 2025-08-11 2026-02-10 广东志力新型包装材料有限公司 Natural resin adhesive, production method and application thereof in paper-plastic composite packaging

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5026813A (en) * 1989-12-27 1991-06-25 General Electric Company Polysilsequioxane and polymethyl-N-hexylsilsesquioxane coating compositions
JP4205368B2 (en) * 2002-06-11 2009-01-07 株式会社Ａｄｅｋａ Curable composition for optical materials
CN100451070C (en) * 2003-04-07 2009-01-14 陶氏康宁公司 Curable organopolysiloxane resin composition for optical waveguide, and method for producing same
JP4734832B2 (en) 2003-05-14 2011-07-27 ナガセケムテックス株式会社 Encapsulant for optical element
JP2005263869A (en) 2004-03-16 2005-09-29 Nagase Chemtex Corp Resin composition for sealing optical semiconductor
JP2006328231A (en) 2005-05-26 2006-12-07 Nagase Chemtex Corp Encapsulating resin composition for optical elements
CN102007165B (en) * 2008-02-14 2016-04-13 琳得科株式会社 Molding material, sealing material, and optical element sealing body composed of polyorganosiloxane compound
CN102190956B (en) * 2010-03-11 2013-08-28 财团法人工业技术研究院 Antireflective coating material and antireflective coating film containing same
JP2012116990A (en) * 2010-12-02 2012-06-21 Seiko Instruments Inc Composition for sealant, and light-emitting device and solar cell module using the composition for sealant
TW201400572A (en) * 2012-03-23 2014-01-01 琳得科股份有限公司 Curing composition, cured product, and method of using the curable composition
TWI700314B (en) * 2014-05-07 2020-08-01 日商琳得科股份有限公司 Curable polysilsesquioxane compound, its manufacturing method, curing composition, curing product, curing composition, etc. use method
JP6534034B2 (en) * 2014-05-14 2019-06-26 学校法人神奈川大学 Curable composition, method for producing cured product using the same and method for re-dissolving the same
JP6009120B2 (en) * 2014-07-23 2016-10-19 リンテック株式会社 Curable composition, method for producing curable composition, cured product, method for using curable composition, and optical device
CN108368346B (en) * 2015-12-22 2021-07-13 琳得科株式会社 Curable composition, preparation method of curable composition, cured product, method of using curable composition, and optical device
WO2018110550A1 (en) * 2016-12-15 2018-06-21 ナガセケムテックス株式会社 Thermosetting resin composition, photocurable resin composition, cured product and heat resistance improving agent
JP2018178003A (en) * 2017-04-17 2018-11-15 株式会社ダイセル Fluorine-containing epoxy-modified silsesquioxane and curable composition containing the same

Also Published As

Publication number Publication date
CN112739748A (en) 2021-04-30
KR102891164B1 (en) 2025-11-25
WO2020067451A1 (en) 2020-04-02
TWI831839B (en) 2024-02-11
CN112739748B (en) 2022-07-12
KR20210066800A (en) 2021-06-07
JPWO2020067451A1 (en) 2021-02-15
TW202031739A (en) 2020-09-01
JP6830563B2 (en) 2021-02-17

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