MY203575A - Curable composition, cured product and use of curable composition - Google Patents

Curable composition, cured product and use of curable composition

Info

Publication number
MY203575A
MY203575A MYPI2021001103A MYPI2021001103A MY203575A MY 203575 A MY203575 A MY 203575A MY PI2021001103 A MYPI2021001103 A MY PI2021001103A MY PI2021001103 A MYPI2021001103 A MY PI2021001103A MY 203575 A MY203575 A MY 203575A
Authority
MY
Malaysia
Prior art keywords
curable composition
formula
cured product
integer
optical element
Prior art date
Application number
MYPI2021001103A
Inventor
Akiko Umeda
Manabu Miyawaki
Hidekazu Nakayama
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of MY203575A publication Critical patent/MY203575A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/24—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen halogen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/544—Silicon-containing compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C09J183/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Silicon Polymers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Sealing Material Composition (AREA)

Abstract

The present invention provides: a curable composition comprising the following component (A) and a solvent, and having a thixotropic index of at least 2; a cured product obtained by curing the curable composition, and which has high adhesive strength; and a method for using the curable composition as an adhesive for an optical element fixation member or as a sealant for an optical element fixation member. The curable composition according to the present invention has excellent curing properties and a low refractive index. Component (A): a curable polysilsesquioxane compound having a repeating unit represented by the formula (a-1), and characterized by satisfying a specified requirement relating to Si-NMR and by having a mass average molecular weight (Mw) in a specified range (R represents a fluoroalkyl group represented by a composition formula: CH21F, m represents an integer of 1 to 10, n represents an integer of at least 2 and up to (2m+ 1 ), and D represents a linking group that connects R and Si ( excluding an alkylene group) or a single bond). Formula (a-1): R-D-SiO3/2.
MYPI2021001103A 2018-09-28 2019-09-27 Curable composition, cured product and use of curable composition MY203575A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018183184 2018-09-28
PCT/JP2019/038224 WO2020067454A1 (en) 2018-09-28 2019-09-27 Curable composition, cured product and use of curable composition

Publications (1)

Publication Number Publication Date
MY203575A true MY203575A (en) 2024-07-04

Family

ID=69953133

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2021001103A MY203575A (en) 2018-09-28 2019-09-27 Curable composition, cured product and use of curable composition

Country Status (6)

Country Link
JP (1) JP6840901B2 (en)
KR (1) KR102780122B1 (en)
CN (1) CN112739776B (en)
MY (1) MY203575A (en)
TW (1) TWI815979B (en)
WO (1) WO2020067454A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7575301B2 (en) * 2021-03-09 2024-10-29 リンテック株式会社 Die bond material, light emitting device, and method for manufacturing light emitting device
TW202244238A (en) * 2021-03-26 2022-11-16 日商琳得科股份有限公司 Adhesive paste, method for using adhesive paste, and method for manufacturing semiconductor device

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4205368B2 (en) * 2002-06-11 2009-01-07 株式会社Ａｄｅｋａ Curable composition for optical materials
JP4734832B2 (en) 2003-05-14 2011-07-27 ナガセケムテックス株式会社 Encapsulant for optical element
JP2005263869A (en) 2004-03-16 2005-09-29 Nagase Chemtex Corp Resin composition for sealing optical semiconductor
JP2006328231A (en) 2005-05-26 2006-12-07 Nagase Chemtex Corp Encapsulating resin composition for optical elements
WO2009101753A1 (en) * 2008-02-14 2009-08-20 Lintec Corporation Molding material composed of polyorganosiloxane compound, sealing material, and sealed optical device
CN102190956B (en) * 2010-03-11 2013-08-28 财团法人工业技术研究院 Antireflective coating material and antireflective coating film containing same
JP2012116990A (en) * 2010-12-02 2012-06-21 Seiko Instruments Inc Composition for sealant, and light-emitting device and solar cell module using the composition for sealant
TW201400572A (en) * 2012-03-23 2014-01-01 琳得科股份有限公司 Curing composition, cured product, and method of using the curable composition
JP6534034B2 (en) * 2014-05-14 2019-06-26 学校法人神奈川大学 Curable composition, method for producing cured product using the same and method for re-dissolving the same
EP3281984B1 (en) * 2015-04-10 2024-01-31 Dow Toray Co., Ltd. Fluoroalkyl-containing curable organopolysiloxane composition, cured object obtained therefrom, and electronic component or display device including said cured object
CN108473767B (en) * 2015-12-22 2021-07-13 琳得科株式会社 Curable composition, method for producing curable composition, cured product, and method for using curable composition
TWI751997B (en) * 2015-12-22 2022-01-11 日商琳得科股份有限公司 Curable composition, method for producing curable composition, cured product, method for using curable composition, and optical device
JP2018178003A (en) * 2017-04-17 2018-11-15 株式会社ダイセル Fluorine-containing epoxy-modified silsesquioxane and curable composition containing the same

Also Published As

Publication number Publication date
CN112739776A (en) 2021-04-30
JP6840901B2 (en) 2021-03-10
WO2020067454A1 (en) 2020-04-02
TWI815979B (en) 2023-09-21
JPWO2020067454A1 (en) 2021-02-15
KR102780122B1 (en) 2025-03-11
CN112739776B (en) 2022-10-28
KR20210070269A (en) 2021-06-14
TW202024192A (en) 2020-07-01

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