MY205986A - Polishing liquid composition - Google Patents

Polishing liquid composition

Info

Publication number
MY205986A
MY205986A MYPI2021002609A MYPI2021002609A MY205986A MY 205986 A MY205986 A MY 205986A MY PI2021002609 A MYPI2021002609 A MY PI2021002609A MY PI2021002609 A MYPI2021002609 A MY PI2021002609A MY 205986 A MY205986 A MY 205986A
Authority
MY
Malaysia
Prior art keywords
liquid composition
component
polishing liquid
polishing
present
Prior art date
Application number
MYPI2021002609A
Inventor
Takushima Daiki
Original Assignee
Kao Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kao Corp filed Critical Kao Corp
Publication of MY205986A publication Critical patent/MY205986A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

In an aspect of the present invention, a polishing liquid composition with which the polishing speed can be ensured and scratches on the polished surface of a substrate can be reduced is provided. An aspect of the present disclosure relates to a polishing liquid composition containing an abrasive (component A), a water-soluble polymer (component B), an acid (component C), and an aqueous medium. The component B is a cationic polymer having a phenyl ether skeleton in the main chain or side chain thereof.
MYPI2021002609A 2018-11-15 2019-11-14 Polishing liquid composition MY205986A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018214535 2018-11-15
PCT/JP2019/044719 WO2020100985A1 (en) 2018-11-15 2019-11-14 Polishing liquid composition

Publications (1)

Publication Number Publication Date
MY205986A true MY205986A (en) 2024-11-22

Family

ID=70731622

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2021002609A MY205986A (en) 2018-11-15 2019-11-14 Polishing liquid composition

Country Status (4)

Country Link
JP (1) JP7396868B2 (en)
MY (1) MY205986A (en)
TW (1) TWI819140B (en)
WO (1) WO2020100985A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024172151A1 (en) * 2023-02-16 2024-08-22 花王株式会社 Polishing liquid composition for magnetic disk substrates

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2378771A1 (en) * 1999-08-13 2001-02-22 Cabot Microelectronics Corporation Chemical mechanical polishing systems and methods for their use
JP2005311011A (en) * 2004-04-21 2005-11-04 Sumitomo Bakelite Co Ltd Polishing composition
JP5725832B2 (en) 2010-12-16 2015-05-27 株式会社クラレ Chemical mechanical polishing method and slurry used therefor
KR102137293B1 (en) * 2012-08-30 2020-07-23 히타치가세이가부시끼가이샤 Polishing agent, polishing agent set and method for polishing base
JP6623942B2 (en) * 2016-06-13 2019-12-25 Jsr株式会社 Semiconductor surface treatment composition, surface treatment method, and method of manufacturing semiconductor device
JP7035773B2 (en) * 2018-04-27 2022-03-15 三菱ケミカル株式会社 Polishing composition

Also Published As

Publication number Publication date
JP7396868B2 (en) 2023-12-12
JP2020084186A (en) 2020-06-04
WO2020100985A1 (en) 2020-05-22
TWI819140B (en) 2023-10-21
TW202024290A (en) 2020-07-01

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