NL6804657A - - Google Patents
Info
- Publication number
- NL6804657A NL6804657A NL6804657A NL6804657A NL6804657A NL 6804657 A NL6804657 A NL 6804657A NL 6804657 A NL6804657 A NL 6804657A NL 6804657 A NL6804657 A NL 6804657A NL 6804657 A NL6804657 A NL 6804657A
- Authority
- NL
- Netherlands
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
- H10W76/42—Fillings
- H10W76/43—Gaseous fillings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D99/00—Subject matter not provided for in other groups of this subclass
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB25377/67A GB1134998A (en) | 1967-04-04 | 1967-04-04 | Improvements in or relating to insulated gate field effect transistors |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL6804657A true NL6804657A (fr) | 1968-10-07 |
Family
ID=10058090
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL6804657A NL6804657A (fr) | 1967-04-04 | 1968-04-03 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US3489965A (fr) |
| CH (1) | CH462327A (fr) |
| DE (1) | DE1764096A1 (fr) |
| FR (1) | FR1558876A (fr) |
| GB (1) | GB1134998A (fr) |
| NL (1) | NL6804657A (fr) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6388203B1 (en) | 1995-04-04 | 2002-05-14 | Unitive International Limited | Controlled-shaped solder reservoirs for increasing the volume of solder bumps, and structures formed thereby |
| EP0819318B1 (fr) | 1995-04-05 | 2003-05-14 | Unitive International Limited | Structure a perles de soudure pour substrat microelectronique |
| US6025767A (en) * | 1996-08-05 | 2000-02-15 | Mcnc | Encapsulated micro-relay modules and methods of fabricating same |
| DE60108413T2 (de) * | 2000-11-10 | 2005-06-02 | Unitive Electronics, Inc. | Verfahren zum positionieren von komponenten mit hilfe flüssiger antriebsmittel und strukturen hierfür |
| US6863209B2 (en) | 2000-12-15 | 2005-03-08 | Unitivie International Limited | Low temperature methods of bonding components |
| AU2003256360A1 (en) * | 2002-06-25 | 2004-01-06 | Unitive International Limited | Methods of forming electronic structures including conductive shunt layers and related structures |
| US7531898B2 (en) * | 2002-06-25 | 2009-05-12 | Unitive International Limited | Non-Circular via holes for bumping pads and related structures |
| US7547623B2 (en) * | 2002-06-25 | 2009-06-16 | Unitive International Limited | Methods of forming lead free solder bumps |
| TWI225899B (en) * | 2003-02-18 | 2005-01-01 | Unitive Semiconductor Taiwan C | Etching solution and method for manufacturing conductive bump using the etching solution to selectively remove barrier layer |
| US7049216B2 (en) * | 2003-10-14 | 2006-05-23 | Unitive International Limited | Methods of providing solder structures for out plane connections |
| TW200603698A (en) | 2004-04-13 | 2006-01-16 | Unitive International Ltd | Methods of forming solder bumps on exposed metal pads and related structures |
| US20060205170A1 (en) * | 2005-03-09 | 2006-09-14 | Rinne Glenn A | Methods of forming self-healing metal-insulator-metal (MIM) structures and related devices |
| US7674701B2 (en) | 2006-02-08 | 2010-03-09 | Amkor Technology, Inc. | Methods of forming metal layers using multi-layer lift-off patterns |
| US7932615B2 (en) * | 2006-02-08 | 2011-04-26 | Amkor Technology, Inc. | Electronic devices including solder bumps on compliant dielectric layers |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2793331A (en) * | 1955-05-09 | 1957-05-21 | Sperry Rand Corp | Semi-conductive devices |
| NL95308C (fr) * | 1956-02-29 | 1960-09-15 | ||
| US2900531A (en) * | 1957-02-28 | 1959-08-18 | Rca Corp | Field-effect transistor |
| BE584431A (fr) * | 1959-02-09 | |||
| US3244947A (en) * | 1962-06-15 | 1966-04-05 | Slater Electric Inc | Semi-conductor diode and manufacture thereof |
| US3274458A (en) * | 1964-04-02 | 1966-09-20 | Int Rectifier Corp | Extremely high voltage silicon device |
-
1967
- 1967-04-04 GB GB25377/67A patent/GB1134998A/en not_active Expired
- 1967-04-04 DE DE19671764096 patent/DE1764096A1/de active Pending
-
1968
- 1968-03-29 US US717157A patent/US3489965A/en not_active Expired - Lifetime
- 1968-04-02 CH CH484868A patent/CH462327A/fr unknown
- 1968-04-03 NL NL6804657A patent/NL6804657A/xx unknown
- 1968-04-04 FR FR1558876D patent/FR1558876A/fr not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| US3489965A (en) | 1970-01-13 |
| FR1558876A (fr) | 1969-02-28 |
| DE1764096A1 (de) | 1971-05-27 |
| GB1134998A (en) | 1968-11-27 |
| CH462327A (fr) | 1968-09-15 |