NL7204755A - - Google Patents

Info

Publication number: NL7204755A
Authority: NL; Netherlands

Application number

NL7204755A

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1971-04-12

Filing date

1972-04-10

Publication date

1972-10-16

1972-04-10 Application filed filed Critical

1972-10-16 Publication of NL7204755A publication Critical patent/NL7204755A/xx

Links

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/421—Shapes or dispositions
- H10W70/424—Cross-sectional shapes
- H10W70/427—Bent parts
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/461—Leadframes specially adapted for cooling
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49121—Beam lead frame or beam lead device

NL7204755A 1971-04-12 1972-04-10 NL7204755A (es)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US13306571A	1971-04-12	1971-04-12

Publications (1)

Publication Number	Publication Date
NL7204755A true NL7204755A (es)	1972-10-16

Family

ID=22456847

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
NL7204755A NL7204755A (es)	1971-04-12	1972-04-10

Country Status (10)

Country	Link
US (1)	US3735017A (es)
BE (1)	BE781898A (es)
CA (1)	CA943268A (es)
DE (1)	DE2215417A1 (es)
ES (1)	ES401656A1 (es)
FR (1)	FR2132846B1 (es)
GB (1)	GB1337692A (es)
IT (1)	IT950743B (es)
NL (1)	NL7204755A (es)
SE (1)	SE368478B (es)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3882807A (en) *	1974-04-08	1975-05-13	Texas Instruments Inc	Method of separating dual inline packages from a strip
DE2444892C3 (de) *	1974-09-19	1982-03-18	Siemens AG, 1000 Berlin und 8000 München	Verfahren zur Herstellung von streifenförmigen Anschlußelementen
DE2511209C3 (de) *	1975-03-14	1980-10-02	Brown, Boveri & Cie Ag, 6800 Mannheim	Verfahren zum Kontaktieren der Elektroden von scheibenförmigen Halbleiterkörpern und Metallstreifen zur Durchführung des Verfahrens
DE2714145C2 (de) *	1976-03-31	1985-01-10	Mitsubishi Denki K.K., Tokio/Tokyo	Gestanzte Metallträgerplatte für die Herstellung von kunststoffummantelten Halbleiterbauelementen
US4158745A (en) *	1977-10-27	1979-06-19	Amp Incorporated	Lead frame having integral terminal tabs
US4478588A (en) *	1978-03-06	1984-10-23	Amp Incorporated	Light emitting diode assembly
US4214120A (en) *	1978-10-27	1980-07-22	Western Electric Company, Inc.	Electronic device package having solder leads and methods of assembling the package
US4439918A (en) *	1979-03-12	1984-04-03	Western Electric Co., Inc.	Methods of packaging an electronic device
US4346396A (en) *	1979-03-12	1982-08-24	Western Electric Co., Inc.	Electronic device assembly and methods of making same
US4252864A (en) *	1979-11-05	1981-02-24	Amp Incorporated	Lead frame having integral terminal tabs
US4323293A (en) *	1980-06-30	1982-04-06	Bourns, Inc.	Terminal lead with labyrinthine clip
US4446375A (en) *	1981-10-14	1984-05-01	General Electric Company	Optocoupler having folded lead frame construction
DE3148382A1 (de) *	1981-12-07	1983-06-09	Black & Decker, Inc., 19711 Newark, Del.	Elektrogeraet, insbesondere elektrowerkzeug, mit steckbaren bauteilen
US4567545A (en) *	1983-05-18	1986-01-28	Mettler Rollin W Jun	Integrated circuit module and method of making same
EP0400177A1 (de) *	1989-05-31	1990-12-05	Siemens Aktiengesellschaft	Verbindung eines Halbleiterbauelements mit einem Metallträger
MXPA04009282A (es) *	2002-03-26	2005-01-25	Georgia Pacific Resins	Fertilizador de nitrogeno de lenta liberacion.
US7622796B2 (en) *	2005-09-13	2009-11-24	Alpha And Omega Semiconductor Limited	Semiconductor package having a bridged plate interconnection
US20070057368A1 (en) *	2005-09-13	2007-03-15	Yueh-Se Ho	Semiconductor package having plate interconnections
US7683464B2 (en) *	2005-09-13	2010-03-23	Alpha And Omega Semiconductor Incorporated	Semiconductor package having dimpled plate interconnections
US8680658B2 (en) *	2008-05-30	2014-03-25	Alpha And Omega Semiconductor Incorporated	Conductive clip for semiconductor device package

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US2476429A (en) *	1946-08-30	1949-07-19	Aircraft Marine Prod Inc	Connector for electrical conductors
US3569797A (en) *	1969-03-12	1971-03-09	Bendix Corp	Semiconductor device with preassembled mounting
US3597666A (en) *	1969-11-26	1971-08-03	Fairchild Camera Instr Co	Lead frame design
US3628483A (en) *	1970-03-20	1971-12-21	Amp Inc	Method of making power frame for integrated circuit

1971
- 1971-04-12 US US00133065A patent/US3735017A/en not_active Expired - Lifetime
1972
- 1972-03-21 CA CA137,680A patent/CA943268A/en not_active Expired
- 1972-03-22 GB GB1331272A patent/GB1337692A/en not_active Expired
- 1972-03-24 IT IT22360/72A patent/IT950743B/it active
- 1972-03-29 DE DE19722215417 patent/DE2215417A1/de active Pending
- 1972-04-10 BE BE781898A patent/BE781898A/xx unknown
- 1972-04-10 NL NL7204755A patent/NL7204755A/xx unknown
- 1972-04-11 FR FR7212609A patent/FR2132846B1/fr not_active Expired
- 1972-04-11 SE SE04652/72A patent/SE368478B/xx unknown
- 1972-04-11 ES ES401656A patent/ES401656A1/es not_active Expired

Also Published As

Publication number	Publication date
ES401656A1 (es)	1975-11-01
DE2215417A1 (de)	1972-10-26
FR2132846B1 (es)	1977-12-23
US3735017A (en)	1973-05-22
IT950743B (it)	1973-06-20
CA943268A (en)	1974-03-05
FR2132846A1 (es)	1972-11-24
BE781898A (fr)	1972-10-10
SE368478B (es)	1974-07-01
GB1337692A (en)	1973-11-21

Publication	Publication Date	Title
FR2132846B1 (es)	1977-12-23
AU2658571A (es)	1972-09-21
AU2726271A (es)	1972-10-05
AU2742671A (es)	1972-10-12
AU2894671A (es)	1972-11-23
AU2941471A (es)	1972-11-30
AU2952271A (es)	1972-12-07
AU3005371A (es)	1972-12-21
AU2875571A (es)	1972-11-16
AU2755871A (es)	1972-10-19
AU2706571A (es)	1971-07-15
AU2724971A (es)	1972-10-05
AU2854371A (es)	1972-11-09
AU2740271A (es)	1972-10-12
AU2654071A (es)	1972-09-21
AU2588771A (es)	1972-08-31
AU2836771A (es)	1972-11-09
AU2837671A (es)	1972-11-09
AU2880771A (es)	1972-11-16
AU2885171A (es)	1972-11-16
AU2907471A (es)	1972-11-23
AU3038671A (es)	1973-01-04
AU3025871A (es)	1973-01-04
AU2927871A (es)	1972-11-30
AU2963771A (es)	1972-12-07