NL8203253A - Werkwijze en inrichting voor het met kunststof omhullen van elektronische componenten. - Google Patents

Werkwijze en inrichting voor het met kunststof omhullen van elektronische componenten. Download PDF

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Publication number
NL8203253A
NL8203253A NL8203253A NL8203253A NL8203253A NL 8203253 A NL8203253 A NL 8203253A NL 8203253 A NL8203253 A NL 8203253A NL 8203253 A NL8203253 A NL 8203253A NL 8203253 A NL8203253 A NL 8203253A
Authority
NL
Netherlands
Prior art keywords
mold
strip
plastic
parts
mold cavities
Prior art date
Application number
NL8203253A
Other languages
English (en)
Dutch (nl)
Original Assignee
Arbo Handel Ontwikkeling
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Arbo Handel Ontwikkeling filed Critical Arbo Handel Ontwikkeling
Priority to NL8203253A priority Critical patent/NL8203253A/nl
Priority to DE8383201115T priority patent/DE3371263D1/de
Priority to AT83201115T priority patent/ATE26896T1/de
Priority to EP83201115A priority patent/EP0101630B1/de
Priority to JP58148678A priority patent/JPS5952842A/ja
Priority to US06/523,749 priority patent/US4653993A/en
Publication of NL8203253A publication Critical patent/NL8203253A/nl

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B29C45/462—Injection of preformed charges of material

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
NL8203253A 1982-08-19 1982-08-19 Werkwijze en inrichting voor het met kunststof omhullen van elektronische componenten. NL8203253A (nl)

Priority Applications (6)

Application Number Priority Date Filing Date Title
NL8203253A NL8203253A (nl) 1982-08-19 1982-08-19 Werkwijze en inrichting voor het met kunststof omhullen van elektronische componenten.
DE8383201115T DE3371263D1 (en) 1982-08-19 1983-07-27 Method and system for encapsulating electronic components into plastic material
AT83201115T ATE26896T1 (de) 1982-08-19 1983-07-27 Verfahren und system zum einkapseln elektronischer bauteile in kunststoff.
EP83201115A EP0101630B1 (de) 1982-08-19 1983-07-27 Verfahren und System zum Einkapseln elektronischer Bauteile in Kunststoff
JP58148678A JPS5952842A (ja) 1982-08-19 1983-08-12 電子部品をプラスチツク材へ封入する方法および装置
US06/523,749 US4653993A (en) 1982-08-19 1983-08-16 Apparatus for encapsulating electronic components in plastic material

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL8203253A NL8203253A (nl) 1982-08-19 1982-08-19 Werkwijze en inrichting voor het met kunststof omhullen van elektronische componenten.
NL8203253 1982-08-19

Publications (1)

Publication Number Publication Date
NL8203253A true NL8203253A (nl) 1984-03-16

Family

ID=19840156

Family Applications (1)

Application Number Title Priority Date Filing Date
NL8203253A NL8203253A (nl) 1982-08-19 1982-08-19 Werkwijze en inrichting voor het met kunststof omhullen van elektronische componenten.

Country Status (6)

Country Link
US (1) US4653993A (de)
EP (1) EP0101630B1 (de)
JP (1) JPS5952842A (de)
AT (1) ATE26896T1 (de)
DE (1) DE3371263D1 (de)
NL (1) NL8203253A (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL8501393A (nl) * 1985-05-14 1986-12-01 Arbo Handel Ontwikkeling Inrichting voor het tegelijkertijd omhullen van een aantal elektronische componenten.
US4764327A (en) * 1986-01-14 1988-08-16 Mitsubishi Gas Chemical Company, Inc. Process of producing plastic-molded printed circuit boards
JPH0740573B2 (ja) * 1987-01-26 1995-05-01 株式会社東芝 半導体製造装置
US5200125A (en) * 1988-12-24 1993-04-06 T&K International Laboratory, Ltd. Method for seal molding electronic components with resin
US4927590A (en) * 1989-05-26 1990-05-22 At&T Bell Laboratories Method for encapsulating integrated circuits
US6153141A (en) * 1993-11-23 2000-11-28 Motorola, Inc. Semiconductor packaging method
JP3383701B2 (ja) * 1994-03-07 2003-03-04 松下電器産業株式会社 樹脂封入成形用金型
NL9400844A (nl) * 1994-05-24 1996-01-02 Boschman Holding Bv Werkwijze en inrichting voor het ommantelen van voorwerpen.
US5855924A (en) * 1995-12-27 1999-01-05 Siemens Microelectronics, Inc. Closed-mold for LED alphanumeric displays
JP2970569B2 (ja) * 1997-01-13 1999-11-02 日本電気株式会社 樹脂封止方法および樹脂封止金型装置
US5925384A (en) * 1997-04-25 1999-07-20 Micron Technology, Inc. Manual pellet loader for Boschman automolds
US6666997B2 (en) * 2001-10-02 2003-12-23 Micron Technology, Inc. Method for removing cleaning compound flash from mold vents
US7264456B2 (en) * 2001-10-10 2007-09-04 Micron Technology, Inc. Leadframe and method for reducing mold compound adhesion problems
US7323361B2 (en) * 2002-03-29 2008-01-29 Fairchild Semiconductor Corporation Packaging system for semiconductor devices
JP2004063851A (ja) * 2002-07-30 2004-02-26 Renesas Technology Corp 樹脂封止装置
KR20090006096A (ko) 2006-04-11 2009-01-14 토와 가부시기가이샤 전자 부품의 수지 밀봉 성형 방법 및 전자 부품의 수지 밀봉 성형 장치
US7678617B1 (en) 2006-12-21 2010-03-16 National Semiconductor Corporation Universal laminator
AT512441B1 (de) * 2012-01-18 2014-08-15 Engel Austria Gmbh Verfahren zur herstellung eines faserverbund- oder hybridbauteils

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB960097A (en) * 1960-04-14 1964-06-10 Dubilier Condenser Co 1925 Ltd Improvements in or relating to the production of encapsulated electrical components
US3471900A (en) * 1967-05-24 1969-10-14 Trw Inc Mold for encapsulating electrical components
IT982109B (it) * 1973-04-27 1974-10-21 Billi Spa Sistema di comando degli aghi per macchine da maglieria con amplifi cazione del comando imposto dalle camme
US3915780A (en) * 1973-08-02 1975-10-28 Texas Instruments Inc Extruded epoxy packaging system
US4109373A (en) * 1975-03-10 1978-08-29 General Electric Company Method for manufacturing semiconductor devices
JPS5326670A (en) * 1976-08-25 1978-03-11 Hitachi Ltd Manufacture of semiconductor device
NL189379C (nl) * 1977-05-05 1993-03-16 Richardus Henricus Johannes Fi Werkwijze voor inkapselen van micro-elektronische elementen.
JPS54162963A (en) * 1978-06-14 1979-12-25 Mitsubishi Electric Corp Manufacture of resin-sealed semiconductor device
US4368168A (en) * 1978-07-17 1983-01-11 Dusan Slepcevic Method for encapsulating electrical components
US4332537A (en) * 1978-07-17 1982-06-01 Dusan Slepcevic Encapsulation mold with removable cavity plates
JPS5850582B2 (ja) * 1979-08-24 1983-11-11 道男 長田 半導体封入成形方法とその金型装置
JPS5649533A (en) * 1979-09-28 1981-05-06 Hitachi Ltd Manufacture method of electron watch
JPS6045571B2 (ja) * 1980-06-18 1985-10-11 株式会社東芝 樹脂封止用モ−ルド装置
US4388265A (en) * 1981-12-14 1983-06-14 Kazuo Bandoh Process and apparatus for molding plastics
US4460537A (en) * 1982-07-26 1984-07-17 Motorola, Inc. Slot transfer molding apparatus and methods

Also Published As

Publication number Publication date
ATE26896T1 (de) 1987-05-15
DE3371263D1 (en) 1987-06-04
US4653993A (en) 1987-03-31
EP0101630B1 (de) 1987-04-29
JPS5952842A (ja) 1984-03-27
EP0101630A1 (de) 1984-02-29

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Legal Events

Date Code Title Description
A1B A search report has been drawn up
A85 Still pending on 85-01-01
BV The patent application has lapsed