NO166729B - Fremgangsmaate ved overflatebehandling av kobber. - Google Patents

Fremgangsmaate ved overflatebehandling av kobber. Download PDF

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Publication number
NO166729B
NO166729B NO854402A NO854402A NO166729B NO 166729 B NO166729 B NO 166729B NO 854402 A NO854402 A NO 854402A NO 854402 A NO854402 A NO 854402A NO 166729 B NO166729 B NO 166729B
Authority
NO
Norway
Prior art keywords
machine
container
line
detergent
copper
Prior art date
Application number
NO854402A
Other languages
English (en)
Other versions
NO854402L (no
NO166729C (no
Inventor
Kuniki Ueno
Naotomi Takahashi
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Publication of NO854402L publication Critical patent/NO854402L/no
Publication of NO166729B publication Critical patent/NO166729B/no
Publication of NO166729C publication Critical patent/NO166729C/no

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/565—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of zinc
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Laminated Bodies (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
  • Solid-Phase Diffusion Into Metallic Material Surfaces (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Golf Clubs (AREA)
  • Dental Preparations (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Description

Anordning ved en vaske- eller oppvaskmaskin.
Oppfinnelsen vedrorer en anordning ved en vaske- eller oppvaskmaskin med en vanntilkoblingsdel som er forsynt med et med en fri ende utformet rorstykke som munner fritt ut over en til maskinens vanntilforselsledning tilkoblet beholder, idet rorstykket er anordnet over beholderen, og beholderen er utformet som en del av en tilkoblingsdel som danner en fast del av maskinens forovrig fortrinnsvis demonterbare side- eller bakvegg og er forsynt med et oppad åpent overlop fra en del av beholderen, som med en på avstand fra beholderens overste kant sluttende mellomvegg er adskilt fra en annen del av beholderen, i hvilken del innlopet til maskinens vanntilforselsledning er anordnet, idet den med overldpet forsynte del i bunnen er forsynt med en tilkoblingsdel for en ledning som er forbundet med bunnen av maskinens behandlingsrom og fortrinnsvis også med sugesiden for maskinens pumpe.
Oppfinnelsen kjennetegnes forst og fremst ved at beholderen inntil åpningen for maskinens vanntilforselsledning er forsynt med et rom for vaskemiddel, hvilket rom har en åpning samt er tilgjengelig fra maskinens overdel for dosering av vaskemiddel.
Ifolge et ytterligere trekk munner det over rommet for vaskemiddel ut en fbrste ledning for tilforsel av vann for innspyling av vaskemiddel gjennom ledningen for vanntilforselen til maskinens behandlingsrom, over hvilken sistnevnte ledning en annen ledning for direkte tilforsel av vann til maskinens behandlingsrom munner ut.
Derved oppnåes en forenklet og billigere fremstilling av maskinen, samt gjor såvel installasjon som bruk enkel og lettvint. Videre reduseres risikoen for at vaskemidlet i beholderen klum-per seg sammen under innspylingen til maskinens behandlingsrom.
Oppfinnelsen skal i det efterfolgende beskrives nærmere under henvisning til et på tegningene vist utforelseseksempel av en vaskemaskin, idet også ytterligere trekk ved oppfinnelsen skal angis nærmere.
På tegningene viser:
Fig. 1 en vaskemaskin sett ovenifra i perspektiv med et doseringsmål i innsatt stilling resp. i stilling for innsetting, Fig. 2 et snitt gjennom et betjeningspanel for vaskemaskinen med et doseringsmål anordnet i dette. Fig. 3 anordningen sett i perspektiv fra vaskemaskinens indre, og
Fig. 4 viser overlopet sett ovenifra.
På tegningene er maskinen som helhet betegnet med lo. Med 11 og 12 er dennes fremre resp. bakre lokk betegnet, idet det forst-nevnte dekker vasketrommelen og det bakre dekker maskinens betjeningspanel 13 og åpningen 14 for en vaskemiddellomme 15. På dette panel 13 er maskinens elektriske betjeningsorgan anordnet. Over åpningen 14 for vaskemiddellommen 15 er dessuten doserings-målet 16 innsatt som et lokk.
Over åpningen 14 for vaskemiddellommen 15 er utformet en hals 17 som er anordnet for å styre det graderte doseringsmål 16 mot åpningen 14 for vaskemiddellommens 15 rom 18 for vaskemiddel i koblingssokkelen 19. På denne sokkel er i vaskemiddellommens 15 bunn anbragt et væsketillop 2o til vaske- eller oppvaskmaskinens behandlingsrom for godset og i en overlopslommes 23 bunn er et væskeavlop 21 anbragt fra behandlingsrommets bunn. Vaskemiddellommen 15 står derved i direkte forbindelse med væsketillopet 2o til behandlingsrommet, hvorved fåes meget god behandling av vas-kevæske og vaskemiddel.
Koblingssokkelen 19 er utformet med et overlop 22 fra overlbps-lommen 23 som er adskilt fra vaskemiddellommens 15 rom 18 for vaskemiddel ved hjelp av en mellomvegg 24, i hvilken er skåret ut en overlopskant 25 mellom vaskemiddellommen 15 og overlops-lommen 23. Over vaskemiddellommen 15 er anordnet en eller flere ledninger for vanntilforsel til lommen, selv om dette ikke er vist på tegningene. Derved kan en vanntilforselslednings munning være rettet inn over lommens 15 rom 18 for vaskemiddel for innspyling av dette til vasketrommelen, og en annen vanntilforselslednings munning kan være anordnet rett over denne lommes 15 bunnavlopsåpning til væsketillopet 2o.
I koblingssokkelen 19 er også anordnet et hull 26 for en avlbps-slange fra maskinens pumpe. I kanten av sokkelen 19 er også utformet en koblingsdel 27 for maskinens elektriske tilforselsled-ning 28.
Tegningene viser bare en utforelsesform av anordningen ifolge oppfinnelsen, men flere modifikasjoner kan selvsagt tenkes innen-for oppfinnelsens ramme.

Claims (2)

1. Vaske- eller oppvaskmaskin med en vanntilkoblingsdel som er forsynt med et med en fri ende utformet rorstykke som munner fritt ut over en til maskinens vanntilforselsledning tilkoblet beholder, idet rorstykket er anordnet over beholderen, og beholderen er utformet som en del av en tilkoblingsdel som danner en fast del av maskinens forovrig fortrinnsvis demonterbare side-eller bakvegg og er forsynt med et oppad åpent overlbp fra en del av beholderen, som med en på avstand fra beholderens bverste kant sluttende mellomvegg er adskilt fra en annen del av beholderen, i hvilken del innlopet til maskinens vanntilforselsledning er anordnet, idet den med overlbpet forsynte del i bunnen er forsynt med en tilkoblingsdel for en ledning som er forbundet med bunnen av maskinens behandlingsrom og fortrinnsvis også med sugesiden for maskinens pumpe, karakterisert ved at beholderen (18) inntil åpningen for maskinens vanntilforselsledning (2o) er forsynt med et rom for vaskemiddel, hvilket rom har en åpning (14) samt er tilgjengelig fra maskinens overdel for dosering av vaskemiddel.
2. Vaske- eller oppvaskmaskin som angitt i krav 1, karakterisert ved at det over rommet (18) for vaskemiddel munner ut en forste ledning for tilforsel av vann for innspyling av vaskemiddel gjennom ledningen (2o) for vanntilfbr-selen til maskinens behandlingsrom, over hvilken sistnevnte ledning (2o) en annen ledning for direkte tilforsel av vann til maskinens behandlingsrom munner ut.
NO854402A 1984-11-06 1985-11-05 Fremgangsmaate ved overflatebehandling av kobber. NO166729C (no)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59233572A JPS61110794A (ja) 1984-11-06 1984-11-06 銅箔の表面処理方法

Publications (3)

Publication Number Publication Date
NO854402L NO854402L (no) 1986-05-07
NO166729B true NO166729B (no) 1991-05-21
NO166729C NO166729C (no) 1991-08-28

Family

ID=16957172

Family Applications (1)

Application Number Title Priority Date Filing Date
NO854402A NO166729C (no) 1984-11-06 1985-11-05 Fremgangsmaate ved overflatebehandling av kobber.

Country Status (8)

Country Link
US (1) US4640747A (no)
EP (1) EP0180981B1 (no)
JP (1) JPS61110794A (no)
AT (1) ATE41682T1 (no)
DE (1) DE3569001D1 (no)
ES (1) ES8701857A1 (no)
FI (1) FI81130C (no)
NO (1) NO166729C (no)

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JPH0660435B2 (ja) * 1989-03-01 1994-08-10 古河電気工業株式会社 銅製熱交換器用フィン材とその製造方法
US5063117A (en) * 1988-12-27 1991-11-05 The Furukawa Electric Co., Ltd. Copper fin material for heat-exchanger and method of producing the same
JPH02228495A (ja) * 1989-03-01 1990-09-11 Furukawa Electric Co Ltd:The 銅製熱交換器用フィン材とその製造方法
US5230932A (en) * 1989-10-13 1993-07-27 Olin Corporation Chromium-zinc anti-tarnish coating for copper foil
US5022968A (en) * 1990-09-20 1991-06-11 Olin Corporation Method and composition for depositing a chromium-zinc anti-tarnish coating on copper foil
US5098796A (en) * 1989-10-13 1992-03-24 Olin Corporation Chromium-zinc anti-tarnish coating on copper foil
US5250363A (en) * 1989-10-13 1993-10-05 Olin Corporation Chromium-zinc anti-tarnish coating for copper foil having a dark color
JPH0819550B2 (ja) * 1990-06-05 1996-02-28 福田金属箔粉工業株式会社 印刷回路用銅箔の表面処理方法
TW230290B (zh) * 1991-11-15 1994-09-11 Nikko Guruder Foreer Kk 印刷電路用銅箔之表面處理方法
JP3292774B2 (ja) * 1994-02-15 2002-06-17 三井金属鉱業株式会社 プリント配線板用銅箔およびその製造方法
US5945010A (en) * 1997-09-02 1999-08-31 Composite Concepts Company, Inc. Electrode wire for use in electric discharge machining and process for preparing same
US6015482A (en) * 1997-12-18 2000-01-18 Circuit Research Corp. Printed circuit manufacturing process using tin-nickel plating
JP3142259B2 (ja) * 1998-11-30 2001-03-07 三井金属鉱業株式会社 耐薬品性および耐熱性に優れたプリント配線板用銅箔およびその製造方法
US6579568B2 (en) 1999-11-29 2003-06-17 Mitsui Mining & Smelting Co., Ltd. Copper foil for printed wiring board having excellent chemical resistance and heat resistance
JP3743702B2 (ja) * 2000-04-28 2006-02-08 三井金属鉱業株式会社 プリント配線板のセミアディティブ製造法
JP2003051673A (ja) * 2001-08-06 2003-02-21 Mitsui Mining & Smelting Co Ltd プリント配線板用銅箔及びそのプリント配線板用銅箔を用いた銅張積層板
JP4178415B2 (ja) * 2002-07-04 2008-11-12 三井金属鉱業株式会社 キャリア箔付電解銅箔
JP2005344174A (ja) * 2004-06-03 2005-12-15 Mitsui Mining & Smelting Co Ltd 表面処理銅箔及びその表面処理銅箔を用いて製造したフレキシブル銅張積層板並びにフィルムキャリアテープ
JP2006024902A (ja) * 2004-06-07 2006-01-26 Shinko Electric Ind Co Ltd 極細線パターンを有する配線基板の製造方法および配線基板
ES2811229T3 (es) * 2005-12-01 2021-03-11 Thermocompact Sa Alambre para EDM
JP5638952B2 (ja) * 2008-07-22 2014-12-10 古河電気工業株式会社 表面処理銅箔及び銅張積層板
KR101426038B1 (ko) * 2008-11-13 2014-08-01 주식회사 엠디에스 인쇄회로기판 및 그 제조방법
JP2011162860A (ja) * 2010-02-12 2011-08-25 Furukawa Electric Co Ltd:The 表面粗化銅箔とその製造方法及び銅張積層板
SG183311A1 (en) 2010-05-07 2012-09-27 Jx Nippon Mining & Metals Corp Copper foil for printed circuit
PH12013501034B1 (en) * 2010-11-22 2018-01-12 Mitsui Mining & Smelting Co Ltd Surface treated copper foil
JP5654416B2 (ja) * 2011-06-07 2015-01-14 Jx日鉱日石金属株式会社 液晶ポリマー銅張積層板及び当該積層板に用いる銅箔

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Also Published As

Publication number Publication date
EP0180981B1 (en) 1989-03-22
FI854281L (fi) 1986-05-07
ES548541A0 (es) 1986-12-01
NO854402L (no) 1986-05-07
US4640747A (en) 1987-02-03
DE3569001D1 (en) 1989-04-27
EP0180981A1 (en) 1986-05-14
JPS61110794A (ja) 1986-05-29
FI854281A0 (fi) 1985-10-31
FI81130B (fi) 1990-05-31
FI81130C (fi) 1990-09-10
NO166729C (no) 1991-08-28
ES8701857A1 (es) 1986-12-01
ATE41682T1 (de) 1989-04-15
JPH0447038B2 (no) 1992-07-31

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