NO20003024L - Innkapsling - Google Patents

Innkapsling

Info

Publication number
NO20003024L
NO20003024L NO20003024A NO20003024A NO20003024L NO 20003024 L NO20003024 L NO 20003024L NO 20003024 A NO20003024 A NO 20003024A NO 20003024 A NO20003024 A NO 20003024A NO 20003024 L NO20003024 L NO 20003024L
Authority
NO
Norway
Prior art keywords
main portions
contact
electrical contact
seal
projections
Prior art date
Application number
NO20003024A
Other languages
English (en)
Other versions
NO20003024D0 (no
Inventor
Trevor John Bryant
Original Assignee
Marconi Comm Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Marconi Comm Ltd filed Critical Marconi Comm Ltd
Publication of NO20003024D0 publication Critical patent/NO20003024D0/no
Publication of NO20003024L publication Critical patent/NO20003024L/no

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0015—Gaskets or seals

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

En forbedret elektromagnetisk forsegling er frembragt mellom hoveddeler (10, 40) av en innkapsling ved å anordne kontaktoverflater (15, 45) på hoveddelene som har fremspring (30, 32, 38, 60, 68) for å forbedre den elektriske kontakt mellom hoveddelene. Denne forsegling kan anvendes på forskjellige former for overflater som skal bringes i kontakt med hverandre, innbefattet komplementære not- og fjær-overflater eller trinntilformede overflater. Lignende fremspring kan også føres inn i spalter for montering av paneler i den hensikt å forbedre den elektriske" kontakt mellom hoveddelene og panelet.
NO20003024A 1999-06-11 2000-06-13 Innkapsling NO20003024L (no)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9913660A GB2350936B (en) 1999-06-11 1999-06-11 Enclosure

Publications (2)

Publication Number Publication Date
NO20003024D0 NO20003024D0 (no) 2000-06-13
NO20003024L true NO20003024L (no) 2000-12-12

Family

ID=10855204

Family Applications (1)

Application Number Title Priority Date Filing Date
NO20003024A NO20003024L (no) 1999-06-11 2000-06-13 Innkapsling

Country Status (8)

Country Link
US (1) US6444901B1 (no)
EP (1) EP1059834A3 (no)
JP (1) JP2001057495A (no)
CN (1) CN1203744C (no)
AU (1) AU3943300A (no)
GB (1) GB2350936B (no)
NO (1) NO20003024L (no)
RU (1) RU2000115173A (no)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3941723B2 (ja) * 2003-03-27 2007-07-04 日本電気株式会社 電子機器の筐体
CN101600330B (zh) * 2008-06-03 2012-04-18 上海贝尔股份有限公司 用于面板间电磁屏蔽的结构及其制造方法
WO2010054402A2 (en) 2008-11-10 2010-05-14 Finisar Corporation Electromagnetic shielding configuration
JP2011228388A (ja) * 2010-04-16 2011-11-10 Honda Motor Co Ltd 補助基板接合構造
TWM390029U (en) * 2010-05-21 2010-10-01 Askey Computer Corp Shell for electronic device
JP5535035B2 (ja) * 2010-10-29 2014-07-02 パナソニックヘルスケア株式会社 ヒンジ装置及びそれを用いた超低温フリーザ
CN202435779U (zh) * 2011-12-02 2012-09-12 鸿富锦精密工业（深圳）有限公司 电磁屏蔽箱体
CN107529299A (zh) * 2017-09-12 2017-12-29 珠海格力电器股份有限公司 电控箱
US11395419B2 (en) * 2020-10-20 2022-07-19 Quanta Computer Inc. Stepped venting panel

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3296354A (en) 1964-02-05 1967-01-03 Basic Products Corp Furnace
US3296356A (en) * 1965-03-02 1967-01-03 James H Mcadams Radio frequency electromagnetic energy r. f. barrier
US4759466A (en) * 1986-08-14 1988-07-26 Apple Computer, Inc. EMI seam for enclosures
JPH062317Y2 (ja) * 1988-08-09 1994-01-19 株式会社東芝 筐体構造
GB2236910B (en) * 1989-09-28 1993-12-08 Technophone Ltd A housing for electronic circuitry
US5001298A (en) * 1989-10-18 1991-03-19 Signal Catv System Inc. Radio frequency interference device for a high-frequency signal distributor
DE9103040U1 (de) * 1991-03-13 1991-06-13 Siemens Nixdorf Informationssysteme AG, 4790 Paderborn Vorrichtung zur Kontaktierung von Wanne und Haube eines geschlossenen Gehäuses
JP2501638Y2 (ja) * 1991-11-25 1996-06-19 船井電機株式会社 プリント基板装着用シ―ルド板
US5175395A (en) * 1991-11-27 1992-12-29 Rockwell International Corporation Electromagnetic shield
DE4223322C1 (no) * 1992-07-16 1993-07-29 Schroff Gmbh, 7541 Straubenhardt, De
US5354951A (en) * 1993-03-15 1994-10-11 Leader Tech, Inc. Circuit board component shielding enclosure and assembly
US5348549A (en) * 1993-03-29 1994-09-20 Brown Daniel R Fluid tight medical apparatus disposal receptacle
DE4319965C3 (de) * 1993-06-14 2000-09-14 Emi Tec Elektronische Material Verfahren zur Herstellung eines Gehäuses mit elektromagnetischer Abschirmung
US5783771A (en) * 1995-10-06 1998-07-21 Digital Equipment Corporation EMI chassis seam
JPH10154890A (ja) * 1996-11-22 1998-06-09 Mitsumi Electric Co Ltd 複数のシールドケースの組立構造

Also Published As

Publication number Publication date
EP1059834A3 (en) 2001-09-19
EP1059834A2 (en) 2000-12-13
GB2350936A (en) 2000-12-13
CN1203744C (zh) 2005-05-25
JP2001057495A (ja) 2001-02-27
US6444901B1 (en) 2002-09-03
NO20003024D0 (no) 2000-06-13
CN1283077A (zh) 2001-02-07
GB2350936B (en) 2001-08-15
AU3943300A (en) 2000-12-14
GB9913660D0 (en) 1999-08-11
RU2000115173A (ru) 2002-05-20

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Legal Events

Date Code Title Description
FC2A Withdrawal, rejection or dismissal of laid open patent application