NO20012676L - Holdeanordning for halvlederskiver - Google Patents

Holdeanordning for halvlederskiver

Info

Publication number
NO20012676L
NO20012676L NO20012676A NO20012676A NO20012676L NO 20012676 L NO20012676 L NO 20012676L NO 20012676 A NO20012676 A NO 20012676A NO 20012676 A NO20012676 A NO 20012676A NO 20012676 L NO20012676 L NO 20012676L
Authority
NO
Norway
Prior art keywords
holding device
disc holding
semiconductor
semiconductor disc
rings
Prior art date
Application number
NO20012676A
Other languages
English (en)
Other versions
NO20012676D0 (no
Inventor
Walter Nadrad
Klaus Sivec
Original Assignee
Sico Productions And Handelsgm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sico Productions And Handelsgm filed Critical Sico Productions And Handelsgm
Publication of NO20012676D0 publication Critical patent/NO20012676D0/no
Publication of NO20012676L publication Critical patent/NO20012676L/no

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/12—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H10P72/127—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterised by the substrate support

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging For Recording Disks (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

En holdeanordning for halvlederskiver i hvilken flere halvlederskiver kan bli innsatt parallelt med hverandre og med et mellomrom oppå hverandre, har flere støtter (1) som er vertikale i bmksposisjonen og på hvilke det er ringer eller ringformede segmenter (2) parallelt med hverandre og med en avstand oppå hverandre. Overflatene til ringene eller de ringformede segmentene (2) som peker oppover og som danner støttene for halvlederskivene er enten polert eller utstyrt med støttetapper (20).
NO20012676A 1999-10-05 2001-05-31 Holdeanordning for halvlederskiver NO20012676L (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP99890317A EP1091391A1 (de) 1999-10-05 1999-10-05 Haltevorrichtung für Halbleiterscheiben
PCT/AT2000/000261 WO2001026140A1 (de) 1999-10-05 2000-10-05 Haltevorrichtung für halbleiterscheiben

Publications (2)

Publication Number Publication Date
NO20012676D0 NO20012676D0 (no) 2001-05-31
NO20012676L true NO20012676L (no) 2001-05-31

Family

ID=8244017

Family Applications (1)

Application Number Title Priority Date Filing Date
NO20012676A NO20012676L (no) 1999-10-05 2001-05-31 Holdeanordning for halvlederskiver

Country Status (7)

Country Link
EP (1) EP1091391A1 (no)
JP (1) JP2003521109A (no)
KR (1) KR20010080993A (no)
CN (1) CN1371527A (no)
CA (1) CA2347295A1 (no)
NO (1) NO20012676L (no)
WO (1) WO2001026140A1 (no)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001230312A (ja) * 2000-02-16 2001-08-24 Nec Corp 半導体製造装置
US7077913B2 (en) * 2002-01-17 2006-07-18 Hitachi Kokusai Electric, Inc. Apparatus for fabricating a semiconductor device
CN1316583C (zh) * 2002-11-26 2007-05-16 株式会社迪斯科 用于储存多个半导体片的盒子
JP3781014B2 (ja) 2003-03-31 2006-05-31 株式会社Ｓｕｍｃｏ シリコンウェーハ熱処理治具およびシリコンウェーハ熱処理方法
DE102009024239A1 (de) * 2009-05-29 2010-12-02 Schmid Technology Systems Gmbh Vorrichtung und Verfahren zum Stapeln bzw. Transport einer Vielzahl von flachen Substraten
KR101005692B1 (ko) * 2010-06-14 2011-01-05 강성원 기능성 복대
DE102012010940A1 (de) * 2012-06-04 2013-12-05 ACI eco Tec GmbH Trägerelemente für die Distanzhaltung und Auflage von Substraten in einer Vorrichtung zur Substratnassbehandlung
FR2995394B1 (fr) * 2012-09-10 2021-03-12 Soitec Silicon On Insulator Dispositif de support d'une pluralite de substrats pour un four vertical
CN103743239B (zh) 2013-12-27 2015-05-20 深圳市华星光电技术有限公司 石英卡夹装置及其制作方法与带该石英卡夹装置的oled高温炉
CN104465464A (zh) * 2014-12-16 2015-03-25 中国电子科技集团公司第四十六研究所 一种小尺寸硫化镉单晶片超声清洗架

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5169453A (en) * 1989-03-20 1992-12-08 Toyoko Kagaku Co., Ltd. Wafer supporting jig and a decompressed gas phase growth method using such a jig
JP2537563Y2 (ja) * 1989-03-20 1997-06-04 東横化学 株式会社 縦型減圧気相成長装置
JPH04304652A (ja) * 1991-04-01 1992-10-28 Hitachi Ltd 熱処理装置用ボート
JPH05102056A (ja) * 1991-10-11 1993-04-23 Rohm Co Ltd ウエハー支持具
JPH05235156A (ja) * 1992-02-21 1993-09-10 Sony Corp 縦型炉用ボート
JPH0745691A (ja) * 1993-07-29 1995-02-14 Kokusai Electric Co Ltd ウェーハホルダ
JP2552094B2 (ja) * 1994-06-23 1996-11-06 九州日本電気株式会社 縦型熱処理炉用ボート
JPH08107079A (ja) * 1994-09-30 1996-04-23 Toshiba Ceramics Co Ltd 縦型ウェ−ハボ−ト及び縦型熱処理炉
JP3122364B2 (ja) * 1996-02-06 2001-01-09 東京エレクトロン株式会社 ウエハボート
JP3505934B2 (ja) * 1996-09-10 2004-03-15 東京エレクトロン株式会社 被処理体の支持構造及び熱処理装置
EP0884769A1 (en) * 1996-02-29 1998-12-16 Tokyo Electron Limited Heat-treating boat for semiconductor wafer
JP3388668B2 (ja) * 1996-02-29 2003-03-24 東京エレクトロン株式会社 熱処理用ボ−ト及び縦型熱処理装置
JP3483698B2 (ja) * 1996-03-27 2004-01-06 宮城沖電気株式会社 縦型半導体製造装置のウエハ支持具
JPH10144616A (ja) * 1996-11-12 1998-05-29 Tekunisuko:Kk 半導体ウェーハ支持ボート
JPH10335434A (ja) * 1997-05-30 1998-12-18 Sumitomo Metal Ind Ltd ウェーハ保持具

Also Published As

Publication number Publication date
NO20012676D0 (no) 2001-05-31
EP1091391A1 (de) 2001-04-11
KR20010080993A (ko) 2001-08-25
CA2347295A1 (en) 2001-04-12
JP2003521109A (ja) 2003-07-08
CN1371527A (zh) 2002-09-25
WO2001026140A1 (de) 2001-04-12

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Legal Events

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