NO20051523L - Nanoktystallelektonanordning - Google Patents

Nanoktystallelektonanordning

Info

Publication number
NO20051523L
NO20051523L NO20051523A NO20051523A NO20051523L NO 20051523 L NO20051523 L NO 20051523L NO 20051523 A NO20051523 A NO 20051523A NO 20051523 A NO20051523 A NO 20051523A NO 20051523 L NO20051523 L NO 20051523L
Authority
NO
Norway
Prior art keywords
layer
charge
conductivity
reservoir layer
port
Prior art date
Application number
NO20051523A
Other languages
English (en)
Other versions
NO20051523D0 (no
Inventor
Bohumil Lojek
Original Assignee
Atmel Corp A Delaware Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atmel Corp A Delaware Corp filed Critical Atmel Corp A Delaware Corp
Publication of NO20051523D0 publication Critical patent/NO20051523D0/no
Publication of NO20051523L publication Critical patent/NO20051523L/no

Links

Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C16/00Erasable programmable read-only memories
    • G11C16/02Erasable programmable read-only memories electrically programmable
    • G11C16/04Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
    • G11C16/0408Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors
    • G11C16/0416Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors comprising cells containing a single floating gate transistor and no select transistor, e.g. UV EPROM
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B63/00Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
    • H10B63/30Resistance change memory devices, e.g. resistive RAM [ReRAM] devices comprising selection components having three or more electrodes, e.g. transistors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/68Floating-gate IGFETs
    • H10D30/681Floating-gate IGFETs having only two programming levels
    • H10D30/683Floating-gate IGFETs having only two programming levels programmed by tunnelling of carriers, e.g. Fowler-Nordheim tunnelling
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/68Floating-gate IGFETs
    • H10D30/6891Floating-gate IGFETs characterised by the shapes, relative sizes or dispositions of the floating gate electrode
    • H10D30/6893Floating-gate IGFETs characterised by the shapes, relative sizes or dispositions of the floating gate electrode wherein the floating gate has multiple non-connected parts, e.g. multi-particle floating gate
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/01Manufacture or treatment
    • H10D64/031Manufacture or treatment of data-storage electrodes
    • H10D64/035Manufacture or treatment of data-storage electrodes comprising conductor-insulator-conductor-insulator-semiconductor structures

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Non-Volatile Memory (AREA)
  • Semiconductor Memories (AREA)

Abstract

Sammendrag En MOS-transistor (29) som har egenskap som en ladningslagringsanordning som i en ikke-volatil minneanordning eller som en forsterker ved bruk av ladningslagringstrekkene for anordningen som en metode for å modulere ledningsevnen for kanalen mellom kilde og drenelektroder (31, 33). Over et dopet substrat (11) isolerer et portoksidlag (17) et dopet elektrisk isolert ladningsreservoarlag (19) fra substratet. Et-overliggende tunnelbarrierelag (21) isolerer ladningsreservoarlaget fra et nanokrystallag (23) som er i stand til å motta eller avgi elektrisk ladnings til ladningsreservoarlaget under påvirkning av kontrollporten (27) overliggende nanokrystallaget og separert ved et oksidlag (25). Elektrisk ladning på ladningsreservoarlaget påvirker ledningsevnen for kanalen. Anordningen kan blir operert i minnemodus som en EEPROM, eller i en forsterkermodus der endringene i portspenninger blir reflektert som endringer i ledningsevne for kanalen.
NO20051523A 2002-08-22 2005-03-22 Nanoktystallelektonanordning NO20051523L (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/227,061 US6690059B1 (en) 2002-08-22 2002-08-22 Nanocrystal electron device
PCT/US2003/021464 WO2004019373A2 (en) 2002-08-22 2003-07-09 Nanocrystal electron device

Publications (2)

Publication Number Publication Date
NO20051523D0 NO20051523D0 (no) 2005-03-22
NO20051523L true NO20051523L (no) 2005-03-22

Family

ID=30770661

Family Applications (1)

Application Number Title Priority Date Filing Date
NO20051523A NO20051523L (no) 2002-08-22 2005-03-22 Nanoktystallelektonanordning

Country Status (10)

Country Link
US (1) US6690059B1 (no)
EP (1) EP1540710A4 (no)
JP (1) JP2005536888A (no)
KR (1) KR20050053626A (no)
CN (1) CN1327512C (no)
AU (1) AU2003253848A1 (no)
CA (1) CA2496032A1 (no)
NO (1) NO20051523L (no)
TW (1) TWI225286B (no)
WO (1) WO2004019373A2 (no)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7105425B1 (en) * 2002-05-16 2006-09-12 Advanced Micro Devices, Inc. Single electron devices formed by laser thermal annealing
KR100973282B1 (ko) * 2003-05-20 2010-07-30 삼성전자주식회사 나노 결정층을 구비하는 소노스 메모리 장치
US6962850B2 (en) * 2003-10-01 2005-11-08 Chartered Semiconductor Manufacturing Ltd. Process to manufacture nonvolatile MOS memory device
US6991984B2 (en) * 2004-01-27 2006-01-31 Freescale Semiconductor, Inc. Method for forming a memory structure using a modified surface topography and structure thereof
KR100601943B1 (ko) * 2004-03-04 2006-07-14 삼성전자주식회사 고르게 분포된 실리콘 나노 도트가 포함된 게이트를구비하는 메모리 소자의 제조 방법
US8828792B2 (en) * 2004-05-25 2014-09-09 The Trustees Of The University Of Pennsylvania Nanostructure assemblies, methods and devices thereof
US7405002B2 (en) * 2004-08-04 2008-07-29 Agency For Science, Technology And Research Coated water-soluble nanoparticles comprising semiconductor core and silica coating
US7301197B2 (en) * 2004-09-21 2007-11-27 Atmel Corporation Non-volatile nanocrystal memory transistors using low voltage impact ionization
US7534489B2 (en) * 2004-09-24 2009-05-19 Agency For Science, Technology And Research Coated composites of magnetic material and quantum dots
US7183180B2 (en) * 2004-10-13 2007-02-27 Atmel Corporation Method for simultaneous fabrication of a nanocrystal and non-nanocrystal device
US20060140009A1 (en) * 2004-12-23 2006-06-29 Bohumil Lojek Programming method for nanocrystal memory device
US7101760B1 (en) 2005-03-31 2006-09-05 Atmel Corporation Charge trapping nanocrystal dielectric for non-volatile memory transistor
US20060220094A1 (en) * 2005-03-31 2006-10-05 Bohumil Lojek Non-volatile memory transistor with nanotube floating gate
US20060231889A1 (en) * 2005-04-13 2006-10-19 Tupei Chen Two-terminal solid-state memory device and two-terminal flexible memory device based on nanocrystals or nanoparticles
TWI289336B (en) * 2005-11-07 2007-11-01 Ind Tech Res Inst Nanocrystal memory component, manufacturing method thereof and memory comprising the same
KR100690925B1 (ko) * 2005-12-01 2007-03-09 삼성전자주식회사 나노 크리스탈 비휘발성 반도체 집적 회로 장치 및 그 제조방법
US7482651B2 (en) * 2005-12-09 2009-01-27 Micron Technology, Inc. Enhanced multi-bit non-volatile memory device with resonant tunnel barrier
KR100837413B1 (ko) * 2006-02-28 2008-06-12 삼성전자주식회사 나노결정을 포함하는 메모리 소자 제조 방법 및 이에 의해제조된 메모리 소자
KR100735534B1 (ko) * 2006-04-04 2007-07-04 삼성전자주식회사 나노 크리스탈 비휘발성 반도체 집적 회로 장치 및 그 제조방법
KR100884240B1 (ko) * 2006-10-20 2009-02-17 삼성전자주식회사 반도체 소자 및 그 형성 방법
US7557008B2 (en) * 2007-01-23 2009-07-07 Freescale Semiconductor, Inc. Method of making a non-volatile memory device
GB0801494D0 (en) 2007-02-23 2008-03-05 Univ Ind & Acad Collaboration Nonvolatile memory electronic device using nanowire used as charge channel and nanoparticles used as charge trap and method for manufacturing the same
KR100850905B1 (ko) * 2007-02-23 2008-08-07 고려대학교 산학협력단 나노선­나노입자 이종결합의 비휘발성 메모리 전자소자 및그 제조방법
JP2009130120A (ja) * 2007-11-22 2009-06-11 Toshiba Corp 半導体装置
KR101155108B1 (ko) * 2009-04-30 2012-06-11 국민대학교산학협력단 전하저장층 및 그의 형성 방법, 이를 이용한 비휘발성 메모리 장치 및 그의 제조 방법
JP5537130B2 (ja) * 2009-11-25 2014-07-02 株式会社東芝 半導体記憶装置
US8536039B2 (en) * 2010-03-25 2013-09-17 Taiwan Semiconductor Manufacturing Co., Ltd. Nano-crystal gate structure for non-volatile memory
CN102543696B (zh) * 2010-12-17 2014-12-17 中国科学院微电子研究所 一种半导体器件的制造方法
DE102013211360A1 (de) 2013-06-18 2014-12-18 Robert Bosch Gmbh Halbleiter-Leistungsschalter und Verfahren zur Herstellung eines Halbleiter-Leistungsschalters
CN112735272B (zh) * 2020-12-30 2022-05-17 武汉华星光电技术有限公司 显示面板及显示装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3878549A (en) * 1970-10-27 1975-04-15 Shumpei Yamazaki Semiconductor memories
US5714766A (en) * 1995-09-29 1998-02-03 International Business Machines Corporation Nano-structure memory device
US5852306A (en) 1997-01-29 1998-12-22 Micron Technology, Inc. Flash memory with nanocrystalline silicon film floating gate
US6054349A (en) 1997-06-12 2000-04-25 Fujitsu Limited Single-electron device including therein nanocrystals
US6232643B1 (en) 1997-11-13 2001-05-15 Micron Technology, Inc. Memory using insulator traps
JPH11186421A (ja) * 1997-12-25 1999-07-09 Sony Corp 不揮発性半導体記憶装置及びその書き込み消去方法
KR100294691B1 (ko) * 1998-06-29 2001-07-12 김영환 다중층양자점을이용한메모리소자및제조방법
TW386314B (en) 1998-09-19 2000-04-01 United Microelectronics Corp Structure of low power, high efficiency programmable erasable non-volatile memory cell and production method thereof
WO2001006570A1 (de) * 1999-07-20 2001-01-25 Infineon Technologies Ag Nichtflüchtige halbleiterspeicherzelle und verfahren zur herstellung derselben
US6320784B1 (en) 2000-03-14 2001-11-20 Motorola, Inc. Memory cell and method for programming thereof
JP2001332636A (ja) * 2000-05-19 2001-11-30 Nec Corp 不揮発性メモリ素子の構造とその製造方法
US6344403B1 (en) 2000-06-16 2002-02-05 Motorola, Inc. Memory device and method for manufacture
US6723606B2 (en) * 2000-06-29 2004-04-20 California Institute Of Technology Aerosol process for fabricating discontinuous floating gate microelectronic devices
CN1305232A (zh) * 2001-02-27 2001-07-25 南京大学 锗/硅复合纳米晶粒浮栅结构mosfet存储器

Also Published As

Publication number Publication date
NO20051523D0 (no) 2005-03-22
EP1540710A4 (en) 2008-11-05
CN1327512C (zh) 2007-07-18
CN1692494A (zh) 2005-11-02
JP2005536888A (ja) 2005-12-02
US6690059B1 (en) 2004-02-10
AU2003253848A8 (en) 2004-03-11
WO2004019373A2 (en) 2004-03-04
EP1540710A2 (en) 2005-06-15
TWI225286B (en) 2004-12-11
TW200405525A (en) 2004-04-01
KR20050053626A (ko) 2005-06-08
WO2004019373B1 (en) 2004-07-01
WO2004019373A3 (en) 2004-05-27
CA2496032A1 (en) 2004-03-04
AU2003253848A1 (en) 2004-03-11

Similar Documents

Publication Publication Date Title
NO20051523L (no) Nanoktystallelektonanordning
US10896916B2 (en) Reverse memory cell
TW540055B (en) Usage of word voltage assistance in twin MONOS cell during program and erase
US8824212B2 (en) Thermally assisted flash memory with segmented word lines
US7476586B2 (en) NOR flash memory cell with high storage density
CN101414479B (zh) 在绝缘体随机存取存储器上的单一晶体管存储单元
JP2018530163A5 (no)
US20130100743A1 (en) Method for operating a semiconductor structure
TW430997B (en) Nonvolatile semiconductor memory device and method for driving the same
TW393779B (en) A method of erasing a flash EEPROM memory
US9818484B2 (en) Systems, methods, and apparatus for memory cells with common source lines
TW200707763A (en) Non-volatile memory semiconductor device having an oxide-nitride-oxide (ONO) top dielectric layer
TWI268623B (en) Semiconductor integrated circuit device and method of manufacturing the same reading memory information at high speed from the transistor-carried nonvolatile memory cell transistor
KR20080016746A (ko) 고 유전율 유전체에서의 정공 포획을 이용하는 메모리
US10317846B2 (en) EEPROM cell with charge loss
WO2005109437A3 (en) Pfet nonvolatile memory
JP2009537932A (ja) Sonosメモリデバイス及びsonosメモリデバイスの作動方法
JPH06302828A (ja) 半導体不揮発性記憶装置
US5999453A (en) Nonvolatile semiconductor memory
JPH10334678A5 (no)
JP3175665B2 (ja) 不揮発性半導体記憶装置のデータ消去方法
US6760270B2 (en) Erase of a non-volatile memory
US6049484A (en) Erase method to improve flash EEPROM endurance by combining high voltage source erase and negative gate erase
US6128223A (en) Semiconductor memory device
JP2010157733A (ja) 半導体メモリセル及び半導体メモリセルの製造方法、半導体メモリセルの動作方法