NO20064558L - Fremgangsmate for forming av en struktur. - Google Patents

Fremgangsmate for forming av en struktur.

Info

Publication number
NO20064558L
NO20064558L NO20064558A NO20064558A NO20064558L NO 20064558 L NO20064558 L NO 20064558L NO 20064558 A NO20064558 A NO 20064558A NO 20064558 A NO20064558 A NO 20064558A NO 20064558 L NO20064558 L NO 20064558L
Authority
NO
Norway
Prior art keywords
substance
carrier
forming
electrically conductive
solvent
Prior art date
Application number
NO20064558A
Other languages
English (en)
Inventor
Ingo Schwirtlich
Hilmar Von Campe
Original Assignee
Rwe Schott Solar Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rwe Schott Solar Gmbh filed Critical Rwe Schott Solar Gmbh
Publication of NO20064558L publication Critical patent/NO20064558L/no

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/20—Electrodes
    • H10F77/206—Electrodes for devices having potential barriers
    • H10F77/211—Electrodes for devices having potential barriers for photovoltaic cells
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Landscapes

  • Photovoltaic Devices (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Printing Methods (AREA)

Abstract

Oppfinnelsen angår en fremgangsmåte for danning av en linjeformet eller prikket struktur på en bærer, spesielt for danning av båndformede, elektrisk ledende kontakter på en solcelle, ved å påføre en pastaliknende, elektrisk ledende substans som inneholder et løsemiddel og som vil hefte seg til bæreren og ved deretter å få nevnte substans til å herde. For å kunne minimalisere skyggelegging av bæreren og for å holde motstanden i strukturen lav, påføres bæreren og/eller substansen et medium inneholdende polare molekyler etter at nevnte substans er påført bæreren, hvilket muliggjør at løsemidlet inneholdt i substansen kan trekkes ut.
NO20064558A 2004-03-09 2006-10-06 Fremgangsmate for forming av en struktur. NO20064558L (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP04005540A EP1575099A1 (de) 2004-03-09 2004-03-09 Verfahren zum Ausbilden einer Struktur
PCT/EP2005/002414 WO2005088730A2 (de) 2004-03-09 2005-03-08 Verfahren zum ausbilden einer struktur

Publications (1)

Publication Number Publication Date
NO20064558L true NO20064558L (no) 2006-12-06

Family

ID=34814274

Family Applications (1)

Application Number Title Priority Date Filing Date
NO20064558A NO20064558L (no) 2004-03-09 2006-10-06 Fremgangsmate for forming av en struktur.

Country Status (5)

Country Link
US (1) US7790508B2 (no)
EP (2) EP1575099A1 (no)
JP (1) JP5335234B2 (no)
NO (1) NO20064558L (no)
WO (1) WO2005088730A2 (no)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8344523B2 (en) * 2006-05-08 2013-01-01 Diemat, Inc. Conductive composition
JP4638382B2 (ja) * 2006-06-05 2011-02-23 田中貴金属工業株式会社 接合方法
DE102009043916A1 (de) 2009-05-19 2010-12-16 Schott Solar Ag Verfahren zur Herstellung elektrischer Kontakte auf einem Halbleiterbauelement
KR101814014B1 (ko) * 2011-03-25 2018-01-03 삼성전자주식회사 도전성 페이스트, 상기 도전성 페이스트를 사용하여 형성된 전극을 포함하는 전자 소자 및 태양 전지
KR102100291B1 (ko) 2011-11-11 2020-04-13 삼성전자주식회사 도전성 페이스트, 상기 도전성 페이스트를 사용하여 형성된 전극을 포함하는 전자 소자 및 태양 전지
KR101985929B1 (ko) 2011-12-09 2019-06-05 삼성전자주식회사 도전성 페이스트, 상기 도전성 페이스트를 사용하여 형성된 전극을 포함하는 전자 소자 및 태양 전지
WO2022066708A1 (en) 2020-09-22 2022-03-31 Milwaukee Electric Tool Corporation Wireless charging pad for power tool battery packs

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US457861A (en) * 1891-08-18 Wheel
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US312864A (en) * 1885-02-24 Iseael kinney
US653918A (en) * 1899-07-20 1900-07-17 Albert De Laski Flat-woven tubular fabric.
US4457861A (en) * 1979-12-13 1984-07-03 Additive Technology Corporation Method, materials and apparatus for manufacturing printed circuits
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JPS63268773A (ja) * 1987-04-25 1988-11-07 Toyobo Co Ltd 光硬化型導電性焼成ペ−スト
JPH0332070A (ja) * 1989-06-29 1991-02-12 Sharp Corp 光電変換半導体装置の電極形成方法
GB9211500D0 (en) * 1992-05-30 1992-07-15 First Class Securities Pastes
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US5653918A (en) * 1996-01-11 1997-08-05 E. I. Du Pont De Nemours And Company Flexible thick film conductor composition
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KR100369565B1 (ko) * 1999-12-17 2003-01-29 대주정밀화학 주식회사 전기발열체용 저항 페이스트 조성물
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Also Published As

Publication number Publication date
WO2005088730A3 (de) 2005-10-27
US7790508B2 (en) 2010-09-07
EP1723681B1 (de) 2016-10-05
JP5335234B2 (ja) 2013-11-06
US20080146016A1 (en) 2008-06-19
EP1575099A1 (de) 2005-09-14
EP1723681A2 (de) 2006-11-22
WO2005088730A2 (de) 2005-09-22
JP2007528127A (ja) 2007-10-04

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