NO320152B1 - Elektronikkomponent, saerlig med piezoelektrisk virkning og beregnet for overflatemontering - Google Patents

Elektronikkomponent, saerlig med piezoelektrisk virkning og beregnet for overflatemontering Download PDF

Info

Publication number: NO320152B1
Authority: NO; Norway
Prior art keywords: electrode; base substrate; lid; circuit; insulation layer
Prior art date: 1996-05-09

Application number

NO19972126A

Other languages

English (en)

Norwegian (no)

Other versions

NO972126L (no

NO972126D0 (no

Inventor

Michinobu Maesaka

Tetsuo Tatsumi

Masato Higuchi

Original Assignee

Murata Manufacturing Co

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1996-05-09

Filing date

1997-05-07

Publication date

2005-10-31

1997-05-07 Application filed by Murata Manufacturing Co filed Critical Murata Manufacturing Co

1997-05-07 Publication of NO972126D0 publication Critical patent/NO972126D0/no

1997-11-10 Publication of NO972126L publication Critical patent/NO972126L/no

2005-10-31 Publication of NO320152B1 publication Critical patent/NO320152B1/no

Links

230000000694 effects Effects 0.000 title description 6
239000000758 substrate Substances 0.000 claims description 52
238000009413 insulation Methods 0.000 claims description 30
229910052751 metal Inorganic materials 0.000 claims description 11
239000002184 metal Substances 0.000 claims description 11
239000003990 capacitor Substances 0.000 description 18
239000000853 adhesive Substances 0.000 description 14
230000001070 adhesive effect Effects 0.000 description 14
238000004519 manufacturing process Methods 0.000 description 5
239000000919 ceramic Substances 0.000 description 3
239000003292 glue Substances 0.000 description 3
238000000034 method Methods 0.000 description 3
239000006258 conductive agent Substances 0.000 description 2
238000010586 diagram Methods 0.000 description 2
239000000463 material Substances 0.000 description 2
239000011347 resin Substances 0.000 description 2
229920005989 resin Polymers 0.000 description 2
238000007789 sealing Methods 0.000 description 2
239000004593 Epoxy Substances 0.000 description 1
BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
239000011248 coating agent Substances 0.000 description 1
238000000576 coating method Methods 0.000 description 1
239000004020 conductor Substances 0.000 description 1
238000013016 damping Methods 0.000 description 1
238000007667 floating Methods 0.000 description 1
239000011521 glass Substances 0.000 description 1
238000005304 joining Methods 0.000 description 1
230000004048 modification Effects 0.000 description 1
238000012986 modification Methods 0.000 description 1
TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
230000000149 penetrating effect Effects 0.000 description 1
238000003825 pressing Methods 0.000 description 1
238000007639 printing Methods 0.000 description 1
238000007650 screen-printing Methods 0.000 description 1
229910052709 silver Inorganic materials 0.000 description 1
239000004332 silver Substances 0.000 description 1
229910000679 solder Inorganic materials 0.000 description 1
238000003892 spreading Methods 0.000 description 1

Classifications

- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device

Landscapes

Physics & Mathematics (AREA)
Acoustics & Sound (AREA)
Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Piezo-Electric Transducers For Audible Bands (AREA)

NO19972126A 1996-05-09 1997-05-07 Elektronikkomponent, saerlig med piezoelektrisk virkning og beregnet for overflatemontering NO320152B1 (no)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP14086096A JP3183169B2 (ja)	1996-05-09	1996-05-09	電子部品の製造方法

Publications (3)

Publication Number	Publication Date
NO972126D0 NO972126D0 (no)	1997-05-07
NO972126L NO972126L (no)	1997-11-10
NO320152B1 true NO320152B1 (no)	2005-10-31

Family

ID=15278435

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
NO19972126A NO320152B1 (no)	1996-05-09	1997-05-07	Elektronikkomponent, saerlig med piezoelektrisk virkning og beregnet for overflatemontering

Country Status (5)

Country	Link
US (1)	US5825120A (de)
EP (1)	EP0806835B1 (de)
JP (1)	JP3183169B2 (de)
CN (1)	CN1140052C (de)
NO (1)	NO320152B1 (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
KR20000047400A (ko) *	1998-12-19	2000-07-25	이형도	고주파형 공진자 및 그 제조방법
GB9902341D0 (en) *	1999-02-03	1999-03-24	Perry James A H	Packaged device
JP3646776B2 (ja) *	1999-03-16	2005-05-11	株式会社村田製作所	電子部品
JP3617368B2 (ja) *	1999-04-02	2005-02-02	株式会社村田製作所	マザー基板および子基板ならびにその製造方法
DE10039646A1 (de) *	1999-08-18	2001-03-08	Murata Manufacturing Co	Leitende Abdeckung, Elektronisches Bauelement und Verfahren zur Bildung einer isolierenden Schicht der leitenden Abdeckung
US7259499B2 (en)	2004-12-23	2007-08-21	Askew Andy R	Piezoelectric bimorph actuator and method of manufacturing thereof
JP4932788B2 (ja) *	2008-06-06	2012-05-16	シャープ株式会社	半導体装置、光学装置用モジュール、及び、半導体装置の製造方法
WO2013172440A1 (ja) *	2012-05-18	2013-11-21	株式会社村田製作所	水晶振動子の製造方法及び水晶振動子
JP2014188239A (ja) *	2013-03-28	2014-10-06	Seiko Epson Corp	流体噴射装置、および、医療機器
JP2015128276A (ja) *	2013-11-29	2015-07-09	日本電波工業株式会社	表面実装水晶振動子及びその製造方法
WO2016190090A1 (ja) *	2015-05-27	2016-12-01	株式会社村田製作所	圧電振動素子搭載用基板並びに圧電振動子及びその製造方法
JP6540955B2 (ja) *	2015-08-10	2019-07-10	株式会社村田製作所	電子部品及びその製造方法
KR20170054010A (ko) *	2015-11-09	2017-05-17	삼성전기주식회사	수정 소자 패키지 및 그 제조방법
JP6181904B1 (ja) *	2016-01-23	2017-08-16	京セラ株式会社	圧電部品
CN106465556B (zh) *	2016-07-21	2019-01-18	北京小米移动软件有限公司	金属盖体及电子设备
JP6604293B2 (ja) *	2016-09-20	2019-11-13	株式会社村田製作所	弾性波装置
WO2018098494A1 (en)	2016-11-28	2018-05-31	Quantumscape Corporation	Pressurized electrochemical cell
CN106899277A (zh) *	2017-02-16	2017-06-27	珠海迈科智能科技股份有限公司	一种晶振元件的制作方法及晶振元件
WO2019065519A1 (ja) *	2017-09-27	2019-04-04	株式会社村田製作所	圧電振動子及び圧電振動子の製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5279794A (en) *	1975-12-26	1977-07-05	Seiko Instr & Electronics Ltd	Piezo-vibrator unit
JPS5925486B2 (ja) *	1977-11-15	1984-06-18	シチズン時計株式会社	圧電振動子の容器
JPS60123120A (ja) *	1983-12-07	1985-07-01	Murata Mfg Co Ltd	圧電共振子とコンデンサの複合部品及びその製造方法
JPH0749914Y2 (ja) *	1986-01-29	1995-11-13	株式会社村田製作所	超音波トランスデユ−サ
JPS6359012A (ja) *	1986-08-27	1988-03-14	Murata Mfg Co Ltd	複合電子部品
JPS6374312A (ja) *	1986-09-18	1988-04-04	Murata Mfg Co Ltd	電子部品の製造方法
JPH04215311A (ja) *	1990-12-14	1992-08-06	Murata Mfg Co Ltd	ケース付圧電部品
US5382929A (en) *	1992-07-31	1995-01-17	Ndk, Nihon Dempa Kogyo Company, Ltd.	Monolithic crystal filter
US5696422A (en) *	1996-03-01	1997-12-09	Piezo Crystal Company	Crystal package

1996
- 1996-05-09 JP JP14086096A patent/JP3183169B2/ja not_active Expired - Lifetime
1997
- 1997-04-30 EP EP97107209A patent/EP0806835B1/de not_active Expired - Lifetime
- 1997-05-07 NO NO19972126A patent/NO320152B1/no not_active IP Right Cessation
- 1997-05-09 CN CNB971111456A patent/CN1140052C/zh not_active Expired - Lifetime
- 1997-05-09 US US08/853,447 patent/US5825120A/en not_active Expired - Lifetime

Also Published As

Publication number	Publication date
US5825120A (en)	1998-10-20
EP0806835A3 (de)	1998-06-10
CN1140052C (zh)	2004-02-25
JPH09307397A (ja)	1997-11-28
JP3183169B2 (ja)	2001-07-03
NO972126L (no)	1997-11-10
EP0806835A2 (de)	1997-11-12
EP0806835B1 (de)	2004-03-17
NO972126D0 (no)	1997-05-07
CN1170277A (zh)	1998-01-14

Legal Events

Date	Code	Title	Description
2017-05-15	MK1K	Patent expired

Publication	Publication Date	Title
NO320152B1 (no)	2005-10-31	Elektronikkomponent, saerlig med piezoelektrisk virkning og beregnet for overflatemontering
US5875099A (en)	1999-02-23	Electronic component
US5504980A (en)	1996-04-09	Method of manufacturing a chip-type piezoelectric-resonator
EP3288184B1 (de)	2021-04-07	Eingekapseltes gehäuse für ein rf-filter und verfahren zur herstellung
JP4712632B2 (ja)	2011-06-29	弾性波デバイス及びその製造方法
AU644183B2 (en)	1993-12-02	Surface acoustic wave device and its manufacturing method
US6154940A (en)	2000-12-05	Electronic part and a method of production thereof
KR101943895B1 (ko)	2019-01-30	전자 부품 수납용 패키지, 전자 장치 및 전자 모듈
KR101804496B1 (ko)	2017-12-04	전자부품 및 그 제조방법
US5410789A (en)	1995-05-02	Method of manufacturing piezoelectric-resonator having vibrating spaces formed therein
KR20180031713A (ko)	2018-03-28	탄성파 장치
DE10331322A1 (de)	2005-02-03	Elektronisches Bauelement und Verfahren zur Herstellung
JP4576741B2 (ja)	2010-11-10	圧電発振器
JP2004200776A (ja)	2004-07-15	Ｓａｗデバイスの構造、及びその製造方法
JP2005130071A (ja)	2005-05-19	圧電デバイスのパッケージ構造
JP2009088908A (ja)	2009-04-23	弾性波装置
JPH11261124A (ja)	1999-09-24	圧電装置、及び該圧電装置の製造方法
CN121749940A (zh)	2026-03-27	具备弹性波器件的模块及其制造方法
CN117200735A (zh)	2023-12-08	弹性波器件
JP5018917B2 (ja)	2012-09-05	圧電発振器の製造方法
JP2007157859A (ja)	2007-06-21	セラミック・パッケージ、集合基板、及び電子デバイス
JPH1127078A (ja)	1999-01-29	チップ型圧電振動部品
JP4904846B2 (ja)	2012-03-28	圧電発振器、収容器、および収容器の製造方法
CN120856095A (zh)	2025-10-28	弹性波器件
JPH08274569A (ja)	1996-10-18	圧電共振子