NO893654L - Materiale for elektroniske komponenter og fremstilling avkomponentene. - Google Patents

Materiale for elektroniske komponenter og fremstilling avkomponentene.

Info

Publication number
NO893654L
NO893654L NO89893654A NO893654A NO893654L NO 893654 L NO893654 L NO 893654L NO 89893654 A NO89893654 A NO 89893654A NO 893654 A NO893654 A NO 893654A NO 893654 L NO893654 L NO 893654L
Authority
NO
Norway
Prior art keywords
components
manufacturing
alloys
boxes
carriers
Prior art date
Application number
NO89893654A
Other languages
English (en)
Norwegian (no)
Other versions
NO893654D0 (no
Inventor
Salim Dermarkar
Xavier Dumant
Michel Lebailly
Original Assignee
Pechiney Recherche
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pechiney Recherche filed Critical Pechiney Recherche
Publication of NO893654D0 publication Critical patent/NO893654D0/no
Publication of NO893654L publication Critical patent/NO893654L/no

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C49/00—Alloys containing metallic or non-metallic fibres or filaments
    • C22C49/14—Alloys containing metallic or non-metallic fibres or filaments characterised by the fibres or filaments
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C29/00—Alloys based on carbides, oxides, nitrides, borides, or silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides, sulfides
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C49/00—Alloys containing metallic or non-metallic fibres or filaments
    • C22C49/02—Alloys containing metallic or non-metallic fibres or filaments characterised by the matrix material
    • C22C49/04—Light metals
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C49/00—Alloys containing metallic or non-metallic fibres or filaments
    • C22C49/02—Alloys containing metallic or non-metallic fibres or filaments characterised by the matrix material
    • C22C49/04—Light metals
    • C22C49/06—Aluminium
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/6875—Shapes or dispositions thereof being on a metallic substrate, e.g. insulated metal substrates [IMS]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacture Of Alloys Or Alloy Compounds (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
  • Developing Agents For Electrophotography (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
NO89893654A 1988-09-13 1989-09-12 Materiale for elektroniske komponenter og fremstilling avkomponentene. NO893654L (no)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8812548 1988-09-13

Publications (2)

Publication Number Publication Date
NO893654D0 NO893654D0 (no) 1989-09-12
NO893654L true NO893654L (no) 1990-03-14

Family

ID=9370390

Family Applications (1)

Application Number Title Priority Date Filing Date
NO89893654A NO893654L (no) 1988-09-13 1989-09-12 Materiale for elektroniske komponenter og fremstilling avkomponentene.

Country Status (4)

Country Link
EP (1) EP0363286B1 (de)
AT (1) ATE97171T1 (de)
DE (1) DE68910634T2 (de)
NO (1) NO893654L (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2590603B2 (ja) * 1990-10-09 1997-03-12 三菱電機株式会社 電子部品塔載用基材
FR2695409B1 (fr) * 1992-09-10 1994-11-25 Aerospatiale Matériau composite associant un alliage de magnésium contenant du zirconium à un renfort carbon, et son procédé de fabrication.
US5528076A (en) * 1995-02-01 1996-06-18 Motorola, Inc. Leadframe having metal impregnated silicon carbide mounting area
AT408345B (de) * 1999-11-17 2001-10-25 Electrovac Verfahren zur festlegung eines aus metall-matrix- composite-(mmc-) materiales gebildeten körpers auf einem keramischen körper
AT413704B (de) * 2004-06-23 2006-05-15 Arc Leichtmetallkompetenzzentrum Ranshofen Gmbh Kohlenstofffaserverstärktes leichtmetallteil und verfahren zur herstellung desselben
DE102017216290B4 (de) * 2017-09-14 2022-09-08 Freie Universität Berlin Verbundwerkstoff und Verfahren zu dessen Herstellung, Kühlkörper und elektronisches Bauteil

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3889348A (en) * 1969-03-27 1975-06-17 Jerome H Lemelson Fiber reinforced composite material and method of making same
US4492265A (en) * 1980-08-04 1985-01-08 Toyota Jidosha Kabushiki Kaisha Method for production of composite material using preheating of reinforcing material
EP0048768B1 (de) * 1980-09-29 1986-01-22 Kabushiki Kaisha Toshiba Halbleiteranordnung mit einem auf einem metallischen Substrat gelöteten Halbleiterelement
JPS5966966A (ja) * 1982-10-09 1984-04-16 Toyota Motor Corp 耐熱性軽合金部材およびその製造方法
JPS619537A (ja) * 1984-06-25 1986-01-17 Mitsubishi Alum Co Ltd 無機短繊維強化金属複合材の製造法
GB2163179B (en) * 1984-08-13 1988-07-20 Ae Plc The manufacture of aluminium/zirconia composites
US4793883A (en) * 1986-07-14 1988-12-27 National Starch And Chemical Corporation Method of bonding a semiconductor chip to a substrate

Also Published As

Publication number Publication date
EP0363286B1 (de) 1993-11-10
DE68910634T2 (de) 1994-03-17
DE68910634D1 (de) 1993-12-16
ATE97171T1 (de) 1993-11-15
EP0363286A3 (en) 1990-11-28
EP0363286A2 (de) 1990-04-11
NO893654D0 (no) 1989-09-12

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