NO943626L - Fjerning av overflateforurensninger ved bestråling - Google Patents

Fjerning av overflateforurensninger ved bestråling

Info

Publication number
NO943626L
NO943626L NO943626A NO943626A NO943626L NO 943626 L NO943626 L NO 943626L NO 943626 A NO943626 A NO 943626A NO 943626 A NO943626 A NO 943626A NO 943626 L NO943626 L NO 943626L
Authority
NO
Norway
Prior art keywords
removal
surface contaminants
irradiation
substrate
energy radiation
Prior art date
Application number
NO943626A
Other languages
English (en)
Norwegian (no)
Other versions
NO943626D0 (no
Inventor
Audrey C Engelsberg
Joseph A Dehais
Original Assignee
Cauldron Lp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cauldron Lp filed Critical Cauldron Lp
Publication of NO943626D0 publication Critical patent/NO943626D0/no
Publication of NO943626L publication Critical patent/NO943626L/no

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/12—Cleaning before device manufacture, i.e. Begin-Of-Line process by dry cleaning only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • B08B7/0042—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by laser
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1435—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor involving specially adapted flow-control means
    • B23K26/1436—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor involving specially adapted flow-control means for pressure control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1435—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor involving specially adapted flow-control means
    • B23K26/1437—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor involving specially adapted flow-control means for flow-rate control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1462—Nozzles; Features related to nozzles
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
    • G03F7/704—Scanned exposure beam, e.g. raster-, rotary- and vector scanning
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70925—Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/412—Deposition of metallic or metal-silicide materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P34/00—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices
    • H10P34/40—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices with high-energy radiation
    • H10P34/42—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices with high-energy radiation with electromagnetic radiation, e.g. laser annealing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/071—Manufacture or treatment of dielectric parts thereof
    • H10W20/092—Manufacture or treatment of dielectric parts thereof by smoothing the dielectric parts

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Environmental & Geological Engineering (AREA)
  • Atmospheric Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Toxicology (AREA)
  • Fluid Mechanics (AREA)
  • Cleaning In General (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Drying Of Semiconductors (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Road Signs Or Road Markings (AREA)
  • Laser Beam Processing (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
NO943626A 1992-03-31 1994-09-29 Fjerning av overflateforurensninger ved bestråling NO943626L (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US86503992A 1992-03-31 1992-03-31
PCT/US1993/002734 WO1993019888A1 (en) 1992-03-31 1993-03-24 Removal of surface contaminants by irradiation

Publications (2)

Publication Number Publication Date
NO943626D0 NO943626D0 (no) 1994-09-29
NO943626L true NO943626L (no) 1994-09-29

Family

ID=25344584

Family Applications (1)

Application Number Title Priority Date Filing Date
NO943626A NO943626L (no) 1992-03-31 1994-09-29 Fjerning av overflateforurensninger ved bestråling

Country Status (17)

Country Link
EP (1) EP0633823B1 (de)
JP (1) JPH07505577A (de)
KR (1) KR100221421B1 (de)
CN (1) CN1078415A (de)
AT (1) ATE180703T1 (de)
AU (1) AU673519B2 (de)
BR (1) BR9306174A (de)
CA (1) CA2132332C (de)
CZ (1) CZ238294A3 (de)
DE (1) DE69325171D1 (de)
FI (1) FI944526L (de)
MX (1) MX9301773A (de)
NO (1) NO943626L (de)
RU (1) RU2114486C1 (de)
SG (1) SG42890A1 (de)
TW (1) TW367527B (de)
WO (1) WO1993019888A1 (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2714464B1 (fr) * 1993-12-23 1996-02-09 Cogema Procédé de contrôle de la contamination surfacique d'un solide et dispositif de mise en Óoeuvre.
IL115934A0 (en) * 1995-11-09 1996-01-31 Oramir Semiconductor Ltd Laser processing chamber with cassette cell
IL115933A0 (en) 1995-11-09 1996-01-31 Oramir Semiconductor Ltd Process and apparatus for oblique beam revolution for the effective laser stripping of sidewalls
IL115931A0 (en) 1995-11-09 1996-01-31 Oramir Semiconductor Ltd Laser stripping improvement by modified gas composition
NL1002598C2 (nl) * 1996-03-13 1997-09-17 Bootsman Holding Bv Werkwijze en inrichting voor het bewerken van substraat.
US5800625A (en) * 1996-07-26 1998-09-01 Cauldron Limited Partnership Removal of material by radiation applied at an oblique angle
US6369353B1 (en) 1998-02-20 2002-04-09 The Goodyear Tire & Rubber Company Robotic laser tire mold cleaning system and method of use
CA2314874A1 (en) * 1998-02-20 1999-08-26 Geary Victor Soska Robotic laser tire mold cleaning system and method of use
FR2777810B1 (fr) * 1998-04-28 2000-05-19 Air Liquide Procede et dispositif de traitement de la surface interne d'une bouteille de gaz
RU2297886C2 (ru) * 2005-06-06 2007-04-27 Евгений Михайлович Борисов Способ очистки поверхности и устройство для его осуществления
TWI426964B (zh) * 2008-09-17 2014-02-21 日立全球先端科技股份有限公司 Organic EL mask cleaning device, organic EL display manufacturing device, organic EL display and organic EL mask cleaning method
KR101135499B1 (ko) 2010-05-28 2012-04-13 삼성에스디아이 주식회사 전지용 전극 탭의 레이저 세정 장치 및 이를 이용한 레이저 세정 방법
RU2538161C2 (ru) * 2012-12-28 2015-01-10 федеральное государственное автономное образовательное учреждение высшего образования "Санкт-Петербургский национальный исследовательский университет информационных технологий, механики и оптики" Способ лазерной очистки поверхности
RU2767229C2 (ru) * 2014-12-30 2022-03-16 Конинклейке Филипс Н.В. Система для предотвращения биологического обрастания (варианты)
JP6382901B2 (ja) 2016-09-29 2018-08-29 ファナック株式会社 レーザー加工システム
US10416575B2 (en) * 2016-11-16 2019-09-17 Suss Microtec Photomask Equipment Gmbh & Co. Kg Apparatus and method for cleaning a partial area of a substrate
JP7522065B2 (ja) * 2020-03-25 2024-07-24 高純度シリコン株式会社 多結晶シリコン塊のクリーニング方法
RU2739195C1 (ru) * 2020-04-07 2020-12-21 Общество С Ограниченной Ответственностью "Нтц Тонкопленочных Технологий В Энергетике" Вакуумная напылительная установка с системой лазерной очистки паллет (варианты)
CN113020129A (zh) * 2021-02-26 2021-06-25 苏州大学 一种复合激光清洗光头及复合式激光清洗方法

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Publication number Priority date Publication date Assignee Title
JPS5776846A (en) * 1980-10-31 1982-05-14 Fujitsu Ltd Surface treating method for semiconductor
JPS57102229A (en) * 1980-12-17 1982-06-25 Matsushita Electric Ind Co Ltd Substrate processing method
US4568632A (en) * 1982-10-07 1986-02-04 International Business Machines Corporation Patterning of polyimide films with far ultraviolet light
JPS6037736A (ja) * 1983-08-11 1985-02-27 Toshiba Corp 表面清浄方法
JPS60129136A (ja) * 1983-12-15 1985-07-10 Toshiba Corp 紫外線照射装置
JPS61147988A (ja) * 1984-12-19 1986-07-05 Toshiba Corp レ−ザ加工装置
US4668304A (en) * 1985-04-10 1987-05-26 Eaton Corporation Dopant gettering semiconductor processing by excimer laser
JPS6285433A (ja) * 1985-10-09 1987-04-18 Sumitomo Electric Ind Ltd 研摩装置
ES2019931B3 (es) * 1986-02-14 1991-07-16 Amoco Corp Tratamiento por laser ultravioleta de superficies moldeadas.
EP0268301B1 (de) * 1986-11-20 1993-09-15 Nec Corporation Verfahren und Vorrichtung um eine Linie auf einem strukturierten Substrat zu schreiben
JPS63178845A (ja) * 1987-01-20 1988-07-22 Mitsubishi Heavy Ind Ltd 付着物除去装置
DE3721940A1 (de) * 1987-07-02 1989-01-12 Ibm Deutschland Entfernen von partikeln von oberflaechen fester koerper durch laserbeschuss
DE3904969A1 (de) * 1988-02-24 1989-09-21 Schmidt Ott Andreas Dr Verfahren zur beseitigung von staubpartikeln von oberflaechen in gasfoermiger umgebung
US5099557A (en) * 1988-07-08 1992-03-31 Engelsberg Audrey C Removal of surface contaminants by irradiation from a high-energy source
US5024968A (en) * 1988-07-08 1991-06-18 Engelsberg Audrey C Removal of surface contaminants by irradiation from a high-energy source
FR2641718B1 (fr) * 1989-01-17 1992-03-20 Ardt Procede de nettoyage de la surface de matieres solides et dispositif de mise en oeuvre de ce procede, utilisant un laser impulsionnel de puissance, a impulsions courtes, dont on focalise le faisceau sur la surface a nettoyer
US4920994A (en) * 1989-09-12 1990-05-01 The United States Of America As Represented By The United States Department Of Energy Laser removal of sludge from steam generators
US5151135A (en) * 1989-09-15 1992-09-29 Amoco Corporation Method for cleaning surfaces using UV lasers
US4979180A (en) * 1989-11-24 1990-12-18 Muncheryan Arthur M Modular interchangeable laser system
JPH04157088A (ja) * 1990-10-17 1992-05-29 Fujitsu Ltd レーザ加工装置

Also Published As

Publication number Publication date
SG42890A1 (en) 1997-10-17
KR100221421B1 (ko) 1999-09-15
CN1078415A (zh) 1993-11-17
EP0633823B1 (de) 1999-06-02
NO943626D0 (no) 1994-09-29
AU3932593A (en) 1993-11-08
JPH07505577A (ja) 1995-06-22
DE69325171D1 (de) 1999-07-08
CA2132332C (en) 1999-03-30
WO1993019888A1 (en) 1993-10-14
RU94042468A (ru) 1997-03-10
FI944526A0 (fi) 1994-09-29
FI944526A7 (fi) 1994-09-29
CA2132332A1 (en) 1993-10-01
MX9301773A (es) 1994-02-28
BR9306174A (pt) 1998-01-13
CZ238294A3 (en) 1996-02-14
EP0633823A4 (en) 1995-02-15
ATE180703T1 (de) 1999-06-15
RU2114486C1 (ru) 1998-06-27
TW367527B (en) 1999-08-21
AU673519B2 (en) 1996-11-14
FI944526L (fi) 1994-09-29
EP0633823A1 (de) 1995-01-18

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