NO996064L - Fremgangsmåte for avknekking av glassvarer - Google Patents

Fremgangsmåte for avknekking av glassvarer

Info

Publication number
NO996064L
NO996064L NO996064A NO996064A NO996064L NO 996064 L NO996064 L NO 996064L NO 996064 A NO996064 A NO 996064A NO 996064 A NO996064 A NO 996064A NO 996064 L NO996064 L NO 996064L
Authority
NO
Norway
Prior art keywords
subjected
laser radiation
cracked
glassware
action
Prior art date
Application number
NO996064A
Other languages
English (en)
Other versions
NO996064D0 (no
Inventor
Georges Cuvelier
Original Assignee
Georges Cuvelier
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Georges Cuvelier filed Critical Georges Cuvelier
Publication of NO996064D0 publication Critical patent/NO996064D0/no
Publication of NO996064L publication Critical patent/NO996064L/no

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/095—Tubes, rods or hollow products
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/095—Tubes, rods or hollow products
    • C03B33/0955—Tubes, rods or hollow products using a focussed radiation beam, e.g. laser

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Toxicology (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Magnetic Heads (AREA)
  • Disintegrating Or Milling (AREA)
  • Crushing And Grinding (AREA)
  • Pulleys (AREA)
  • Output Control And Ontrol Of Special Type Engine (AREA)
  • Pistons, Piston Rings, And Cylinders (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Manufacture, Treatment Of Glass Fibers (AREA)
NO996064A 1997-06-11 1999-12-09 Fremgangsmåte for avknekking av glassvarer NO996064L (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
BE9700505A BE1011208A4 (fr) 1997-06-11 1997-06-11 Procede de decalottage de pieces en verre.
PCT/BE1998/000085 WO1998056722A1 (fr) 1997-06-11 1998-06-10 Procede de decalottage de pieces en verre

Publications (2)

Publication Number Publication Date
NO996064D0 NO996064D0 (no) 1999-12-09
NO996064L true NO996064L (no) 2000-02-09

Family

ID=3890567

Family Applications (1)

Application Number Title Priority Date Filing Date
NO996064A NO996064L (no) 1997-06-11 1999-12-09 Fremgangsmåte for avknekking av glassvarer

Country Status (22)

Country Link
US (1) US6438996B1 (no)
EP (1) EP0988255B1 (no)
JP (1) JP2002510271A (no)
KR (1) KR20010013481A (no)
CN (1) CN1248978C (no)
AT (1) ATE203229T1 (no)
AU (1) AU7752798A (no)
BE (1) BE1011208A4 (no)
CA (1) CA2291592A1 (no)
CZ (1) CZ437099A3 (no)
DE (1) DE69801160T2 (no)
DK (1) DK0988255T3 (no)
ES (1) ES2161054T3 (no)
HU (1) HU222139B1 (no)
NO (1) NO996064L (no)
PT (1) PT988255E (no)
RU (1) RU2193537C2 (no)
SI (1) SI0988255T1 (no)
SK (1) SK167399A3 (no)
TR (1) TR199902991T2 (no)
TW (1) TW416894B (no)
WO (1) WO1998056722A1 (no)

Families Citing this family (66)

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JP4659300B2 (ja) 2000-09-13 2011-03-30 浜松ホトニクス株式会社 レーザ加工方法及び半導体チップの製造方法
BE1013787A3 (fr) * 2000-10-24 2002-08-06 Cuvelier Georges Procede et installation pour la decoupe de pieces en verre.
CN100410196C (zh) * 2001-11-08 2008-08-13 夏普株式会社 切割玻璃基体的方法和装置、液晶板以及制造液晶板的装置
CN101335235B (zh) 2002-03-12 2010-10-13 浜松光子学株式会社 基板的分割方法
AU2003211581A1 (en) 2002-03-12 2003-09-22 Hamamatsu Photonics K.K. Method of cutting processed object
TWI326626B (en) 2002-03-12 2010-07-01 Hamamatsu Photonics Kk Laser processing method
TWI520269B (zh) 2002-12-03 2016-02-01 濱松赫德尼古斯股份有限公司 Cutting method of semiconductor substrate
KR100497820B1 (ko) * 2003-01-06 2005-07-01 로체 시스템즈(주) 유리판절단장치
FR2852250B1 (fr) 2003-03-11 2009-07-24 Jean Luc Jouvin Fourreau de protection pour canule, un ensemble d'injection comportant un tel fourreau et aiguille equipee d'un tel fourreau
DE60315515T2 (de) 2003-03-12 2007-12-13 Hamamatsu Photonics K.K., Hamamatsu Laserstrahlbearbeitungsverfahren
DE102004014277A1 (de) * 2004-03-22 2005-10-20 Fraunhofer Ges Forschung Verfahren zum laserthermischen Trennen von Flachgläsern
DE102004035342B4 (de) * 2004-07-21 2007-12-27 Schott Ag Verfahren zum Durchtrennen von Platten aus nichtmetallischen Werkstoffen
BE1016686A3 (fr) * 2005-07-18 2007-04-03 Georges Cuvelier Installation pour la realisation d'operations de mise en forme de pieces en verre ou en cristal.
US20100320249A1 (en) * 2007-02-28 2010-12-23 Claus Peter Kluge Method for producing a component using asymmetrical energy input along the parting or predetermined breaking line
TWI414383B (zh) * 2008-06-25 2013-11-11 Mitsuboshi Diamond Ind Co Ltd Angle processing device
RU2394780C1 (ru) * 2009-04-13 2010-07-20 Государственное образовательное учреждение высшего профессионального образования "Тульский государственный университет" Способ лазерного импульсного формообразования твердых неметаллических материалов
CN102765876A (zh) * 2011-05-05 2012-11-07 上海镭立激光科技有限公司 一种激光自聚焦穿丝玻璃切割方法
RU2528287C2 (ru) * 2012-05-15 2014-09-10 Открытое Акционерное Общество "Научно-Исследовательский Институт Технического Стекла" Способ лазерной резки хрупких неметаллических материалов и устройство для его осуществления
WO2014079478A1 (en) 2012-11-20 2014-05-30 Light In Light Srl High speed laser processing of transparent materials
EP2754524B1 (de) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
US9701564B2 (en) 2013-01-15 2017-07-11 Corning Incorporated Systems and methods of glass cutting by inducing pulsed laser perforations into glass articles
JP6056564B2 (ja) 2013-03-08 2017-01-11 株式会社Ihi セラミックマトリックス複合材の加工方法
EP2781296B1 (de) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
US10005152B2 (en) * 2013-11-19 2018-06-26 Rofin-Sinar Technologies Llc Method and apparatus for spiral cutting a glass tube using filamentation by burst ultrafast laser pulses
US9687936B2 (en) 2013-12-17 2017-06-27 Corning Incorporated Transparent material cutting with ultrafast laser and beam optics
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
US10442719B2 (en) 2013-12-17 2019-10-15 Corning Incorporated Edge chamfering methods
US10293436B2 (en) 2013-12-17 2019-05-21 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US9676167B2 (en) 2013-12-17 2017-06-13 Corning Incorporated Laser processing of sapphire substrate and related applications
US9850160B2 (en) 2013-12-17 2017-12-26 Corning Incorporated Laser cutting of display glass compositions
US20150165560A1 (en) 2013-12-17 2015-06-18 Corning Incorporated Laser processing of slots and holes
US9701563B2 (en) 2013-12-17 2017-07-11 Corning Incorporated Laser cut composite glass article and method of cutting
US9815730B2 (en) 2013-12-17 2017-11-14 Corning Incorporated Processing 3D shaped transparent brittle substrate
TWI730945B (zh) 2014-07-08 2021-06-21 美商康寧公司 用於雷射處理材料的方法與設備
MX2017000440A (es) * 2014-07-11 2017-08-16 Corning Inc Sistemas y metodos para cortado de vidrio al inducir perforaciones por láser pulsado en artículos de vidrio.
US9617180B2 (en) 2014-07-14 2017-04-11 Corning Incorporated Methods and apparatuses for fabricating glass articles
CN107073641B (zh) 2014-07-14 2020-11-10 康宁股份有限公司 接口块；用于使用这种接口块切割在波长范围内透明的衬底的系统和方法
KR20170028943A (ko) 2014-07-14 2017-03-14 코닝 인코포레이티드 조정가능한 레이저 빔 촛점 라인을 사용하여 투명한 재료를 처리하는 방법 및 시스템
EP3169479B1 (en) 2014-07-14 2019-10-02 Corning Incorporated Method of and system for arresting incident crack propagation in a transparent material
WO2016010949A1 (en) 2014-07-14 2016-01-21 Corning Incorporated Method and system for forming perforations
DE102014013262A1 (de) 2014-09-08 2016-03-10 Schott Ag Vorrichtung und Verfahren zum Durchtrennen von mit einer Geschwindigkeit bewegten Werkstücken mechanisch spröder und nichtmetallischer Werkstoffe
US10047001B2 (en) 2014-12-04 2018-08-14 Corning Incorporated Glass cutting systems and methods using non-diffracting laser beams
CN107406293A (zh) 2015-01-12 2017-11-28 康宁股份有限公司 使用多光子吸收方法来对经热回火的基板进行激光切割
US11773004B2 (en) 2015-03-24 2023-10-03 Corning Incorporated Laser cutting and processing of display glass compositions
KR20170131638A (ko) 2015-03-27 2017-11-29 코닝 인코포레이티드 가스 투과성 유리창 및 이의 제작방법
WO2017011296A1 (en) 2015-07-10 2017-01-19 Corning Incorporated Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same
JP6938543B2 (ja) 2016-05-06 2021-09-22 コーニング インコーポレイテッド 透明基板からの、輪郭設定された形状のレーザ切断及び取り外し
US10410883B2 (en) 2016-06-01 2019-09-10 Corning Incorporated Articles and methods of forming vias in substrates
US10794679B2 (en) 2016-06-29 2020-10-06 Corning Incorporated Method and system for measuring geometric parameters of through holes
JP6673061B2 (ja) * 2016-07-04 2020-03-25 日本電気硝子株式会社 ガラス物品の製造方法
KR20190035805A (ko) 2016-07-29 2019-04-03 코닝 인코포레이티드 레이저 처리를 위한 장치 및 방법
KR102423775B1 (ko) 2016-08-30 2022-07-22 코닝 인코포레이티드 투명 재료의 레이저 가공
US10730783B2 (en) 2016-09-30 2020-08-04 Corning Incorporated Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots
KR102428350B1 (ko) 2016-10-24 2022-08-02 코닝 인코포레이티드 시트형 유리 기판의 레이저 기반 기계 가공을 위한 기판 프로세싱 스테이션
US10752534B2 (en) 2016-11-01 2020-08-25 Corning Incorporated Apparatuses and methods for laser processing laminate workpiece stacks
US10688599B2 (en) 2017-02-09 2020-06-23 Corning Incorporated Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
US10580725B2 (en) 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US10626040B2 (en) 2017-06-15 2020-04-21 Corning Incorporated Articles capable of individual singulation
US12180108B2 (en) 2017-12-19 2024-12-31 Corning Incorporated Methods for etching vias in glass-based articles employing positive charge organic molecules
DE102018100443A1 (de) * 2018-01-10 2019-07-11 Schott Ag Verfahren und Vorrichtung zur Herstellung von Glasvorprodukten und von Glasprodukten
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
DE202019005592U1 (de) * 2019-01-22 2021-02-08 Hegla Gmbh & Co. Kg Vorrichtung zum Bearbeiten und zum Trennen einer Verbundsicherheitsglastafel
RU2719862C1 (ru) * 2019-08-29 2020-04-23 Общество С Ограниченной Ответственностью "Пелком Дубна Машиностроительный Завод" Способ обработки полых стеклоизделий и лазерная установка для его осуществления
FR3118025B3 (fr) * 2020-12-17 2022-12-09 Arc France Procédé de fabrication d’un article creux en verre
CN117464202B (zh) * 2023-12-27 2024-04-16 苏州禧屋新材料科技股份有限公司 一种玻璃钢复合板材用切割装置

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Also Published As

Publication number Publication date
AU7752798A (en) 1998-12-30
SI0988255T1 (no) 2001-12-31
RU2193537C2 (ru) 2002-11-27
ATE203229T1 (de) 2001-08-15
CN1248978C (zh) 2006-04-05
ES2161054T3 (es) 2001-11-16
DE69801160D1 (de) 2001-08-23
KR20010013481A (ko) 2001-02-26
WO1998056722A1 (fr) 1998-12-17
DK0988255T3 (da) 2001-11-05
CN1259924A (zh) 2000-07-12
CZ437099A3 (cs) 2000-07-12
CA2291592A1 (fr) 1998-12-17
HU222139B1 (hu) 2003-04-28
NO996064D0 (no) 1999-12-09
DE69801160T2 (de) 2002-03-28
HUP0004651A3 (en) 2001-06-28
SK167399A3 (en) 2000-07-11
EP0988255A1 (fr) 2000-03-29
PT988255E (pt) 2001-12-28
TW416894B (en) 2001-01-01
EP0988255B1 (fr) 2001-07-18
TR199902991T2 (xx) 2000-07-21
BE1011208A4 (fr) 1999-06-01
US6438996B1 (en) 2002-08-27
HUP0004651A2 (hu) 2001-05-28
JP2002510271A (ja) 2002-04-02

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