PH12015501706A1 - Electro-deposited copper foil, method of surface-treated copper foil manufactured by using electro-deposited copper foil - Google Patents

Electro-deposited copper foil, method of surface-treated copper foil manufactured by using electro-deposited copper foil

Info

Publication number
PH12015501706A1
PH12015501706A1 PH12015501706A PH12015501706A PH12015501706A1 PH 12015501706 A1 PH12015501706 A1 PH 12015501706A1 PH 12015501706 A PH12015501706 A PH 12015501706A PH 12015501706 A PH12015501706 A PH 12015501706A PH 12015501706 A1 PH12015501706 A1 PH 12015501706A1
Authority
PH
Philippines
Prior art keywords
copper foil
electro
electrolytic copper
deposited copper
deposited
Prior art date
Application number
PH12015501706A
Other versions
PH12015501706B1 (en
Inventor
Tomonaga Sakiko
Miyake Koichi
Hozumi Kazutaka
Nakahara Hiroaki
Shibata Yasuhiro
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Publication of PH12015501706A1 publication Critical patent/PH12015501706A1/en
Publication of PH12015501706B1 publication Critical patent/PH12015501706B1/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00Electroforming
    • C25D1/04Wires; Strips; Foils
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/38Electroplating: Baths therefor from solutions of copper
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • C25D7/06Wires; Strips; Foils
    • C25D7/0614Strips or foils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Cell Electrode Carriers And Collectors (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

A purpose of the present invention is to provide an electrolytic copper foil which is superior in physical properties after high-temperature heating to conventional electrolytic copper foils and which is suitable also as the negative-electrode current collector of a lithium-ion secondary battery. The electrolytic copper foil is characterized by having an original-state tensile strength of 600 MPa or higher and a tensile strength after 3500Cx1 hour heating of 470 MPa or higher. Also provided is a process for producing the electrolytic copper foil, characterized by using an electrolytic copper solution acidified with sulfuric acid, the solution containing polyethyleneimine with a molecular weight of 10,000-70,000 in a concentration of 20-100 mg/L and having a chlorine concentration of 0.5-2.5 mg/L.
PH1/2015/501706A 2013-01-31 2014-01-30 Electro-deposited copper foil, method of manufacturing electro-deposited copper foil, and surface-treated copper foil manufactured by using electro-deposited copper foil PH12015501706B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013017620 2013-01-31
PCT/JP2014/052069 WO2014119656A1 (en) 2013-01-31 2014-01-30 Electrolytic copper foil, processes for producing said electrolytic copper foil, and surface-treated copper foil obtained using said electrolytic copper foil

Publications (2)

Publication Number Publication Date
PH12015501706A1 true PH12015501706A1 (en) 2015-10-12
PH12015501706B1 PH12015501706B1 (en) 2022-09-14

Family

ID=51262367

Family Applications (1)

Application Number Title Priority Date Filing Date
PH1/2015/501706A PH12015501706B1 (en) 2013-01-31 2014-01-30 Electro-deposited copper foil, method of manufacturing electro-deposited copper foil, and surface-treated copper foil manufactured by using electro-deposited copper foil

Country Status (7)

Country Link
JP (2) JP6373764B2 (en)
KR (2) KR102227681B1 (en)
CN (1) CN104955988B (en)
MY (2) MY174169A (en)
PH (1) PH12015501706B1 (en)
TW (1) TWI518210B (en)
WO (1) WO2014119656A1 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102122425B1 (en) 2015-06-18 2020-06-12 케이씨에프테크놀로지스 주식회사 Electrolytic copper foil for lithium secondary battery and Lithium secondary battery comprising the same
KR101897474B1 (en) * 2015-06-26 2018-09-12 케이씨에프테크놀로지스 주식회사 Electrolytic copper foil for lithium secondary battery and Lithium secondary battery comprising the same
JP6067910B1 (en) * 2015-11-04 2017-01-25 古河電気工業株式会社 Electrolytic copper foil and lithium ion secondary battery using the electrolytic copper foil
JP6440656B2 (en) * 2016-07-12 2018-12-19 古河電気工業株式会社 Electrolytic copper foil
KR102646185B1 (en) * 2017-02-27 2024-03-08 에스케이넥실리스 주식회사 Copper foil having improved adhesion, electrode comprisng the same, secondary battery comprising the same and method for manufacturing the same
JP6757773B2 (en) * 2018-09-26 2020-09-23 古河電気工業株式会社 Electrolytic copper foil
JP6827022B2 (en) * 2018-10-03 2021-02-10 Jx金属株式会社 Copper foil for flexible printed circuit boards, copper-clad laminates using it, flexible printed circuit boards, and electronic devices
US10581081B1 (en) 2019-02-01 2020-03-03 Chang Chun Petrochemical Co., Ltd. Copper foil for negative electrode current collector of lithium ion secondary battery
CN111455414A (en) * 2020-03-09 2020-07-28 深圳市惟华电子科技有限公司 Additive for producing gradual change type electrolytic copper foil
KR20220043617A (en) * 2020-09-29 2022-04-05 에스케이넥실리스 주식회사 Electrolytic Copper Foil of High Strength, Electrode Comprising The Same, Secondary Battery Comprising The Same, and Method for Manufacturing The Same
CN118765232A (en) * 2022-03-29 2024-10-11 三井金属矿业株式会社 Metal foil with carrier, metal-clad laminate and printed circuit board

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001011685A (en) * 1999-06-30 2001-01-16 Mitsui Mining & Smelting Co Ltd Electrolytic copper foil and method for producing the same
KR100454270B1 (en) * 2002-11-29 2004-10-26 엘지전선 주식회사 Low Roughness Electrodeposited Copper Foil Manufacturing Method And Electrodeposited Copper Foil Thereby
KR100772946B1 (en) * 2003-04-03 2007-11-02 후쿠다 킨조쿠 하쿠훈 코교 가부시키가이샤 Electrodeposited copper foil with low roughness surface and process for producing the same
JP4273309B2 (en) 2003-05-14 2009-06-03 福田金属箔粉工業株式会社 Low rough surface electrolytic copper foil and method for producing the same
US9307639B2 (en) * 2006-04-28 2016-04-05 Mitsui Mining & Smelting Co., Ltd. Electro-deposited copper foil, surface-treated copper foil using the electro-deposited copper foil and copper clad laminate using the surface-treated copper foil, and a method for manufacturing the electro-deposited copper foil
JP5255229B2 (en) 2006-04-28 2013-08-07 三井金属鉱業株式会社 Electrolytic copper foil, surface-treated copper foil using the electrolytic copper foil, copper-clad laminate using the surface-treated copper foil, and method for producing the electrolytic copper foil
JP2008285727A (en) 2007-05-18 2008-11-27 Furukawa Circuit Foil Kk High tensile strength electrolytic copper foil and manufacturing method thereof
JP5588607B2 (en) 2007-10-31 2014-09-10 三井金属鉱業株式会社 Electrolytic copper foil and method for producing the electrolytic copper foil
WO2010004988A1 (en) * 2008-07-07 2010-01-14 古河電気工業株式会社 Electrolytic copper foil and copper-clad laminate
JP5598700B2 (en) 2010-02-25 2014-10-01 福田金属箔粉工業株式会社 Electrolytic copper foil and method for producing the same
KR101385760B1 (en) * 2010-07-01 2014-04-17 미쓰이금속광업주식회사 Electrodeposited copper foil and process for production thereof
TWI432610B (en) * 2010-11-22 2014-04-01 Mitsui Mining & Smelting Co Surface treated copper foil
WO2012091060A1 (en) 2010-12-27 2012-07-05 古河電気工業株式会社 Lithium-ion secondary battery, electrode for secondary battery, and electrolytic copper foil for secondary battery electrode
JP5771392B2 (en) 2010-12-28 2015-08-26 日本電解株式会社 Electrolytic copper foil and method for producing the same
JP5379928B2 (en) * 2011-06-30 2013-12-25 古河電気工業株式会社 Electrolytic copper foil, method for producing the electrolytic copper foil, and lithium ion secondary battery using the electrolytic copper foil as a current collector
KR102101046B1 (en) * 2012-05-22 2020-04-14 미쓰이금속광업주식회사 Copper foil, negative electrode current collector, and negative electrode material for non-aqueous secondary battery

Also Published As

Publication number Publication date
WO2014119656A1 (en) 2014-08-07
TWI518210B (en) 2016-01-21
JP6529646B2 (en) 2019-06-12
CN104955988A (en) 2015-09-30
KR102272695B1 (en) 2021-07-05
JPWO2014119656A1 (en) 2017-01-26
JP6373764B2 (en) 2018-08-15
KR20150114484A (en) 2015-10-12
KR102227681B1 (en) 2021-03-15
TW201437435A (en) 2014-10-01
MY173524A (en) 2020-01-31
PH12015501706B1 (en) 2022-09-14
CN104955988B (en) 2018-01-30
JP2018165411A (en) 2018-10-25
KR20190006075A (en) 2019-01-16
MY174169A (en) 2020-03-12

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