PH22389A - Conductive compositions that are directly solderable and flexible and that can be bonded directly to substrates - Google Patents

Conductive compositions that are directly solderable and flexible and that can be bonded directly to substrates

Info

Publication number
PH22389A
PH22389A PH32474A PH32474A PH22389A PH 22389 A PH22389 A PH 22389A PH 32474 A PH32474 A PH 32474A PH 32474 A PH32474 A PH 32474A PH 22389 A PH22389 A PH 22389A
Authority
PH
Philippines
Prior art keywords
conductive compositions
directly
substrates
flexible
solderable
Prior art date
Application number
PH32474A
Other languages
English (en)
Inventor
Martin Frank Wayne
Shahbazi Samson
Original Assignee
Electro Materials
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electro Materials filed Critical Electro Materials
Publication of PH22389A publication Critical patent/PH22389A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit

Landscapes

  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Medicinal Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
PH32474A 1984-07-18 1985-07-02 Conductive compositions that are directly solderable and flexible and that can be bonded directly to substrates PH22389A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/631,973 US4595604A (en) 1984-07-18 1984-07-18 Conductive compositions that are directly solderable and flexible and that can be bonded directly to substrates
CN85105454A CN85105454B (zh) 1984-07-18 1985-07-17 低阻值电阻组合物

Publications (1)

Publication Number Publication Date
PH22389A true PH22389A (en) 1988-08-12

Family

ID=25741880

Family Applications (1)

Application Number Title Priority Date Filing Date
PH32474A PH22389A (en) 1984-07-18 1985-07-02 Conductive compositions that are directly solderable and flexible and that can be bonded directly to substrates

Country Status (10)

Country Link
US (1) US4595604A (de)
EP (1) EP0169059B1 (de)
JP (1) JPS6143644A (de)
KR (1) KR930000776B1 (de)
CN (1) CN85105454B (de)
AT (1) ATE36918T1 (de)
CA (1) CA1254323A (de)
DE (1) DE3564742D1 (de)
PH (1) PH22389A (de)
SG (1) SG86888G (de)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4680141A (en) * 1984-11-29 1987-07-14 Mcdonnell Douglas Corporation Solder composition
US4673532A (en) * 1986-01-22 1987-06-16 Mcdonnell Douglas Corporation Rosin-free solder composition
US4732702A (en) * 1986-02-13 1988-03-22 Hitachi Chemical Company, Ltd. Electroconductive resin paste
US4740657A (en) * 1986-02-14 1988-04-26 Hitachi, Chemical Company, Ltd Anisotropic-electroconductive adhesive composition, method for connecting circuits using the same, and connected circuit structure thus obtained
US4959178A (en) * 1987-01-27 1990-09-25 Advanced Products Inc. Actinic radiation-curable conductive polymer thick film compositions and their use thereof
US4795508A (en) * 1987-02-05 1989-01-03 Shell Internationale Research Maatschappij B.V. Soldering compositions
US5089173A (en) * 1990-05-02 1992-02-18 Advanced Products Inc. Highly conductive polymer thick film compositions
US5112687A (en) * 1990-05-02 1992-05-12 Advanced Products Inc. Highly conductive polymer thick film compositions
US5141777A (en) * 1990-05-02 1992-08-25 Advanced Products, Inc. Highly conductive polymer thick film compositions
JPH07123179B2 (ja) * 1990-10-05 1995-12-25 信越ポリマー株式会社 異方導電接着剤による回路基板の接続構造
JPH0826251B2 (ja) * 1991-06-05 1996-03-13 福田金属箔粉工業株式会社 焼付型導電塗料用銀粉及びそれを用いた焼付型導電塗料
KR19990008423A (ko) * 1995-05-10 1999-01-25 데이비드 제이. 크루거 양의 온도 계수 회로 보호 디바이스 및 그 제조 방법
US5663702A (en) * 1995-06-07 1997-09-02 Littelfuse, Inc. PTC electrical device having fuse link in series and metallized ceramic electrodes
US6023403A (en) 1996-05-03 2000-02-08 Littlefuse, Inc. Surface mountable electrical device comprising a PTC and fusible element
US6282072B1 (en) 1998-02-24 2001-08-28 Littelfuse, Inc. Electrical devices having a polymer PTC array
US6582647B1 (en) 1998-10-01 2003-06-24 Littelfuse, Inc. Method for heat treating PTC devices
US6218446B1 (en) 1999-01-11 2001-04-17 Dymax Corporation Radiation curable formulation for producing electrically conductive resinous material, method of use, and article produced
US6602741B1 (en) * 1999-09-14 2003-08-05 Matsushita Electric Industrial Co., Ltd. Conductive composition precursor, conductive composition, solid electrolytic capacitor, and their manufacturing method
JP3787717B2 (ja) * 1999-12-28 2006-06-21 ニッタ株式会社 感圧導電性インク組成物
US6750301B1 (en) * 2000-07-07 2004-06-15 National Starch And Chemical Investment Holding Corporation Die attach adhesives with epoxy compound or resin having allyl or vinyl groups
US6628498B2 (en) 2000-08-28 2003-09-30 Steven J. Whitney Integrated electrostatic discharge and overcurrent device
US6824857B2 (en) 2001-04-02 2004-11-30 Nashua Corporation Circuit elements having an embedded conductive trace and methods of manufacture
US7183891B2 (en) 2002-04-08 2007-02-27 Littelfuse, Inc. Direct application voltage variable material, devices employing same and methods of manufacturing such devices
WO2003088356A1 (en) 2002-04-08 2003-10-23 Littelfuse, Inc. Voltage variable material for direct application and devices employing same
EP1383364A3 (de) * 2002-05-23 2006-01-04 Nashua Corporation Schaltungselemente mit tintenaufnehmender Beschichtung und einer Leiterbahn und Verfahren zu deren Herstellung
JP4706703B2 (ja) * 2005-04-25 2011-06-22 株式会社村田製作所 抵抗ペースト、可変抵抗器及びその製造方法
AU2010213946B2 (en) * 2009-02-16 2012-09-06 Cytec Technology Corp. Conductive surfacing films for lightning strike and electromagnetic interference shielding of thermoset composite materials
US20100315105A1 (en) * 2009-06-12 2010-12-16 Fornes Timothy D Method for shielding a substrate from electromagnetic interference
KR20150011817A (ko) * 2012-04-27 2015-02-02 다이요 잉키 세이조 가부시키가이샤 도전성 조성물
KR101633013B1 (ko) * 2012-12-31 2016-06-24 주식회사 아모그린텍 연성인쇄회로기판
CN105629027A (zh) * 2014-10-31 2016-06-01 北京精密机电控制设备研究所 一种高可靠高耐磨导电塑料电位计

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3412043A (en) * 1966-08-05 1968-11-19 Dexter Corp Electrically conductive resinous compositions
JPS57185316A (en) * 1981-05-11 1982-11-15 Sumitomo Metal Mining Co Ltd Electrically conductive resin paste
US4371459A (en) * 1981-12-17 1983-02-01 E. I. Du Pont De Nemours And Company Flexible screen-printable conductor composition
US4535012A (en) * 1983-09-30 1985-08-13 Electro Materials Corp. Of America Fast curing solderable conductor
US4564563A (en) * 1983-09-30 1986-01-14 Electro Materials Corp. Of America Solderable conductor

Also Published As

Publication number Publication date
CN85105454B (zh) 1988-06-22
CN85105454A (zh) 1987-01-28
EP0169059B1 (de) 1988-08-31
EP0169059A3 (en) 1986-08-20
DE3564742D1 (en) 1988-10-06
EP0169059A2 (de) 1986-01-22
KR860001362A (ko) 1986-02-26
JPS6143644A (ja) 1986-03-03
CA1254323A (en) 1989-05-16
US4595604A (en) 1986-06-17
ATE36918T1 (de) 1988-09-15
SG86888G (en) 1989-06-16
KR930000776B1 (ko) 1993-02-04

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