PH23902A - Polymer compositions containing a dissolved dibenzalacetone palladium complex - Google Patents

Polymer compositions containing a dissolved dibenzalacetone palladium complex

Info

Publication number
PH23902A
PH23902A PH34785A PH34785A PH23902A PH 23902 A PH23902 A PH 23902A PH 34785 A PH34785 A PH 34785A PH 34785 A PH34785 A PH 34785A PH 23902 A PH23902 A PH 23902A
Authority
PH
Philippines
Prior art keywords
dibenzalacetone
dissolved
compositions containing
polymer compositions
palladium complex
Prior art date
Application number
PH34785A
Other languages
English (en)
Inventor
Bernd Tieke
Sheik Abdul-Cader Zahir
Original Assignee
Ciba Geigy Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ciba Geigy Ag filed Critical Ciba Geigy Ag
Publication of PH23902A publication Critical patent/PH23902A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/145—Infrared

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
  • Chemically Coating (AREA)
  • Conductive Materials (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Manufacturing Of Printed Wiring (AREA)
PH34785A 1986-01-30 1987-01-29 Polymer compositions containing a dissolved dibenzalacetone palladium complex PH23902A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH34886 1986-01-30

Publications (1)

Publication Number Publication Date
PH23902A true PH23902A (en) 1989-12-18

Family

ID=4184967

Family Applications (1)

Application Number Title Priority Date Filing Date
PH34785A PH23902A (en) 1986-01-30 1987-01-29 Polymer compositions containing a dissolved dibenzalacetone palladium complex

Country Status (5)

Country Link
US (1) US5045436A (ja)
EP (1) EP0233145B1 (ja)
JP (1) JPS62192584A (ja)
DE (1) DE3760813D1 (ja)
PH (1) PH23902A (ja)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5389496A (en) * 1987-03-06 1995-02-14 Rohm And Haas Company Processes and compositions for electroless metallization
US5030742A (en) * 1988-12-16 1991-07-09 Ciba-Geigy Corporation Ultrathin layers of palladium(O) complexes
US5082734A (en) * 1989-12-21 1992-01-21 Monsanto Company Catalytic, water-soluble polymeric films for metal coatings
ATE172755T1 (de) * 1989-12-21 1998-11-15 Amesbury Group Inc Katalytischer wasserlöslicher polymerer film für metallbeschichtungen
US5506091A (en) * 1990-04-20 1996-04-09 Nisshinbo Industries, Inc. Photosensitive resin composition and method of forming conductive pattern
US5310580A (en) * 1992-04-27 1994-05-10 International Business Machines Corporation Electroless metal adhesion to organic dielectric material with phase separated morphology
US5419954A (en) * 1993-02-04 1995-05-30 The Alpha Corporation Composition including a catalytic metal-polymer complex and a method of manufacturing a laminate preform or a laminate which is catalytically effective for subsequent electroless metallization thereof
US6141870A (en) 1997-08-04 2000-11-07 Peter K. Trzyna Method for making electrical device
KR20030076579A (ko) * 2001-01-24 2003-09-26 토레이 엔지니어링 컴퍼니, 리미티드 폴리이미드 수지 전구체 용액, 그 용액을 이용한전자부품용 기재, 및 그 기재의 제조방법
CN100371076C (zh) * 2002-09-13 2008-02-27 和光纯药工业株式会社 钯催化剂组合物
US8435603B2 (en) 2003-12-05 2013-05-07 Conductive Inkjet Technology Limited Formation of solid layers on substrates
WO2005056875A2 (en) * 2003-12-05 2005-06-23 Conductive Inkjet Technology Limited Formation of solid layers on substrates
DE102005015455B4 (de) 2005-04-04 2021-03-18 Infineon Technologies Ag Kunststoffgehäuse und Halbleiterbauteil mit derartigem Kunststoffgehäuse sowie ein Verfahren zur Herstellung eines Kunststoffgehäuses
DE102005015454B4 (de) * 2005-04-04 2010-02-18 Infineon Technologies Ag Halbleitersensorbauteil mit Hohlraumgehäuse und Sensorchip sowie Verfahren zur Herstellung desselben
DE102005037321B4 (de) * 2005-08-04 2013-08-01 Infineon Technologies Ag Verfahren zur Herstellung von Halbleiterbauteilen mit Leiterbahnen zwischen Halbleiterchips und einem Schaltungsträger
US8436197B2 (en) * 2007-10-25 2013-05-07 West Chester University Of Pennsylvania Of The State System Of Higher Education Palladium complexes and polymerization and coupling processes thereof
WO2020122819A1 (en) * 2018-12-14 2020-06-18 Nanyang Technological University Metallization of three-dimensional printed structures

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3900320A (en) * 1971-09-30 1975-08-19 Bell & Howell Co Activation method for electroless plating
US3950570A (en) * 1974-05-02 1976-04-13 Western Electric Company, Inc. Method of depositing a metal on a surface
DE2451217C2 (de) * 1974-10-29 1982-12-23 Basf Ag, 6700 Ludwigshafen Aktivierung von Substraten für die stromlose Metallisierung
DE2451276C2 (de) * 1974-10-29 1982-12-30 Basf Ag, 6700 Ludwigshafen Verfahren zur Herstellung starrer magnetischer Aufzeichnungsträger
GB2085874B (en) * 1980-09-04 1984-08-08 Johnson Matthey Plc Hydroformylation of olefins
DD157989A3 (de) * 1980-10-10 1982-12-22 Lothar Gierth Verfahren zur strukturierten chemisch-reduktiven metallabscheidung
US4347232A (en) * 1981-06-17 1982-08-31 Fmc Corporation Preparation of hydrogen peroxide from its elements
DE3148280A1 (de) * 1981-12-05 1983-06-09 Bayer Ag, 5090 Leverkusen Verfahren zur aktivierung von substratoberflaechen fuer die stromlose metallisierung
US4604303A (en) * 1983-05-11 1986-08-05 Nissan Chemical Industries, Ltd. Polymer composition containing an organic metal complex and method for producing a metallized polymer from the polymer composition
DE3326508A1 (de) * 1983-07-22 1985-02-07 Bayer Ag, 5090 Leverkusen Verfahren zum aktivieren von substratoberflaechen fuer die direkte partielle metallisierung von traegermaterialien
US4469714A (en) * 1983-09-02 1984-09-04 Okuno Chemical Industry Co., Ltd. Composition for bonding electroconductive metal coating to electrically nonconductive material
US4574095A (en) * 1984-11-19 1986-03-04 International Business Machines Corporation Selective deposition of copper

Also Published As

Publication number Publication date
JPS62192584A (ja) 1987-08-24
EP0233145B1 (de) 1989-10-18
DE3760813D1 (en) 1989-11-23
EP0233145A1 (de) 1987-08-19
US5045436A (en) 1991-09-03

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