PH30641A - Opto-electronic coupler having improved moisture protective housing - Google Patents

Opto-electronic coupler having improved moisture protective housing

Info

Publication number
PH30641A
PH30641A PH44363A PH44363A PH30641A PH 30641 A PH30641 A PH 30641A PH 44363 A PH44363 A PH 44363A PH 44363 A PH44363 A PH 44363A PH 30641 A PH30641 A PH 30641A
Authority
PH
Philippines
Prior art keywords
opto
protective housing
improved moisture
moisture protective
electronic coupler
Prior art date
Application number
PH44363A
Other languages
English (en)
Inventor
Jacob Wijdenes
Antonius L M Gieben
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Publication of PH30641A publication Critical patent/PH30641A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F55/00—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto
    • H10F55/20—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers
    • H10F55/25—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers wherein the radiation-sensitive devices and the electric light source are all semiconductor devices
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4295—Coupling light guides with opto-electronic elements coupling with semiconductor devices activated by light through the light guide, e.g. thyristors, phototransistors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
  • Light Receiving Elements (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
PH44363A 1991-05-17 1992-05-18 Opto-electronic coupler having improved moisture protective housing PH30641A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP91201193 1991-05-17

Publications (1)

Publication Number Publication Date
PH30641A true PH30641A (en) 1997-09-16

Family

ID=8207657

Family Applications (1)

Application Number Title Priority Date Filing Date
PH44363A PH30641A (en) 1991-05-17 1992-05-18 Opto-electronic coupler having improved moisture protective housing

Country Status (5)

Country Link
US (1) US5329131A (fr)
EP (1) EP0513908B1 (fr)
JP (1) JP3152500B2 (fr)
DE (1) DE69201161T2 (fr)
PH (1) PH30641A (fr)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4327133B4 (de) * 1993-08-12 2006-07-13 Vishay Europe Gmbh Verfahren zum Aufbringen eines optischen Koppelmediums
JPH07333055A (ja) * 1994-06-03 1995-12-22 Matsushita Electric Ind Co Ltd 光検出器
US5489800A (en) * 1994-08-31 1996-02-06 Motorola, Inc. Dual channel small outline optocoupler package and method thereof
US5614131A (en) * 1995-05-01 1997-03-25 Motorola, Inc. Method of making an optoelectronic device
EP0851414A3 (fr) * 1996-12-26 2000-09-27 Sanyo Electric Co. Ltd Tête de lecture optique et lecteur de supports d'enregistrement
US5828074A (en) * 1997-05-19 1998-10-27 Mini-Systems, Inc. Optoisolator comprising walls having photosensitive inner surfaces
US6943378B2 (en) * 2003-08-14 2005-09-13 Agilent Technologies, Inc. Opto-coupler
US7808004B2 (en) * 2006-03-17 2010-10-05 Edison Opto Corporation Light emitting diode package structure and method of manufacturing the same
US8412006B2 (en) * 2010-03-23 2013-04-02 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Optocoupler
US8571360B2 (en) * 2010-03-23 2013-10-29 Avago Technologies General Ip (Singapore) Pte. Ltd. Optocoupler with light guide defining element
US8577190B2 (en) * 2010-03-23 2013-11-05 Avago Technologies General Ip (Singapore) Pte. Ltd. Optocoupler
CN102736189A (zh) * 2011-04-01 2012-10-17 亿广科技(上海)有限公司 光耦合器
TW201334240A (zh) * 2012-02-08 2013-08-16 隆達電子股份有限公司 半導體發光元件之封裝結構
JP2013179226A (ja) * 2012-02-29 2013-09-09 Toshiba Corp 光結合装置
US20140119691A1 (en) * 2012-10-29 2014-05-01 Avago Technologies General Ip (Singapore) Pte. Ltd. Opto-coupler with light guide
JP6445947B2 (ja) * 2015-09-04 2018-12-26 株式会社東芝 光結合装置
TWI680321B (zh) * 2018-12-24 2019-12-21 兆龍國際股份有限公司 光耦合器
US20220157681A1 (en) * 2020-11-17 2022-05-19 Stmicroelectronics Sdn Bhd Integrated circuit package with v-shaped notch creepage structure

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4179619A (en) * 1977-12-02 1979-12-18 General Electric Company Optocoupler having internal reflection and improved isolation capabilities
DE2806167C2 (de) * 1978-02-14 1986-05-15 Siemens AG, 1000 Berlin und 8000 München Hochspannungsfester Optokoppler
US4645551A (en) * 1984-08-31 1987-02-24 Motorola, Inc. Method of making an octocoupler
JPS6195581A (ja) * 1984-10-16 1986-05-14 Toshiba Corp 光結合素子
JPS61228681A (ja) * 1985-04-01 1986-10-11 Sharp Corp 光結合半導体装置
US4694183A (en) * 1985-06-25 1987-09-15 Hewlett-Packard Company Optical isolator fabricated upon a lead frame
US5148243A (en) * 1985-06-25 1992-09-15 Hewlett-Packard Company Optical isolator with encapsulation
DE3633251A1 (de) * 1986-09-30 1988-03-31 Siemens Ag Optoelektronisches koppelelement
DE3633181C2 (de) * 1986-09-30 1998-12-10 Siemens Ag Reflexlichtschranke
US4980568A (en) * 1989-05-22 1990-12-25 Hewlett-Packard Company Optical isolator having high voltage isolation and high light flux light guide

Also Published As

Publication number Publication date
DE69201161D1 (de) 1995-02-23
US5329131A (en) 1994-07-12
JPH05145111A (ja) 1993-06-11
EP0513908B1 (fr) 1995-01-11
DE69201161T2 (de) 1995-08-24
EP0513908A3 (en) 1993-03-17
JP3152500B2 (ja) 2001-04-03
EP0513908A2 (fr) 1992-11-19

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