PL1799876T3 - Płaski blok końcowy do podtrzymywania obrotowego targetu do napylania - Google Patents

Płaski blok końcowy do podtrzymywania obrotowego targetu do napylania

Info

Publication number
PL1799876T3
PL1799876T3 PL05857644T PL05857644T PL1799876T3 PL 1799876 T3 PL1799876 T3 PL 1799876T3 PL 05857644 T PL05857644 T PL 05857644T PL 05857644 T PL05857644 T PL 05857644T PL 1799876 T3 PL1799876 T3 PL 1799876T3
Authority
PL
Poland
Prior art keywords
block
coolant
target
carrying
axial length
Prior art date
Application number
PL05857644T
Other languages
English (en)
Inventor
Krist Dellaert
Bosscher Wilmert De
Boever Joannes De
Gregory Lapeire
Original Assignee
Bekaert Advanced Coatings
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=35809667&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=PL1799876(T3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Bekaert Advanced Coatings filed Critical Bekaert Advanced Coatings
Publication of PL1799876T3 publication Critical patent/PL1799876T3/pl

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3435—Target holders (includes backing plates and endblocks)

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Physical Vapour Deposition (AREA)
  • Motor Or Generator Frames (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Nozzles (AREA)
PL05857644T 2004-10-18 2005-10-11 Płaski blok końcowy do podtrzymywania obrotowego targetu do napylania PL1799876T3 (pl)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
EP04105116 2004-10-18
EP05101905 2005-03-11
PCT/EP2005/055143 WO2006097152A1 (en) 2004-10-18 2005-10-11 Flat end-block for carrying a rotatable sputtering target
EP05857644A EP1799876B1 (en) 2004-10-18 2005-10-11 Flat end-block for carrying a rotatable sputtering target

Publications (1)

Publication Number Publication Date
PL1799876T3 true PL1799876T3 (pl) 2009-07-31

Family

ID=35809667

Family Applications (1)

Application Number Title Priority Date Filing Date
PL05857644T PL1799876T3 (pl) 2004-10-18 2005-10-11 Płaski blok końcowy do podtrzymywania obrotowego targetu do napylania

Country Status (12)

Country Link
US (1) US8562799B2 (pl)
EP (1) EP1799876B1 (pl)
JP (2) JP5582681B2 (pl)
KR (1) KR101358820B1 (pl)
AT (1) ATE423225T1 (pl)
DE (1) DE602005012850D1 (pl)
DK (1) DK1799876T3 (pl)
ES (1) ES2320366T3 (pl)
PL (1) PL1799876T3 (pl)
PT (1) PT1799876E (pl)
SI (1) SI1799876T1 (pl)
WO (1) WO2006097152A1 (pl)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SI1856303T1 (sl) * 2005-03-11 2009-06-30 Bekaert Advanced Coatings Enojni, pravokotni končni blok
US20120031755A1 (en) * 2006-11-24 2012-02-09 Guo George X Deposition system capable of processing multiple roll-fed substrates
US20080127887A1 (en) * 2006-12-01 2008-06-05 Applied Materials, Inc. Vertically mounted rotary cathodes in sputtering system on elevated rails
DE102008033904B4 (de) * 2008-07-18 2012-01-19 Von Ardenne Anlagentechnik Gmbh Antriebsendblock für eine Magnetronanordnung mit einem rotierenden Target
US8182662B2 (en) * 2009-03-27 2012-05-22 Sputtering Components, Inc. Rotary cathode for magnetron sputtering apparatus
US20120097526A1 (en) * 2009-04-03 2012-04-26 Madocks John E Rotary magnetron
JP5497572B2 (ja) * 2009-08-18 2014-05-21 キヤノンアネルバ株式会社 スパッタリング装置及び真空処理装置
DE102009056241B4 (de) * 2009-12-01 2012-07-12 Von Ardenne Anlagentechnik Gmbh Stützeinrichtung für eine Magnetronanordnung mit einem rotierenden Target
KR101155906B1 (ko) 2009-12-11 2012-06-20 삼성모바일디스플레이주식회사 스퍼터링 장치
EP2371992B1 (en) * 2010-04-01 2013-06-05 Applied Materials, Inc. End-block and sputtering installation
EP2709138B1 (en) * 2010-05-11 2016-11-30 Applied Materials, Inc. Chamber for physical vapor deposition
JP2014523969A (ja) 2011-06-27 2014-09-18 ソレラス・リミテッド スパッタリングターゲット
BE1020564A5 (nl) * 2013-04-04 2013-12-03 Soleras Advanced Coatings Bvba Spindel voor magnetron sputter inrichting.
US9809876B2 (en) 2014-01-13 2017-11-07 Centre Luxembourgeois De Recherches Pour Le Verre Et La Ceramique (C.R.V.C.) Sarl Endblock for rotatable target with electrical connection between collector and rotor at pressure less than atmospheric pressure
WO2016033475A1 (en) 2014-08-29 2016-03-03 Sputtering Components, Inc. Dual power feed rotary sputtering cathode
CN104640339A (zh) * 2015-01-12 2015-05-20 广东韦达尔科技有限公司 一种等离子表面处理装置
BE1024754B9 (nl) * 2016-11-29 2018-07-24 Soleras Advanced Coatings Bvba Een universeel monteerbaar eindblok
JP2018131644A (ja) * 2017-02-13 2018-08-23 株式会社アルバック スパッタリング装置用の回転式カソードユニット
CN113366605B (zh) * 2019-02-05 2024-02-20 应用材料公司 沉积设备和用于监测沉积设备的方法
KR102857349B1 (ko) 2019-12-23 2025-09-09 주식회사 선익시스템 스퍼터용 회전형 타겟장치 및 상기 타겟장치를 구비한 스퍼터장치
KR102802960B1 (ko) * 2020-09-16 2025-05-07 가부시키가이샤 알박 회전식 캐소드 유닛용 구동 블록
US12173782B2 (en) 2022-12-19 2024-12-24 Dana Italia S.R.L Gear box with multilayer sealing arrangement
CN116397207B (zh) * 2023-04-17 2024-12-13 沈阳乐贝真空技术有限公司 一种双开门柔性多功能真空镀膜设备

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3878085A (en) * 1973-07-05 1975-04-15 Sloan Technology Corp Cathode sputtering apparatus
US4356073A (en) * 1981-02-12 1982-10-26 Shatterproof Glass Corporation Magnetron cathode sputtering apparatus
US4422916A (en) * 1981-02-12 1983-12-27 Shatterproof Glass Corporation Magnetron cathode sputtering apparatus
US4445997A (en) * 1983-08-17 1984-05-01 Shatterproof Glass Corporation Rotatable sputtering apparatus
US4443318A (en) * 1983-08-17 1984-04-17 Shatterproof Glass Corporation Cathodic sputtering apparatus
US4519885A (en) * 1983-12-27 1985-05-28 Shatterproof Glass Corp. Method and apparatus for changing sputtering targets in a magnetron sputtering system
US4575102A (en) * 1984-11-20 1986-03-11 Ferrofluidics Corporation Coaxial, multiple-shaft ferrofluid seal apparatus
US4995958A (en) * 1989-05-22 1991-02-26 Varian Associates, Inc. Sputtering apparatus with a rotating magnet array having a geometry for specified target erosion profile
US5096562A (en) * 1989-11-08 1992-03-17 The Boc Group, Inc. Rotating cylindrical magnetron structure for large area coating
JP3516949B2 (ja) * 1990-08-10 2004-04-05 バイラテック・シン・フィルムズ・インコーポレイテッド 回転マグネトロンスパッタリングシステムにおけるアーク抑制のためのシールディング
US5200049A (en) * 1990-08-10 1993-04-06 Viratec Thin Films, Inc. Cantilever mount for rotating cylindrical magnetrons
US5100527A (en) * 1990-10-18 1992-03-31 Viratec Thin Films, Inc. Rotating magnetron incorporating a removable cathode
US5620577A (en) * 1993-12-30 1997-04-15 Viratec Thin Films, Inc. Spring-loaded mount for a rotatable sputtering cathode
US5445721A (en) * 1994-08-25 1995-08-29 The Boc Group, Inc. Rotatable magnetron including a replacement target structure
US5591314A (en) * 1995-10-27 1997-01-07 Morgan; Steven V. Apparatus for affixing a rotating cylindrical magnetron target to a spindle
JP3810132B2 (ja) * 1996-05-23 2006-08-16 株式会社ライク スパッタリング装置
EP0918351A1 (en) * 1997-11-19 1999-05-26 Sinvaco N.V. Improved planar magnetron with moving magnet assembly
EP0969238A1 (en) 1998-06-29 2000-01-05 Sinvaco N.V. Vacuum tight coupling for tube sections
JP2002529600A (ja) * 1998-11-06 2002-09-10 シヴァク 高レート・コーティング用のスパッタリング装置および方法
US6488824B1 (en) * 1998-11-06 2002-12-03 Raycom Technologies, Inc. Sputtering apparatus and process for high rate coatings
US6263542B1 (en) * 1999-06-22 2001-07-24 Lam Research Corporation Tolerance resistant and vacuum compliant door hinge with open-assist feature
DE19958666C2 (de) 1999-12-06 2003-10-30 Heraeus Gmbh W C Vorrichtung zur lösbaren Verbindung eines zylinderrohrförmigen Targetteiles mit einem Aufnahmeteil
AU2002230639A1 (en) 2000-11-09 2002-05-21 Viratec Thin Films, Inc. Alternating current rotatable sputter cathode
US6375815B1 (en) * 2001-02-17 2002-04-23 David Mark Lynn Cylindrical magnetron target and apparatus for affixing the target to a rotatable spindle assembly
US6736948B2 (en) * 2002-01-18 2004-05-18 Von Ardenne Anlagentechnik Gmbh Cylindrical AC/DC magnetron with compliant drive system and improved electrical and thermal isolation
US20030173217A1 (en) * 2002-03-14 2003-09-18 Sputtering Components, Inc. High-power ion sputtering magnetron
DE10213049A1 (de) * 2002-03-22 2003-10-02 Dieter Wurczinger Drehbare Rohrkatode
WO2004085902A1 (en) 2003-03-25 2004-10-07 Bekaert Advanced Coatings Universal vacuum coupling for cylindrical target
WO2005005682A1 (en) 2003-07-04 2005-01-20 Bekaert Advanced Coatings Rotating tubular sputter target assembly
SI1856303T1 (sl) * 2005-03-11 2009-06-30 Bekaert Advanced Coatings Enojni, pravokotni končni blok

Also Published As

Publication number Publication date
DE602005012850D1 (de) 2009-04-02
EP1799876B1 (en) 2009-02-18
JP2014194086A (ja) 2014-10-09
EP1799876A1 (en) 2007-06-27
ATE423225T1 (de) 2009-03-15
SI1799876T1 (sl) 2009-06-30
US20080105543A1 (en) 2008-05-08
JP5582681B2 (ja) 2014-09-03
WO2006097152A1 (en) 2006-09-21
KR20070067139A (ko) 2007-06-27
JP2008517150A (ja) 2008-05-22
JP6034830B2 (ja) 2016-11-30
US8562799B2 (en) 2013-10-22
PT1799876E (pt) 2009-03-30
DK1799876T3 (da) 2009-04-20
ES2320366T3 (es) 2009-05-21
KR101358820B1 (ko) 2014-02-10

Similar Documents

Publication Publication Date Title
SI1799876T1 (sl) Plosk končni blok zasučne tarče za napraševanje
DE602004020227D1 (de) Rotierende rohrförmige sputtertargetanorndung
US9349576B2 (en) Magnetron for cylindrical targets
US20030173217A1 (en) High-power ion sputtering magnetron
JP2006210726A5 (pl)
JP5265811B2 (ja) スパッタ成膜装置
SG169230A1 (en) Sputtering target, sintered body, conductive film formed by using them, organic el device, and substrate used for the organic el device
WO2007051105A3 (en) Cathode incorporating fixed or rotating target in combination with a moving magnet assembly and applications thereof
GB201300607D0 (en) In-Vacuum rotational device
TW200606995A (en) A magnetron sputtering device, a cylindrical cathode and a method of coating thin multicomponent films on a substrate
JP2005298965A (ja) 高電力スパッタリングのための電力結合器
MX2009000449A (es) Aparato y metodo de recubrimiento.
EP1858044A3 (en) Switchgear
CN211689222U (zh) 滚筒式磁控溅射镀膜机
AU2002220482A1 (en) Apparatus for evaporation of materials for coating of objects
TWI523965B (zh) 濺鍍設備及濺鍍方法
TW200643205A (en) Flat end-block for carrying a rotatable sputtering target
CN110885966A (zh) 滚筒式磁控溅射镀膜机
TWI365914B (en) Phase change recording film having high electrical resistance and sputtering target for forming phase change recording film
WO2015105711A1 (en) Endblock for rotatable target with electrical connection between collector and rotor at pressure less than atmospheric pressure
Strümpfel et al. Low ohm large area ITO coating by reactive magnetron sputtering in DC and MF mode
Zheng et al. Surface and interface analysis of tris-(8-hydroxyquinoline) aluminum and indium–tin-oxide using atomic force microscopy (AFM) and X-ray photoelectron spectroscopy (XPS)
CN206157215U (zh) 新型旋转阴极
TWI349716B (en) Sliding anode magnetron sputtering source
JP4646066B2 (ja) 真空処理装置