PL1951800T3 - Układ żywicy epoksydowej odporny na wpływy atmosferyczne - Google Patents
Układ żywicy epoksydowej odporny na wpływy atmosferyczneInfo
- Publication number
- PL1951800T3 PL1951800T3 PL06807584T PL06807584T PL1951800T3 PL 1951800 T3 PL1951800 T3 PL 1951800T3 PL 06807584 T PL06807584 T PL 06807584T PL 06807584 T PL06807584 T PL 06807584T PL 1951800 T3 PL1951800 T3 PL 1951800T3
- Authority
- PL
- Poland
- Prior art keywords
- alkyl
- epoxy resin
- weather
- resin system
- absorber
- Prior art date
Links
- 239000003822 epoxy resin Substances 0.000 title abstract 3
- 229920000647 polyepoxide Polymers 0.000 title abstract 3
- 125000004169 (C1-C6) alkyl group Chemical group 0.000 abstract 3
- 125000004191 (C1-C6) alkoxy group Chemical group 0.000 abstract 2
- 239000006096 absorbing agent Substances 0.000 abstract 2
- 125000000217 alkyl group Chemical group 0.000 abstract 2
- 239000003963 antioxidant agent Substances 0.000 abstract 2
- 230000003078 antioxidant effect Effects 0.000 abstract 2
- 125000000753 cycloalkyl group Chemical group 0.000 abstract 2
- 150000008065 acid anhydrides Chemical class 0.000 abstract 1
- 125000001931 aliphatic group Chemical group 0.000 abstract 1
- 125000003118 aryl group Chemical group 0.000 abstract 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 abstract 1
- 239000012964 benzotriazole Substances 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 239000012772 electrical insulation material Substances 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
- C08K5/3432—Six-membered rings
- C08K5/3435—Piperidines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/005—Stabilisers against oxidation, heat, light, ozone
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Organic Insulating Materials (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
- Diaphragms For Electromechanical Transducers (AREA)
- Preparation Of Compounds By Using Micro-Organisms (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP05111098 | 2005-11-22 | ||
| PCT/EP2006/067828 WO2007060077A1 (en) | 2005-11-22 | 2006-10-26 | Weather-resistant epoxy resin system |
| EP20060807584 EP1951800B1 (en) | 2005-11-22 | 2006-10-26 | Weather-resistant epoxy resin system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PL1951800T3 true PL1951800T3 (pl) | 2009-09-30 |
Family
ID=35453586
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL06807584T PL1951800T3 (pl) | 2005-11-22 | 2006-10-26 | Układ żywicy epoksydowej odporny na wpływy atmosferyczne |
Country Status (12)
| Country | Link |
|---|---|
| US (1) | US8436079B2 (pl) |
| EP (1) | EP1951800B1 (pl) |
| JP (1) | JP5226526B2 (pl) |
| CN (1) | CN101313024B (pl) |
| AT (1) | ATE428749T1 (pl) |
| AU (1) | AU2006316667B2 (pl) |
| BR (1) | BRPI0618438B1 (pl) |
| DE (1) | DE602006006338D1 (pl) |
| PL (1) | PL1951800T3 (pl) |
| TW (1) | TWI412557B (pl) |
| WO (1) | WO2007060077A1 (pl) |
| ZA (1) | ZA200803382B (pl) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5540485B2 (ja) * | 2007-10-09 | 2014-07-02 | 日立化成株式会社 | 封止用エポキシ樹脂組成物及び電子部品装置 |
| JP2009275080A (ja) * | 2008-05-13 | 2009-11-26 | Konica Minolta Ij Technologies Inc | 活性エネルギー線硬化性組成物及びインクジェット用インク |
| US20120208924A1 (en) * | 2009-07-14 | 2012-08-16 | Abb Research Ltd | Epoxy resin composition |
| TWI422638B (zh) * | 2009-08-25 | 2014-01-11 | 臺灣永光化學工業股份有限公司 | 含矽樹脂封裝組成物 |
| WO2011047929A1 (en) * | 2009-10-21 | 2011-04-28 | Huntsman Advanced Materials (Switzerland) Gmbh | Thermosetting composition |
| WO2012036291A1 (ja) * | 2010-09-16 | 2012-03-22 | 積水化学工業株式会社 | 調光シート、調光体、合わせガラス用中間膜及び合わせガラス |
| EP2439240A1 (en) * | 2010-10-06 | 2012-04-11 | Henkel AG & Co. KGaA | Radiation curable composition |
| EP2854260A1 (de) * | 2013-09-27 | 2015-04-01 | Siemens Aktiengesellschaft | Nutverschlussmasse, Nutverschluss und Verfahren zum Herstellen eines Nutverschlusses |
| EP2874280A1 (de) | 2013-11-14 | 2015-05-20 | Siemens Aktiengesellschaft | Nutverschlussmasse, Nutverschluss und Verfahren zum Herstellen eines Nutverschlusses |
| US20180171101A1 (en) * | 2015-06-16 | 2018-06-21 | Huntsman International Llc | Epoxy Resin Composition |
| DE102016203867A1 (de) * | 2016-03-09 | 2017-09-14 | Siemens Aktiengesellschaft | Fester Isolationswerkstoff, Verwendung dazu und damit hergestelltes Isolationssystem |
| US10959344B2 (en) | 2017-10-06 | 2021-03-23 | Trench Limited | Outdoor electrical apparatus having an outer housing arranged to selectively encase a main encapsulant |
| US12448480B2 (en) * | 2020-05-21 | 2025-10-21 | Daicel Corporation | Curable epoxy composition for rotary electric machine |
| CN119391139A (zh) * | 2024-12-19 | 2025-02-07 | 常熟裕博高分子材料有限公司 | 一种低黄变耐紫外线环氧树脂组合物及其制备方法 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1467672A (en) * | 1974-04-11 | 1977-03-16 | Ciba Geigy Ag | Stabilised epoxy resin |
| DE3016097A1 (de) * | 1980-04-25 | 1981-10-29 | Siemens AG, 1000 Berlin und 8000 München | Schnellhaertende epoxidharzmassen |
| DE3167225D1 (en) * | 1980-11-17 | 1984-12-20 | Ciba Geigy Ag | Stabilisers against photo degradation |
| DE3242711A1 (de) * | 1982-11-19 | 1984-05-24 | Bayer Ag, 5090 Leverkusen | Mischungen spezieller cycloaliphatischer 1,2-diepoxide und ihre verwendung |
| US5026751A (en) | 1986-03-17 | 1991-06-25 | General Electric Company | UV light stabilizer composition comprising cyclic aliphatic epoxy UV screener, and polyalkyldipiperidine (HALS) compounds |
| US5124378A (en) * | 1987-09-21 | 1992-06-23 | Ciba-Geigy Corporation | Stabilization of ambient cured coatings |
| JPH0668016B2 (ja) * | 1988-04-26 | 1994-08-31 | 三洋化成工業株式会社 | エポキシ樹脂組成物 |
| KR0169709B1 (ko) * | 1988-12-13 | 1999-03-20 | 하쯔도리 마사미쯔 | 에폭시 수지용 경화제 조성물 및 에폭시 수지 조성물 |
| JPH02170820A (ja) * | 1988-12-23 | 1990-07-02 | Yokohama Rubber Co Ltd:The | エポキシ樹脂組成物 |
| TW289044B (pl) * | 1994-08-02 | 1996-10-21 | Ciba Geigy Ag | |
| JP3065246B2 (ja) * | 1995-03-10 | 2000-07-17 | 富士化学工業株式会社 | ハロゲン含有樹脂用安定剤、その製造法及びハロゲン含有樹脂組成物 |
| DE50014006D1 (de) * | 1999-03-16 | 2007-03-15 | Huntsman Adv Mat Switzerland | Härtbare zusammensetzung mit besonderer eigenschaftskombination |
| DE10027206A1 (de) * | 2000-05-31 | 2001-12-13 | Osram Opto Semiconductors Gmbh | Alterungsstabile Epoxidharzsysteme, daraus hergestellte Formstoffe und Bauelemente und deren Verwendung |
| JP3981239B2 (ja) * | 2000-12-01 | 2007-09-26 | 関西ペイント株式会社 | 一回塗装仕上げ用防食塗料組成物 |
| JP2005502737A (ja) * | 2001-06-21 | 2005-01-27 | 株式会社カネカ | 速硬化性組成物 |
| WO2004035558A1 (ja) * | 2002-09-05 | 2004-04-29 | Daicel Chemical Industries, Ltd. | 脂環式ジエポキシ化合物の製造方法、硬化性エポキシ樹脂組成物、電子部品封止用エポキシ樹脂組成物、電気絶縁油用安定剤、および電気絶縁用注型エポキシ樹脂組成物 |
| JP2004315744A (ja) * | 2003-04-18 | 2004-11-11 | Omron Corp | 硬化物の耐光性に優れた硬化型樹脂組成物 |
-
2006
- 2006-10-26 EP EP20060807584 patent/EP1951800B1/en active Active
- 2006-10-26 PL PL06807584T patent/PL1951800T3/pl unknown
- 2006-10-26 CN CN2006800434911A patent/CN101313024B/zh active Active
- 2006-10-26 JP JP2008540559A patent/JP5226526B2/ja active Active
- 2006-10-26 BR BRPI0618438-3A patent/BRPI0618438B1/pt active IP Right Grant
- 2006-10-26 AT AT06807584T patent/ATE428749T1/de active
- 2006-10-26 US US12/094,422 patent/US8436079B2/en active Active
- 2006-10-26 DE DE200660006338 patent/DE602006006338D1/de active Active
- 2006-10-26 WO PCT/EP2006/067828 patent/WO2007060077A1/en not_active Ceased
- 2006-10-26 AU AU2006316667A patent/AU2006316667B2/en active Active
- 2006-11-21 TW TW95143048A patent/TWI412557B/zh active
-
2008
- 2008-04-16 ZA ZA200803382A patent/ZA200803382B/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JP2009516759A (ja) | 2009-04-23 |
| JP5226526B2 (ja) | 2013-07-03 |
| EP1951800A1 (en) | 2008-08-06 |
| EP1951800B1 (en) | 2009-04-15 |
| US20090023843A1 (en) | 2009-01-22 |
| TWI412557B (zh) | 2013-10-21 |
| ATE428749T1 (de) | 2009-05-15 |
| AU2006316667A1 (en) | 2007-05-31 |
| DE602006006338D1 (de) | 2009-05-28 |
| ZA200803382B (en) | 2009-01-28 |
| CN101313024A (zh) | 2008-11-26 |
| TW200730577A (en) | 2007-08-16 |
| BRPI0618438B1 (pt) | 2018-03-13 |
| WO2007060077A1 (en) | 2007-05-31 |
| CN101313024B (zh) | 2012-10-10 |
| AU2006316667B2 (en) | 2012-08-02 |
| BRPI0618438A2 (pt) | 2016-08-30 |
| US8436079B2 (en) | 2013-05-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| ZA200803382B (en) | Weather-resistant epoxy resin system | |
| WO2009041389A1 (ja) | エポキシ樹脂組成物、その硬化物及び発光ダイオード | |
| CN101781536B (zh) | 一种热固型丙烯酸酯结构胶及制备方法 | |
| WO2009037862A1 (ja) | 包接錯体を含有する半導体封止用エポキシ樹脂組成物 | |
| TW200617086A (en) | Curable resin composition, curable film and cured film | |
| TW200738770A (en) | Active energy ray-curable resin composition and use thereof | |
| MX340557B (es) | Composicion de poliamida. | |
| MY149580A (en) | Epoxy resin, curable resin composition and cured product thereof | |
| MY156527A (en) | Epoxy resin, process for production thereof, epoxy resin composition using same, and cured product | |
| TW200734394A (en) | Resin composition for organic insulating layer, method of manufacturing resin composition, and display panel including resin composition | |
| TW200734377A (en) | Phenol resin and resin composition | |
| NZ602391A (en) | Low temperature heat-curable powder coating composition comprising a crystalline polyester resin, an amorphous resin and a peroxide | |
| TW200420598A (en) | A curable resin composition and cured product | |
| WO2011094004A3 (en) | Compositions having phosphorus-containing compounds | |
| TW200631981A (en) | The novel curable resin, the method of manufacturing the same, the epoxy resin composition and the electronic parts/devices | |
| TW200513508A (en) | Epoxy compound, preparation method thereof, and use thereof | |
| MY143212A (en) | Photosemiconductor encapsulant of epoxy resin, anhydride and aromatic silicone resin | |
| ATE474875T1 (de) | Wärmehärtbare zusammensetzung | |
| TW200609207A (en) | Novel phenol compound and novel epoxy resin derivable from such phenol compound | |
| MY135984A (en) | Polyester based thermoplastic resin composition and molded article | |
| TW200732366A (en) | Thermosetting resin composition | |
| MX2008002127A (es) | Promotores de la viscosidad con grupos amino terminales, sus productos resultantes y sus usos. | |
| ATE512197T1 (de) | Thermoplastische flammwidrige harzzusammensetzungen | |
| ATE298771T1 (de) | Epoxyharzzusammensetzung zur einkapselung von halbleitern | |
| EP1433775A3 (en) | Modified chain aliphatic polyamine |