PL1969160T3 - Elektrolit i sposób osadzania matowej warstwy metalu - Google Patents

Elektrolit i sposób osadzania matowej warstwy metalu

Info

Publication number
PL1969160T3
PL1969160T3 PL06701821T PL06701821T PL1969160T3 PL 1969160 T3 PL1969160 T3 PL 1969160T3 PL 06701821 T PL06701821 T PL 06701821T PL 06701821 T PL06701821 T PL 06701821T PL 1969160 T3 PL1969160 T3 PL 1969160T3
Authority
PL
Poland
Prior art keywords
metal layer
electrolyte
depositing
polyalkylene oxide
dispersion
Prior art date
Application number
PL06701821T
Other languages
English (en)
Inventor
Andreas Königshofen
Danica Elbick
Christoph Werner
Wolfgang Clauberg
Peter Pies
Andreas Möbius
Original Assignee
Enthone Incorporated
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Enthone Incorporated filed Critical Enthone Incorporated
Publication of PL1969160T3 publication Critical patent/PL1969160T3/pl

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
  • Manufacture And Refinement Of Metals (AREA)
PL06701821T 2006-01-06 2006-01-06 Elektrolit i sposób osadzania matowej warstwy metalu PL1969160T3 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/EP2006/000076 WO2007076898A1 (de) 2006-01-06 2006-01-06 Elektrolyt und verfahren zur abscheidung einer matten metallschicht
EP06701821A EP1969160B1 (de) 2006-01-06 2006-01-06 Elektrolyt und verfahren zur abscheidung einer matten metallschicht

Publications (1)

Publication Number Publication Date
PL1969160T3 true PL1969160T3 (pl) 2011-09-30

Family

ID=36956125

Family Applications (1)

Application Number Title Priority Date Filing Date
PL06701821T PL1969160T3 (pl) 2006-01-06 2006-01-06 Elektrolit i sposób osadzania matowej warstwy metalu

Country Status (10)

Country Link
US (2) US8192607B2 (pl)
EP (1) EP1969160B1 (pl)
JP (1) JP4811880B2 (pl)
KR (1) KR101234429B1 (pl)
CN (1) CN101400830B (pl)
AT (1) ATE507327T1 (pl)
DE (1) DE502006009414D1 (pl)
ES (1) ES2361500T3 (pl)
PL (1) PL1969160T3 (pl)
WO (1) WO2007076898A1 (pl)

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US7951600B2 (en) 2008-11-07 2011-05-31 Xtalic Corporation Electrodeposition baths, systems and methods
EP2568063A1 (en) * 2011-09-09 2013-03-13 Rohm and Haas Electronic Materials LLC Low internal stress copper electroplating method
US20130220819A1 (en) * 2012-02-27 2013-08-29 Faraday Technology, Inc. Electrodeposition of chromium from trivalent chromium using modulated electric fields
US20160032479A1 (en) * 2013-03-15 2016-02-04 Enthone Inc. Electrodeposition of silver with fluoropolymer nanoparticles
CN103382564B (zh) * 2013-07-18 2016-10-05 华南理工大学 金属表面超疏水钴镀层及其制备方法
KR101636361B1 (ko) * 2014-07-31 2016-07-06 주식회사 에이피씨티 과불소화알킬 계면활성제를 함유하는 솔더범프용 주석합금 전기도금액
GB2534120A (en) * 2014-11-28 2016-07-20 Daido Ind Bearings Europe Ltd Bismuth-based composite coating for overlay applications in plain bearings
AT516876B1 (de) * 2015-03-09 2016-11-15 Ing W Garhöfer Ges M B H Abscheidung von dekorativen Palladium-Eisen-Legierungsbeschichtungen auf metallischen Substanzen
JP6631349B2 (ja) 2015-03-26 2020-01-15 三菱マテリアル株式会社 アンモニウム塩を用いためっき液
CN105648490B (zh) * 2016-01-07 2017-08-15 东南大学 一种无低表面能物质改性的超疏水表面及其制备方法
CN105862093B (zh) * 2016-05-26 2018-03-06 安庆师范大学 一种离子液体中电镀Ni‑Cr‑PTFE复合镀层的方法
CN109652829B (zh) * 2019-01-04 2021-07-09 中国计量大学 一种无稀土Bi基磁性电镀液及其制备方法
CN109680310B (zh) * 2019-01-04 2020-07-07 中国计量大学 一种镍锑电镀液及其制备方法
FR3092589A1 (fr) * 2019-02-08 2020-08-14 Aveni Electrodéposition d’un alliage de cobalt et utilisation en microélectronique
CN110714212B (zh) * 2019-10-12 2021-04-30 常州大学 一种水溶液体系中由氯化镍一步法制备超疏水镍薄膜的方法
AT523922B1 (de) * 2020-09-08 2022-01-15 Iwg Ing W Garhoefer Ges M B H Elektrolytbad für Palladium-Ruthenium-Beschichtungen

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DE19540011C2 (de) * 1995-10-27 1998-09-10 Lpw Chemie Gmbh Verfahren zur galvanischen Abscheidung von blendfreien Nickel- oder Nickellegierungsniederschlägen
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CN100348780C (zh) * 2004-03-16 2007-11-14 天津大学 脉冲镀镍基纳米复合镀层的方法及设备
TW200632147A (pl) * 2004-11-12 2006-09-16

Also Published As

Publication number Publication date
CN101400830A (zh) 2009-04-01
ATE507327T1 (de) 2011-05-15
US8192607B2 (en) 2012-06-05
KR20080092399A (ko) 2008-10-15
DE502006009414D1 (de) 2011-06-09
ES2361500T3 (es) 2011-06-17
CN101400830B (zh) 2012-07-04
JP2009522441A (ja) 2009-06-11
EP1969160A1 (de) 2008-09-17
KR101234429B1 (ko) 2013-02-18
JP4811880B2 (ja) 2011-11-09
US20120298519A1 (en) 2012-11-29
WO2007076898A1 (de) 2007-07-12
EP1969160B1 (de) 2011-04-27
US20080302668A1 (en) 2008-12-11

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