PL2165295T3 - Zabezpieczona wkładka, zwłaszcza do karty chipowej - Google Patents

Zabezpieczona wkładka, zwłaszcza do karty chipowej

Info

Publication number
PL2165295T3
PL2165295T3 PL08826572.3T PL08826572T PL2165295T3 PL 2165295 T3 PL2165295 T3 PL 2165295T3 PL 08826572 T PL08826572 T PL 08826572T PL 2165295 T3 PL2165295 T3 PL 2165295T3
Authority
PL
Poland
Prior art keywords
chip card
insert intended
secure insert
secure
intended
Prior art date
Application number
PL08826572.3T
Other languages
English (en)
Inventor
Didier Elbaz
Thomas Battmann
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of PL2165295T3 publication Critical patent/PL2165295T3/pl

Links

Classifications

    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Management, Administration, Business Operations System, And Electronic Commerce (AREA)
PL08826572.3T 2007-06-21 2008-06-19 Zabezpieczona wkładka, zwłaszcza do karty chipowej PL2165295T3 (pl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0704424A FR2917871B1 (fr) 2007-06-21 2007-06-21 Insert securise notamment pour carte a puce

Publications (1)

Publication Number Publication Date
PL2165295T3 true PL2165295T3 (pl) 2016-09-30

Family

ID=38788364

Family Applications (1)

Application Number Title Priority Date Filing Date
PL08826572.3T PL2165295T3 (pl) 2007-06-21 2008-06-19 Zabezpieczona wkładka, zwłaszcza do karty chipowej

Country Status (12)

Country Link
US (1) US8272572B2 (pl)
EP (1) EP2165295B1 (pl)
JP (1) JP5325213B2 (pl)
KR (1) KR101599558B1 (pl)
ES (1) ES2567607T3 (pl)
FR (1) FR2917871B1 (pl)
HR (1) HRP20160433T1 (pl)
HU (1) HUE028797T2 (pl)
MA (1) MA31569B1 (pl)
PL (1) PL2165295T3 (pl)
TN (1) TN2009000526A1 (pl)
WO (1) WO2009013407A2 (pl)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008011611A1 (de) * 2008-02-28 2009-09-03 Infineon Technologies Ag Chipkarten und Verfahren zum Herstellen einer Chipkarte
FR2944122B1 (fr) * 2009-04-01 2011-05-06 Imprimerie Nationale Insert formant antenne et carte a puce le comportant.
US20150286921A1 (en) 2014-04-03 2015-10-08 Infineon Technologies Ag Chip card substrate and method of forming a chip card substrate
FR3076374B1 (fr) * 2017-12-31 2020-01-10 Smart Packaging Solutions Insert pour carte a puce sans contact
KR102805319B1 (ko) 2020-09-18 2025-05-12 랑셍 홀딩 스마트 카드의 프리램 본체, 스마트 카드, 프리램 본체의 형성 방법 및 스마트 카드의 형성 방법

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2691563B1 (fr) 1992-05-19 1996-05-31 Francois Droz Carte comprenant au moins un element electronique et procede de fabrication d'une telle carte.
FR2801708B1 (fr) * 1999-11-29 2003-12-26 A S K Procede de fabrication d'une carte a puce sans contact avec un support d'antenne en materiau fibreux
JP4736191B2 (ja) * 2001-01-22 2011-07-27 大日本印刷株式会社 Icカードとその製造方法
FR2829857B1 (fr) * 2001-09-14 2004-09-17 A S K Carte a puce sans contact ou hybride contact-sans contact a tenue renforcee du module electronique
JP2003099748A (ja) * 2001-09-26 2003-04-04 Oji Paper Co Ltd 非接触icカード
JP2003260889A (ja) * 2002-03-08 2003-09-16 Toshiba Corp 転写型保護膜リボン、その製造方法、及び印刷物
JP2006309603A (ja) * 2005-04-28 2006-11-09 Kyodo Printing Co Ltd 非接触型icカード
US8079529B2 (en) * 2009-03-30 2011-12-20 Visa International Service Association EMF signature device

Also Published As

Publication number Publication date
FR2917871A1 (fr) 2008-12-26
MA31569B1 (fr) 2010-08-02
FR2917871B1 (fr) 2010-10-22
US20100288842A1 (en) 2010-11-18
EP2165295B1 (fr) 2016-01-27
EP2165295A2 (fr) 2010-03-24
KR20100038205A (ko) 2010-04-13
ES2567607T3 (es) 2016-04-25
HUE028797T2 (en) 2017-01-30
JP2010530582A (ja) 2010-09-09
HRP20160433T1 (hr) 2016-06-03
WO2009013407A2 (fr) 2009-01-29
TN2009000526A1 (fr) 2011-03-31
KR101599558B1 (ko) 2016-03-03
WO2009013407A3 (fr) 2009-04-16
JP5325213B2 (ja) 2013-10-23
US8272572B2 (en) 2012-09-25

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