PL2297262T3 - Utwardzalna kompozycja przewodząca wypełniona materiałem w postaci płatków powlekanych srebrem oraz zastosowanie w montażu - Google Patents

Utwardzalna kompozycja przewodząca wypełniona materiałem w postaci płatków powlekanych srebrem oraz zastosowanie w montażu

Info

Publication number
PL2297262T3
PL2297262T3 PL08773016T PL08773016T PL2297262T3 PL 2297262 T3 PL2297262 T3 PL 2297262T3 PL 08773016 T PL08773016 T PL 08773016T PL 08773016 T PL08773016 T PL 08773016T PL 2297262 T3 PL2297262 T3 PL 2297262T3
Authority
PL
Poland
Prior art keywords
silver
assembly
conductive composition
composition filled
curable conductive
Prior art date
Application number
PL08773016T
Other languages
English (en)
Inventor
Hao Kong
Minghai Wang
Original Assignee
Henkel IP & Holding GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel IP & Holding GmbH filed Critical Henkel IP & Holding GmbH
Publication of PL2297262T3 publication Critical patent/PL2297262T3/pl

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4284—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof together with other curing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/12—Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/02—Polysilicates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/02—Ingredients treated with inorganic substances
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/011—Apparatus therefor
    • H10W72/0113—Apparatus for manufacturing die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polymerisation Methods In General (AREA)
  • Die Bonding (AREA)
PL08773016T 2008-07-03 2008-07-03 Utwardzalna kompozycja przewodząca wypełniona materiałem w postaci płatków powlekanych srebrem oraz zastosowanie w montażu PL2297262T3 (pl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2008/001269 WO2010000096A1 (en) 2008-07-03 2008-07-03 Silver coated flaky material filled conductive curable composition and the application in die attach

Publications (1)

Publication Number Publication Date
PL2297262T3 true PL2297262T3 (pl) 2017-06-30

Family

ID=41465450

Family Applications (1)

Application Number Title Priority Date Filing Date
PL08773016T PL2297262T3 (pl) 2008-07-03 2008-07-03 Utwardzalna kompozycja przewodząca wypełniona materiałem w postaci płatków powlekanych srebrem oraz zastosowanie w montażu

Country Status (8)

Country Link
US (1) US20110095241A1 (pl)
EP (1) EP2297262B1 (pl)
JP (1) JP2011526309A (pl)
KR (3) KR101532494B1 (pl)
CN (1) CN102076801A (pl)
PL (1) PL2297262T3 (pl)
TW (1) TWI453762B (pl)
WO (1) WO2010000096A1 (pl)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012022011A1 (en) * 2010-08-20 2012-02-23 Ablestik (Shanghai) Limited Stabilized, silver coated filler-containing curable compositions
CN102649893A (zh) * 2011-02-23 2012-08-29 爱博斯迪科化学(上海)有限公司 用于电容器的导电涂料及相关电容器
KR101971746B1 (ko) * 2011-03-01 2019-04-23 나믹스 가부시끼가이샤 도전성 조성물
JP5925556B2 (ja) * 2012-03-29 2016-05-25 Ｄｏｗａエレクトロニクス株式会社 銀被覆フレーク状硝子粉およびその製造方法
US10000670B2 (en) 2012-07-30 2018-06-19 Henkel IP & Holding GmbH Silver sintering compositions with fluxing or reducing agents for metal adhesion
JP6349930B2 (ja) * 2014-05-01 2018-07-04 住友ベークライト株式会社 半導体装置の製造方法、および接着剤組成物
JP6383183B2 (ja) * 2014-06-03 2018-08-29 太陽インキ製造株式会社 導電性接着剤およびそれを用いた電子部品
JP2016004659A (ja) * 2014-06-16 2016-01-12 株式会社村田製作所 導電性樹脂ペーストおよびセラミック電子部品
EP3294799B1 (en) 2015-05-08 2024-09-04 Henkel AG & Co. KGaA Sinterable films and pastes and methods for the use thereof
EP3093852B1 (en) * 2015-05-13 2017-12-27 Heraeus Deutschland GmbH & Co. KG Use of an electrically conductive composition
US10323157B2 (en) * 2015-08-20 2019-06-18 Parker-Hannifin Corporation Silver-silver chloride compositions and electrical devices containing the same
JP6110464B2 (ja) * 2015-11-20 2017-04-05 Ｄｏｗａエレクトロニクス株式会社 銀被覆フレーク状硝子粉およびその製造方法
JP2017105883A (ja) * 2015-12-07 2017-06-15 信越化学工業株式会社 液状樹脂組成物及び該組成物を用いたダイアタッチ方法、並びに該組成物の硬化物を有する半導体装置
JP7361447B2 (ja) * 2015-12-11 2023-10-16 Dic株式会社 導電性樹脂組成物、導電性接着シート及び積層体
TWI738735B (zh) * 2016-05-27 2021-09-11 德商漢高智慧財產控股公司 藉由毛細流動以於電子封裝中進行間隙塗覆及／或於其中或其間充填的組合物及其使用方法
US10590232B2 (en) * 2016-06-02 2020-03-17 Hitachi Chemical Company, Ltd. Resin composition and method of producing laminate
CN109689760B (zh) * 2016-08-29 2021-02-09 日本板硝子株式会社 树脂强化用填充材料和树脂组合物
KR101766629B1 (ko) 2016-09-02 2017-08-08 데이코쿠 잉키 세이조 가부시키가이샤 도전성 액상 조성물
CN109475941B (zh) * 2016-09-15 2022-07-12 汉高知识产权控股有限责任公司 用于涂覆和间隙填充应用的含石墨烯的材料
CN106497161B (zh) * 2016-10-31 2019-01-15 江苏裕邦车业科技有限公司 用于砂带的超涂层浆料
US10889419B2 (en) 2019-03-29 2021-01-12 Gpcp Ip Holdings Llc Removeable band with window for confining stacks of disposable cutlery
US11952190B2 (en) 2019-03-29 2024-04-09 Gpcp Ip Holdings Llc Removeable band for stack of disposable cutlery
WO2021016905A1 (en) 2019-07-31 2021-02-04 Henkel Ag & Co. Kgaa Electrically conductive silicone composition with high adhesion strength
US12230511B2 (en) 2020-08-24 2025-02-18 Stmicroelectronics S.R.L. Method of manufacturing semiconductor devices and corresponding device
US11961629B1 (en) 2022-12-08 2024-04-16 Geckos Technology Corp. Antioxidant conductive thermal paste and method of manufacturing the same

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1254330A (en) * 1982-02-08 1989-05-16 Kenneth Goetz Electroconductive element, precursor conductive composition and fabrication of same
US4483898A (en) 1982-03-17 1984-11-20 At&T Bell Laboratories Liquids with reduced spreading tendency
JPS5986638A (ja) * 1982-11-09 1984-05-18 Kuraray Co Ltd 電磁しやへい性および剛性に優れた樹脂組成物
US4548862A (en) * 1984-09-04 1985-10-22 Minnesota Mining And Manufacturing Company Flexible tape having bridges of electrically conductive particles extending across its pressure-sensitive adhesive layer
JPS61267203A (ja) * 1985-05-21 1986-11-26 東芝ケミカル株式会社 導電性ペ−スト
JPH03264678A (ja) * 1990-03-15 1991-11-25 Showa Denko Kk 導電性ペースト用銅粉
JPH07138549A (ja) 1993-11-15 1995-05-30 Tatsuta Electric Wire & Cable Co Ltd 導電性接着剤
US5951918A (en) * 1995-02-08 1999-09-14 Hitachi Chemical Company, Ltd. Composite electroconductive powder, electroconductive paste, process for producing electroconductive paste, electric circuit and process for producing electric circuit
US5840432A (en) * 1995-02-13 1998-11-24 Hitachi Chemical Company, Ltd. Electroconductive paste
JPH09296158A (ja) 1996-05-01 1997-11-18 Nippon Handa Kk 導電性接着剤
JP3526183B2 (ja) 1997-09-18 2004-05-10 住友ベークライト株式会社 導電性樹脂ペースト及びこれを用いて製造された半導体装置
JP3254626B2 (ja) 1997-09-22 2002-02-12 住友ベークライト株式会社 導電性樹脂ペースト及びこれを用いた半導体装置
JP3747995B2 (ja) * 1998-08-11 2006-02-22 住友ベークライト株式会社 導電性樹脂ペースト及びこれを用いた半導体装置
US6013203A (en) * 1998-08-19 2000-01-11 Enthone-Omi, Inc. Coatings for EMI/RFI shielding
US6515237B2 (en) * 2000-11-24 2003-02-04 Hitachi Chemical Company, Ltd. Through-hole wiring board
JP2002164632A (ja) * 2000-11-24 2002-06-07 Hitachi Chem Co Ltd スルーホール配線板
JP2002245852A (ja) 2001-02-20 2002-08-30 Hitachi Chem Co Ltd 導電ペースト
EP1355324A4 (en) * 2001-01-24 2005-03-23 Kaken Tech Co Ltd POWDER AND CONDUCTIVE COMPOSITION
US20020190242A1 (en) * 2001-05-29 2002-12-19 General Electric Company Composition, use of composition and electronic devices
JP4224771B2 (ja) 2002-05-15 2009-02-18 日立化成工業株式会社 導電ペースト
JP4389148B2 (ja) * 2002-05-17 2009-12-24 日立化成工業株式会社 導電ペースト
JP4235888B2 (ja) 2002-06-07 2009-03-11 日立化成工業株式会社 導電ペースト
JP4235887B2 (ja) * 2002-06-07 2009-03-11 日立化成工業株式会社 導電ペースト
JP4178374B2 (ja) * 2002-08-08 2008-11-12 三井金属鉱業株式会社 銀コートフレーク銅粉及びその銀コートフレーク銅粉の製造方法並びにその銀コートフレーク銅粉を用いた導電性ペースト
DE102004032903B4 (de) * 2003-07-08 2006-06-29 Hitachi Chemical Co., Ltd. Leitfähiges Pulver und Verfahren zur Herstellung desselben
JP4595301B2 (ja) 2003-08-29 2010-12-08 住友ベークライト株式会社 半導体用樹脂ペースト及び半導体装置
JP2005317491A (ja) 2004-04-01 2005-11-10 Hitachi Chem Co Ltd 導電ペーストおよびそれを用いた電子部品搭載基板
US8617688B2 (en) * 2005-05-30 2013-12-31 Sumitomo Electric Industries, Ltd. Conductive paste and multilayer printed wiring board using the same
CN1277893C (zh) * 2005-07-11 2006-10-04 大连轻工业学院 一种光固化导电胶及其制法
US8709288B2 (en) * 2006-09-08 2014-04-29 Sun Chemical Corporation High conductive water-based silver ink
CN101081969B (zh) * 2007-06-28 2010-06-02 中国兵器工业集团第五三研究所 一种导电胶粘剂

Also Published As

Publication number Publication date
KR20140070638A (ko) 2014-06-10
KR101532494B1 (ko) 2015-06-29
TW201003675A (en) 2010-01-16
KR20110025836A (ko) 2011-03-11
WO2010000096A1 (en) 2010-01-07
CN102076801A (zh) 2011-05-25
JP2011526309A (ja) 2011-10-06
EP2297262B1 (en) 2016-12-21
EP2297262A1 (en) 2011-03-23
US20110095241A1 (en) 2011-04-28
TWI453762B (zh) 2014-09-21
EP2297262A4 (en) 2014-07-16
KR20130084697A (ko) 2013-07-25

Similar Documents

Publication Publication Date Title
PL2297262T3 (pl) Utwardzalna kompozycja przewodząca wypełniona materiałem w postaci płatków powlekanych srebrem oraz zastosowanie w montażu
IL267138A (en) Improved composition of cells and methods for its preparation
EP2492289A4 (en) POLYMERIZABLE DENTAL COMPOSITION AND DENTAL MATERIALS WITH THIS
GB0810453D0 (en) Improved conductivity of resin materials and composite materials
GB0801155D0 (en) Fibre-reinforced composition material and manufacture thereof
EP2260525A4 (en) COMPOSITE ELECTRODE MATERIAL
BRPI0915481A2 (pt) material e método para produzir o mesmo
EP2405452A4 (en) ELECTRODE MATERIAL AND ELECTRODE WITH ELECTRODE MATERIAL
BR112013006899A2 (pt) "composição e material compósito reforçado"
EP2599840A4 (en) SILVER INK COMPOSITION AND BASE MATERIAL
IL225740A0 (en) Adapted factor vii polypeptides and uses thereof
BRPI1006441A2 (pt) estrutura compósita com uma superfície e estrutura compósita sobremoldada
EP2341106A4 (en) CURABLE COMPOSITION AND CURED PRODUCT OBTAINED THEREFROM
ZA201008355B (en) Wood substitute material and its use
BRPI0918006A2 (pt) abrasividade reduzida com material pesado micronizado
BRPI0918328B8 (pt) composição e artigo
EP2332519A4 (en) COSMETIC POWDER MATERIAL
ZA200905508B (en) Compositions and methods to prevent cancer with cupredoxins
BRPI0923690A2 (pt) composição curável de organopolissiloxano e material poroso curado de organopolissiloxano
EP2205677A4 (en) NETWORKABLE FLUOROLPOLYMER COMPOSITION AND USES THEREOF
PL2402035T3 (pl) Materiał powlekający do stałego preparatu farmaceutycznego i stały preparat farmaceutyczny utworzony z jego użyciem
GB2454774B (en) Transparent aqua-based nano sol-gel composition and method of applying the same
EP2351790A4 (en) POLYOLEFIN RESIN COMPOSITION AND APPLICATIONS THEREOF
EP2261284A4 (en) RUBBER COMPOSITION AND USE THEREOF
IL213636A0 (en) Compositions and methods to prevent cancer with cupredoxins