PL2401897T3 - Wielowarstwowy nośnik układu i sposób jego wytwarzania - Google Patents

Wielowarstwowy nośnik układu i sposób jego wytwarzania

Info

Publication number
PL2401897T3
PL2401897T3 PL10707860T PL10707860T PL2401897T3 PL 2401897 T3 PL2401897 T3 PL 2401897T3 PL 10707860 T PL10707860 T PL 10707860T PL 10707860 T PL10707860 T PL 10707860T PL 2401897 T3 PL2401897 T3 PL 2401897T3
Authority
PL
Poland
Prior art keywords
production
layer circuit
circuit carrier
carrier
layer
Prior art date
Application number
PL10707860T
Other languages
English (en)
Inventor
Dieter Götsch
Roman Karmazin
Richard Matz
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of PL2401897T3 publication Critical patent/PL2401897T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed inductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
PL10707860T 2009-02-27 2010-02-23 Wielowarstwowy nośnik układu i sposób jego wytwarzania PL2401897T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102009010874A DE102009010874A1 (de) 2009-02-27 2009-02-27 Mehrlagige Schaltungsanordnung und Verfahren zu deren Herstellung
EP10707860.2A EP2401897B1 (de) 2009-02-27 2010-02-23 Mehrlagiger schaltungsträger und verfahren zu dessen herstellung
PCT/EP2010/052286 WO2010097387A1 (de) 2009-02-27 2010-02-23 Mehrlagiger schaltungsträger und verfahren zu dessen herstellung

Publications (1)

Publication Number Publication Date
PL2401897T3 true PL2401897T3 (pl) 2014-07-31

Family

ID=42101233

Family Applications (1)

Application Number Title Priority Date Filing Date
PL10707860T PL2401897T3 (pl) 2009-02-27 2010-02-23 Wielowarstwowy nośnik układu i sposób jego wytwarzania

Country Status (6)

Country Link
EP (1) EP2401897B1 (pl)
KR (1) KR20110132576A (pl)
CN (1) CN102334391B (pl)
DE (1) DE102009010874A1 (pl)
PL (1) PL2401897T3 (pl)
WO (1) WO2010097387A1 (pl)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013205655A1 (de) 2013-03-28 2014-10-02 Siemens Aktiengesellschaft Mehrlagiges induktives passives Bauelement und Folienkörper zu dessen Herstellung
DE102014209881A1 (de) 2014-05-23 2015-11-26 Siemens Aktiengesellschaft Mehrlagiges induktives passives Bauelement und Folienkörper zu dessen Herstellung
DE102016101999A1 (de) * 2016-02-04 2017-08-10 Automotive Lighting Reutlingen Gmbh Lichtmodul für eine Kraftfahrzeugbeleuchtungseinrichtung
WO2017147129A1 (en) 2016-02-24 2017-08-31 Murata Manufacturing Co., Ltd. Substrate-embedded transformer with improved isolation
US12272484B2 (en) * 2021-03-04 2025-04-08 Intel Corporation Coreless electronic substrates having embedded inductors
CN114501857B (zh) * 2021-12-15 2025-06-27 武汉利之达科技股份有限公司 一种多层陶瓷电路板制备方法
CN114743787B (zh) * 2022-03-29 2023-11-21 中国电子科技集团公司第四十三研究所 可拆分ltcc平面变压器的制作方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2746723B2 (ja) * 1990-03-28 1998-05-06 ティーディーケイ株式会社 厚膜の磁界結合コイルを有する回路
US5476726A (en) * 1992-01-22 1995-12-19 Hitachi, Ltd. Circuit board with metal layer for solder bonding and electronic circuit device employing the same
US6021050A (en) * 1998-12-02 2000-02-01 Bourns, Inc. Printed circuit boards with integrated passive components and method for making same
DE10139707A1 (de) * 2001-08-11 2003-02-20 Philips Corp Intellectual Pty Leiterplatte
AU2002340750A1 (en) * 2001-09-28 2003-04-14 Siemens Aktiengesellschaft Method for contacting electrical contact surfaces of a substrate and device consisting of a substrate having electrical contact surfaces
DE102005006638B4 (de) * 2005-02-14 2009-01-02 Siemens Ag Haftfeste Leiterbahn auf Isolationsschicht
JP2007266114A (ja) * 2006-03-27 2007-10-11 Kyocera Corp 配線基板の製造方法
JP4818198B2 (ja) * 2007-03-15 2011-11-16 京セラ株式会社 コイル内蔵基板

Also Published As

Publication number Publication date
CN102334391A (zh) 2012-01-25
KR20110132576A (ko) 2011-12-08
EP2401897B1 (de) 2014-02-12
WO2010097387A1 (de) 2010-09-02
EP2401897A1 (de) 2012-01-04
DE102009010874A1 (de) 2010-09-02
CN102334391B (zh) 2014-06-11

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PL2401897T3 (pl) Wielowarstwowy nośnik układu i sposób jego wytwarzania