PL2547482T3 - Sposób lutowania powierzchni metalicznego podłoża - Google Patents

Sposób lutowania powierzchni metalicznego podłoża

Info

Publication number
PL2547482T3
PL2547482T3 PL11708841T PL11708841T PL2547482T3 PL 2547482 T3 PL2547482 T3 PL 2547482T3 PL 11708841 T PL11708841 T PL 11708841T PL 11708841 T PL11708841 T PL 11708841T PL 2547482 T3 PL2547482 T3 PL 2547482T3
Authority
PL
Poland
Prior art keywords
brazing
metallic substrate
metallic
substrate
Prior art date
Application number
PL11708841T
Other languages
English (en)
Inventor
Sebastian Piegert
Ingo Reinkensmeier
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of PL2547482T3 publication Critical patent/PL2547482T3/pl

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/206—Cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/10—Aluminium or alloys thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Products (AREA)
  • Catalysts (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
PL11708841T 2010-03-18 2011-03-15 Sposób lutowania powierzchni metalicznego podłoża PL2547482T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP10002901A EP2366484A1 (en) 2010-03-18 2010-03-18 A method for brazing a surface of a metallic substrate
EP11708841.9A EP2547482B1 (en) 2010-03-18 2011-03-15 A method for brazing a surface of a metallic substrate
PCT/EP2011/053897 WO2011113832A1 (en) 2010-03-18 2011-03-15 A method for brazing a surface of a metallic substrate

Publications (1)

Publication Number Publication Date
PL2547482T3 true PL2547482T3 (pl) 2015-11-30

Family

ID=42610053

Family Applications (1)

Application Number Title Priority Date Filing Date
PL11708841T PL2547482T3 (pl) 2010-03-18 2011-03-15 Sposób lutowania powierzchni metalicznego podłoża

Country Status (7)

Country Link
US (1) US20130001277A1 (pl)
EP (2) EP2366484A1 (pl)
JP (1) JP5792207B2 (pl)
CN (1) CN102802858B (pl)
PL (1) PL2547482T3 (pl)
RU (1) RU2568545C2 (pl)
WO (1) WO2011113832A1 (pl)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015061295A1 (en) * 2013-10-22 2015-04-30 Northeastern University Flux-less direct soldering by ultrasonic surface activation
CN105618882A (zh) * 2016-03-08 2016-06-01 西北工业大学 钎焊接头的封装方法
CN110576232B (zh) * 2019-08-12 2021-07-16 湖南浩威特科技发展有限公司 高体积分数碳化硅颗粒增强铝基复合材料与铝硅合金的钎焊方法
CN110576231B (zh) * 2019-08-12 2021-08-31 湖南浩威特科技发展有限公司 高硅铝合金半固态钎焊方法和高硅铝合金钎焊接头

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2144064A (en) * 1983-07-30 1985-02-27 Marconi Co Ltd A method of soldering together two surfaces
US4572939A (en) * 1984-01-27 1986-02-25 The United States Of America As Represented By The United States Department Of Energy Brazing technique
JP3132850B2 (ja) * 1991-07-29 2001-02-05 三菱重工業株式会社 Ｎｉ基耐熱合金のろう付方法
DE69415280T2 (de) * 1993-05-12 1999-04-29 Nippon Steel Corp., Tokio/Tokyo Verfahren zum löten von einer warmfesten legierung, die mit einem isolierenden oxidischen film beschichtet ist, vorgeheitzter metallischer träger zum reinigen von abgasen und verfahren zum erzeugen von diesem
US7043819B1 (en) * 1996-12-23 2006-05-16 Recast Airfoil Group Methods for forming metal parts having superior surface characteristics
JPH08229819A (ja) * 1994-12-22 1996-09-10 Mitsubishi Heavy Ind Ltd 二段階ブラスト処理によるロー付け方法
US6575353B2 (en) * 2001-02-20 2003-06-10 3M Innovative Properties Company Reducing metals as a brazing flux
DE10342242A1 (de) * 2003-09-11 2005-04-07 Behr Gmbh & Co. Kg Lötwerkstück, Lötverfahren und Wärmetauscher
US20080236738A1 (en) * 2007-03-30 2008-10-02 Chi-Fung Lo Bonded sputtering target and methods of manufacture
RU2354514C2 (ru) * 2007-05-21 2009-05-10 Андрей Валентинович Полторыбатько Способ пайки алюминия, плакированного силумином, и алюминиевых сплавов, плакированных силумином
WO2009141444A1 (en) * 2008-05-23 2009-11-26 Loctite (R&D) Limited Surface-promoted cure of one-part cationically curable compositions
JP2010149175A (ja) * 2008-12-26 2010-07-08 Honda Motor Co Ltd ニッケル合金材のろう付け方法
CN101502904A (zh) * 2009-03-03 2009-08-12 北京科技大学 微电子封装用铝碳化硅复合材料与可伐合金的钎焊方法
JP5582762B2 (ja) * 2009-11-09 2014-09-03 デノラ・テック・インコーポレーテッド ハロゲン含有溶液の電気分解において用いるための電極

Also Published As

Publication number Publication date
CN102802858B (zh) 2015-11-25
JP5792207B2 (ja) 2015-10-07
WO2011113832A1 (en) 2011-09-22
RU2012144322A (ru) 2014-04-27
RU2568545C2 (ru) 2015-11-20
EP2547482B1 (en) 2015-07-01
CN102802858A (zh) 2012-11-28
EP2366484A1 (en) 2011-09-21
US20130001277A1 (en) 2013-01-03
EP2547482A1 (en) 2013-01-23
JP2013522047A (ja) 2013-06-13

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