PL2609800T3 - Układ chłodzenia cieczą dla serwera - Google Patents

Układ chłodzenia cieczą dla serwera

Info

Publication number
PL2609800T3
PL2609800T3 PL11752036T PL11752036T PL2609800T3 PL 2609800 T3 PL2609800 T3 PL 2609800T3 PL 11752036 T PL11752036 T PL 11752036T PL 11752036 T PL11752036 T PL 11752036T PL 2609800 T3 PL2609800 T3 PL 2609800T3
Authority
PL
Poland
Prior art keywords
server
cooling system
liquid cooling
liquid
cooling
Prior art date
Application number
PL11752036T
Other languages
English (en)
Inventor
Steven B. Branton
Original Assignee
Asetek Danmark A/S
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=44545955&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=PL2609800(T3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Asetek Danmark A/S filed Critical Asetek Danmark A/S
Publication of PL2609800T3 publication Critical patent/PL2609800T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20263—Heat dissipaters releasing heat from coolant
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20754—Air circulating in closed loop within cabinets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
PL11752036T 2010-08-26 2011-08-23 Układ chłodzenia cieczą dla serwera PL2609800T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US37724910P 2010-08-26 2010-08-26
EP11752036.1A EP2609800B1 (en) 2010-08-26 2011-08-23 Liquid cooling system for a server
PCT/US2011/048735 WO2012027319A1 (en) 2010-08-26 2011-08-23 Liquid cooling system for a server

Publications (1)

Publication Number Publication Date
PL2609800T3 true PL2609800T3 (pl) 2020-05-18

Family

ID=44545955

Family Applications (1)

Application Number Title Priority Date Filing Date
PL11752036T PL2609800T3 (pl) 2010-08-26 2011-08-23 Układ chłodzenia cieczą dla serwera

Country Status (7)

Country Link
US (5) US8724315B2 (pl)
EP (1) EP2609800B1 (pl)
CN (2) CN105828574B (pl)
DK (1) DK2609800T3 (pl)
ES (1) ES2769605T3 (pl)
PL (1) PL2609800T3 (pl)
WO (1) WO2012027319A1 (pl)

Families Citing this family (110)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9943014B2 (en) 2013-03-15 2018-04-10 Coolit Systems, Inc. Manifolded heat exchangers and related systems
US9496200B2 (en) 2011-07-27 2016-11-15 Coolit Systems, Inc. Modular heat-transfer systems
US8746330B2 (en) 2007-08-09 2014-06-10 Coolit Systems Inc. Fluid heat exchanger configured to provide a split flow
US9453691B2 (en) 2007-08-09 2016-09-27 Coolit Systems, Inc. Fluid heat exchange systems
US8472182B2 (en) * 2010-07-28 2013-06-25 International Business Machines Corporation Apparatus and method for facilitating dissipation of heat from a liquid-cooled electronics rack
CN105828574B (zh) * 2010-08-26 2018-09-21 阿塞泰克丹麦公司 用于计算机服务器机架的冷却系统
US9848509B2 (en) 2011-06-27 2017-12-19 Ebullient, Inc. Heat sink module
US9832913B2 (en) 2011-06-27 2017-11-28 Ebullient, Inc. Method of operating a cooling apparatus to provide stable two-phase flow
US9901008B2 (en) 2014-10-27 2018-02-20 Ebullient, Inc. Redundant heat sink module
US9854714B2 (en) 2011-06-27 2017-12-26 Ebullient, Inc. Method of absorbing sensible and latent heat with series-connected heat sinks
US9901013B2 (en) 2011-06-27 2018-02-20 Ebullient, Inc. Method of cooling series-connected heat sink modules
US9854715B2 (en) 2011-06-27 2017-12-26 Ebullient, Inc. Flexible two-phase cooling system
US10365667B2 (en) 2011-08-11 2019-07-30 Coolit Systems, Inc. Flow-path controllers and related systems
US9155230B2 (en) * 2011-11-28 2015-10-06 Asetek Danmark A/S Cooling system for a server
US20140321056A1 (en) * 2011-12-01 2014-10-30 Nec Corporation Electronic substrate housing equipment and electric apparatus
TWI459893B (zh) * 2012-01-20 2014-11-01 Delta Electronics Inc 機櫃系統及其排風設備
KR101906648B1 (ko) 2012-02-09 2018-10-10 휴렛 팩커드 엔터프라이즈 디벨롭먼트 엘피 열 방산 시스템
CN104094682B (zh) * 2012-03-12 2017-01-18 慧与发展有限责任合伙企业 一种用于电子器件机架的液体冷却系统及液体冷却方法
US9631880B2 (en) 2012-04-10 2017-04-25 Lenovo Enterprise Solutions (Singapore) Pte. Ltd. Process for optimizing a heat exchanger configuration
JP6069880B2 (ja) 2012-04-24 2017-02-01 富士通株式会社 ラック装置、ラックシステム及び筐体構造
US9167728B2 (en) * 2012-07-18 2015-10-20 International Business Machines Corporation Information technology equipment cooling method
US9927187B2 (en) 2012-09-28 2018-03-27 Hewlett Packard Enterprise Development Lp Cooling assembly
US9803937B2 (en) 2013-01-31 2017-10-31 Hewlett Packard Enterprise Development Lp Liquid cooling
US9049800B2 (en) * 2013-02-01 2015-06-02 Dell Products L.P. Immersion server, immersion server drawer, and rack-mountable immersion server drawer-based cabinet
TWI531795B (zh) 2013-03-15 2016-05-01 水冷系統公司 感測器、多工通信技術及相關系統
US12366870B2 (en) 2013-03-15 2025-07-22 Coolit Systems, Inc. Flow-path controllers and related systems
US9351430B2 (en) * 2013-06-13 2016-05-24 Microsoft Technology Licensing, Llc Renewable energy based datacenter cooling
CN104423504A (zh) * 2013-08-28 2015-03-18 英业达科技有限公司 服务器
CN104661485A (zh) * 2013-11-19 2015-05-27 艾默生网络能源有限公司 一种电气柜及改善电气柜内环境的方法
US10201116B1 (en) * 2013-12-02 2019-02-05 Amazon Technologies, Inc. Cooling system for data center rack
WO2015083256A1 (ja) * 2013-12-04 2015-06-11 富士通株式会社 混合作動液を用いた冷却装置及び電子装置の冷却装置
JP5858414B1 (ja) * 2014-08-18 2016-02-10 株式会社Ｍｕｒａｋｕｍｏ システムおよびラック
US10455726B2 (en) * 2014-09-30 2019-10-22 Hewlett Packard Enterprise Development Lp Modular cooling
US20160120059A1 (en) 2014-10-27 2016-04-28 Ebullient, Llc Two-phase cooling system
US10184699B2 (en) 2014-10-27 2019-01-22 Ebullient, Inc. Fluid distribution unit for two-phase cooling system
US9852963B2 (en) 2014-10-27 2017-12-26 Ebullient, Inc. Microprocessor assembly adapted for fluid cooling
CN104602486A (zh) * 2014-12-22 2015-05-06 曙光信息产业(北京)有限公司 液冷服务器
CN104615220A (zh) * 2014-12-25 2015-05-13 曙光信息产业(北京)有限公司 冷却系统和服务器系统
US9832912B2 (en) 2015-05-07 2017-11-28 Dhk Storage, Llc Computer server heat regulation utilizing integrated precision air flow
US9844167B2 (en) * 2015-06-26 2017-12-12 Microsoft Technology Licensing, Llc Underwater container cooling via external heat exchanger
US9801313B2 (en) 2015-06-26 2017-10-24 Microsoft Technology Licensing, Llc Underwater container cooling via integrated heat exchanger
US10206312B2 (en) 2015-12-21 2019-02-12 Dell Products, L.P. Liquid cooled rack information handling system having storage drive carrier for leak containment and vibration mitigation
US10156873B2 (en) * 2015-12-21 2018-12-18 Dell Products, L.P. Information handling system having fluid manifold with embedded heat exchanger system
US9839164B2 (en) 2015-12-21 2017-12-05 Dell Products, L.P. Rack information handling system having modular liquid distribution (MLD) conduits
US10146231B2 (en) 2015-12-21 2018-12-04 Dell Products, L.P. Liquid flow control based upon energy balance and fan speed for controlling exhaust air temperature
US10064314B2 (en) 2015-12-21 2018-08-28 Dell Products, L.P. Runtime service of liquid cooled servers operating under positive hydraulic pressure without impacting component performance
US9795065B2 (en) 2015-12-21 2017-10-17 Dell Products, L.P. Integrated air-spring for hydraulic force damping of a rigid liquid cooling subsystem
US9622388B1 (en) * 2016-02-10 2017-04-11 Ciena Corporation Multi-directional fans in an electronic chassis supporting extended range temperature operation
US9723762B1 (en) 2016-03-15 2017-08-01 Amazon Technologies, Inc. Free cooling in high humidity environments
US9961806B2 (en) * 2016-05-19 2018-05-01 Power Distribution Systems Development LLC Systems and methods for transformer cooling by vertical airflow
CN106091758B (zh) * 2016-05-31 2018-04-13 北京百度网讯科技有限公司 用于数据中心的热量回收系统
US11249522B2 (en) * 2016-06-30 2022-02-15 Intel Corporation Heat transfer apparatus for a computer environment
DE102016218200A1 (de) * 2016-09-22 2018-03-22 Siemens Healthcare Gmbh Redundantes Kühlsystem für einen Magnetresonanztomographen
US11574372B2 (en) * 2017-02-08 2023-02-07 Upstream Data Inc. Blockchain mine at oil or gas facility
US10390462B2 (en) * 2017-02-16 2019-08-20 Dell Products, Lp Server chassis with independent orthogonal airflow layout
US10037062B1 (en) 2017-03-17 2018-07-31 Microsoft Technology Licensing, Llc Thermal venting device with pressurized plenum
US10244655B2 (en) * 2017-03-20 2019-03-26 International Business Machines Corporation Two-phase liquid cooled electronics
US10108233B1 (en) * 2017-04-06 2018-10-23 Johann Wischnesky Computer cooling assembly
US10191521B2 (en) * 2017-05-25 2019-01-29 Coolanyp, LLC Hub-link liquid cooling system
JP6888469B2 (ja) * 2017-08-04 2021-06-16 富士通株式会社 情報処理装置
US10785895B2 (en) * 2017-10-04 2020-09-22 Google Llc Managing a data center
US10888013B2 (en) 2017-10-04 2021-01-05 Google Llc Managing a data center
US11452243B2 (en) 2017-10-12 2022-09-20 Coolit Systems, Inc. Cooling system, controllers and methods
CN109757061B (zh) * 2017-11-03 2021-06-11 阿里巴巴集团控股有限公司 冷却机柜及冷却系统
CN109757060B (zh) 2017-11-03 2020-11-24 阿里巴巴集团控股有限公司 冷却设备
CN110139531B (zh) 2018-02-02 2021-03-05 阿里巴巴集团控股有限公司 适用于冷却设备的导流系统及冷却系统
US10681846B2 (en) 2018-04-19 2020-06-09 Google Llc Cooling electronic devices in a data center
US10645847B2 (en) * 2018-04-20 2020-05-05 Google Llc Cooling electronic devices in a data center
US11240932B1 (en) * 2018-07-27 2022-02-01 Waymo Llc Cold plate
US11467637B2 (en) * 2018-07-31 2022-10-11 Wuxi Kalannipu Thermal Management Technology Co., Ltd. Modular computer cooling system
GB2576032B (en) * 2018-08-02 2021-04-21 Provost Fellows Found Scholars & Other Members Board College Holy & Und Liquid cooled server module
US10966352B2 (en) 2018-09-24 2021-03-30 Google Llc Cooling electronic devices in a data center
US11147191B2 (en) * 2018-10-29 2021-10-12 Quanta Computer Inc. Liquid cooling with outdoor chiller rack system
US10746084B2 (en) * 2018-12-13 2020-08-18 General Electric Company Liquid driven thermal module and thermal management system
US10548240B1 (en) 2019-01-11 2020-01-28 Google Llc Cooling electronic devices in a data center
US11662037B2 (en) 2019-01-18 2023-05-30 Coolit Systems, Inc. Fluid flow control valve for fluid flow systems, and methods
US11163291B2 (en) * 2019-02-08 2021-11-02 Dell Products L.P. System and method of determining coolant leaks within information handling systems
HUP1900078A1 (hu) * 2019-03-13 2020-09-28 Heatventors Kft Rendszer és alkalmazás szerverterem hõmérsékletének szabályozására
US11473860B2 (en) 2019-04-25 2022-10-18 Coolit Systems, Inc. Cooling module with leak detector and related systems
US11907029B2 (en) 2019-05-15 2024-02-20 Upstream Data Inc. Portable blockchain mining system and methods of use
US11490546B2 (en) * 2019-05-21 2022-11-01 Iceotope Group Limited Cooling system for electronic modules
FR3099814B1 (fr) * 2019-08-07 2022-05-13 Tresorio Installation et procédé de récupération de chaleur
US10925187B1 (en) * 2019-08-30 2021-02-16 Dell Products, L.P. Remote heat exchanger arm for direct contact liquid cooling for rack mounted equipment
US11089715B2 (en) * 2019-09-17 2021-08-10 Baidu Usa Llc Cooling chassis design for server liquid cooling of electronic racks of a data center
US11212943B2 (en) * 2020-02-21 2021-12-28 Nvidia Corporation Universal pluggable datacenter cooling system
CA3076653A1 (en) 2020-03-21 2021-09-21 Upstream Data Inc. Portable blockchain mining systems and methods of use
US11395443B2 (en) 2020-05-11 2022-07-19 Coolit Systems, Inc. Liquid pumping units, and related systems and methods
US20210368656A1 (en) * 2020-05-20 2021-11-25 Nvidia Corporation Intelligent control and distribution of a liquid in a data center
DE112020007377T5 (de) * 2020-08-24 2023-04-27 Nvidia Corporation Intelligente anpassbare rippen zur kühlung von rechenzentrumsvorrichtungen
NL2027460B1 (en) * 2021-01-29 2022-09-02 Solo30 B V Hybrid datacentre module
US11956931B2 (en) * 2021-02-18 2024-04-09 Nvidia Corporation Intelligent and dynamic cold plate for datacenter cooling systems
US12101907B2 (en) * 2021-04-30 2024-09-24 Nvidia Corporation Intelligent pod-based cooling loop with dry cooler for mobile datacenter cooling systems
US11725886B2 (en) 2021-05-20 2023-08-15 Coolit Systems, Inc. Modular fluid heat exchange systems
TWI784614B (zh) * 2021-07-07 2022-11-21 訊凱國際股份有限公司 伺服裝置與承載殼體
US11785741B2 (en) * 2021-07-20 2023-10-10 Dell Products L.P. System and method for cooling a computing device
TWI793757B (zh) * 2021-09-09 2023-02-21 緯創資通股份有限公司 浸沒式冷卻系統及冷卻裝置
US12114469B2 (en) * 2021-12-06 2024-10-08 Nvidia Corporation Adjustable fluid coupling in datacenter cooling systems
CN116321914A (zh) * 2021-12-20 2023-06-23 曙光数据基础设施创新技术(北京)股份有限公司 电子设备的自动调节流体冷却系统
US12200914B2 (en) 2022-01-24 2025-01-14 Coolit Systems, Inc. Smart components, systems and methods for transferring heat
US12069840B2 (en) * 2022-03-07 2024-08-20 Nvidia Corporation Interfacing flow controllers for datacenter cooling systems
CN217742122U (zh) * 2022-03-16 2022-11-04 广运机械工程股份有限公司 热交换系统
CN217509347U (zh) * 2022-03-16 2022-09-27 广运机械工程股份有限公司 热交换系统
EP4508505A1 (en) 2022-05-12 2025-02-19 Psiquantum, Corp. Modular distributed cryogenic system
US12127374B2 (en) * 2022-06-21 2024-10-22 Nvidia Corporation Staged commissioning for datacenter cooling systems
US20240032257A1 (en) * 2022-07-22 2024-01-25 Dell Products L.P. Inter-stage air-to-liquid radiator
CN115066168B (zh) * 2022-08-19 2022-11-01 南通华锐软件技术有限公司 一种计算机机房服务器机柜冷却系统
EP4398692A1 (en) * 2023-01-09 2024-07-10 Carrier Corporation Server with hybrid thermal management system
US12507383B2 (en) 2023-05-31 2025-12-23 Nexalus Limited Sealed rack server cooling unit
US20250311170A1 (en) * 2024-03-27 2025-10-02 International Business Machines Corporation Intra-drawer heat exchanger
TWI910009B (zh) * 2025-03-28 2025-12-21 緯創資通股份有限公司 伺服器裝置、擴充模組及散熱模組

Family Cites Families (56)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6506111B2 (en) * 2001-05-16 2003-01-14 Sanmina-Sci Corporation Cooling airflow distribution device
WO2002102124A2 (en) 2001-06-12 2002-12-19 Liebert Corporation Single or dual buss thermal transfer system
US6981543B2 (en) * 2001-09-20 2006-01-03 Intel Corporation Modular capillary pumped loop cooling system
US6828675B2 (en) * 2001-09-26 2004-12-07 Modine Manufacturing Company Modular cooling system and thermal bus for high power electronics cabinets
US6700785B2 (en) 2002-01-04 2004-03-02 Intel Corporation Computer system which locks a server unit subassembly in a selected position in a support frame
US6807056B2 (en) * 2002-09-24 2004-10-19 Hitachi, Ltd. Electronic equipment
US6970355B2 (en) 2002-11-20 2005-11-29 International Business Machines Corporation Frame level partial cooling boost for drawer and/or node level processors
JP4199018B2 (ja) 2003-02-14 2008-12-17 株式会社日立製作所 ラックマウントサーバシステム
DE20308158U1 (de) 2003-03-07 2003-07-31 Rittal GmbH & Co. KG, 35745 Herborn Flüssigkeits-Kühlsystem
US6763880B1 (en) 2003-06-26 2004-07-20 Evserv Tech Corporation Liquid cooled radiation module for servers
US6819563B1 (en) * 2003-07-02 2004-11-16 International Business Machines Corporation Method and system for cooling electronics racks using pre-cooled air
US7012807B2 (en) * 2003-09-30 2006-03-14 International Business Machines Corporation Thermal dissipation assembly and fabrication method for electronics drawer of a multiple-drawer electronics rack
US20050128705A1 (en) 2003-12-16 2005-06-16 International Business Machines Corporation Composite cold plate assembly
US6896612B1 (en) 2004-01-26 2005-05-24 Sun Microsystems, Inc. Self-cooled electronic equipment enclosure with failure tolerant cooling system and method of operation
US7203063B2 (en) * 2004-05-21 2007-04-10 Hewlett-Packard Development Company, L.P. Small form factor liquid loop cooling system
US7420804B2 (en) * 2004-06-30 2008-09-02 Intel Corporation Liquid cooling system including hot-swappable components
US7380409B2 (en) 2004-09-30 2008-06-03 International Business Machines Corporation Isolation valve and coolant connect/disconnect assemblies and methods of fabrication for interfacing a liquid cooled electronics subsystem and an electronics housing
US7277282B2 (en) * 2004-12-27 2007-10-02 Intel Corporation Integrated circuit cooling system including heat pipes and external heat sink
CN1652678A (zh) * 2005-02-23 2005-08-10 大连大学 无噪声电子教室系统
US20060187638A1 (en) 2005-02-24 2006-08-24 Vinson Wade D System and method for liquid cooling of an electronic device
US7438124B2 (en) * 2005-10-04 2008-10-21 Delphi Technologies, Inc. Evaporative cooling system for a data-communications cabinet
US8289710B2 (en) * 2006-02-16 2012-10-16 Liebert Corporation Liquid cooling systems for server applications
TW200805042A (en) * 2006-02-16 2008-01-16 Cooligy Inc Liquid cooling loops for server applications
DK2032907T3 (en) 2006-06-01 2018-07-02 Google Llc Hot cooling for electronics
US20070297136A1 (en) * 2006-06-23 2007-12-27 Sun Micosystems, Inc. Modular liquid cooling of electronic components while preserving data center integrity
JP4789760B2 (ja) 2006-09-19 2011-10-12 富士通株式会社 電子機器及びラック状装置
US7372698B1 (en) * 2006-12-21 2008-05-13 Isothermal Systems Research, Inc. Electronics equipment heat exchanger system
US7525207B2 (en) 2007-02-26 2009-04-28 Google Inc. Water-based data center
US7957132B2 (en) * 2007-04-16 2011-06-07 Fried Stephen S Efficiently cool data centers and electronic enclosures using loop heat pipes
US20090027856A1 (en) * 2007-07-26 2009-01-29 Mccoy Scott Blade cooling system using wet and dry heat sinks
US9496200B2 (en) * 2011-07-27 2016-11-15 Coolit Systems, Inc. Modular heat-transfer systems
US8051672B2 (en) * 2007-08-30 2011-11-08 Afco Systems Fluid cooled cabinet for electronic equipment
DE102007045733B3 (de) 2007-09-25 2009-02-05 Qimonda Ag Speichermodul, Hauptplatine, Computersystem und Wärmeübertragungssystem
US9025330B2 (en) * 2007-09-30 2015-05-05 Alcatel Lucent Recirculating gas rack cooling architecture
US7757506B2 (en) 2007-11-19 2010-07-20 International Business Machines Corporation System and method for facilitating cooling of a liquid-cooled electronics rack
US8387249B2 (en) 2007-11-19 2013-03-05 International Business Machines Corporation Apparatus and method for facilitating servicing of a liquid-cooled electronics rack
US7660109B2 (en) * 2007-12-17 2010-02-09 International Business Machines Corporation Apparatus and method for facilitating cooling of an electronics system
US8164901B2 (en) 2008-04-16 2012-04-24 Julius Neudorfer High efficiency heat removal system for rack mounted computer equipment
WO2009131810A2 (en) 2008-04-21 2009-10-29 Hardcore Computer, Inc. A case and rack system for liquid submersion cooling of electronic devices connected in an array
US7626820B1 (en) 2008-05-15 2009-12-01 Sun Microsystems, Inc. Thermal transfer technique using heat pipes with integral rack rails
EP3270261A1 (en) * 2008-05-21 2018-01-17 Asetek A/S Graphics card thermal interposer
US7639499B1 (en) 2008-07-07 2009-12-29 International Business Machines Corporation Liquid cooling apparatus and method for facilitating cooling of an electronics system
US20100032140A1 (en) 2008-08-06 2010-02-11 Sun Microsystems, Inc. Liquid cooled rack with optimized liquid flow path driven by electronic cooling demand
US20100085708A1 (en) * 2008-10-07 2010-04-08 Liebert Corporation High-efficiency, fluid-cooled ups converter
US7944694B2 (en) 2008-10-23 2011-05-17 International Business Machines Corporation Liquid cooling apparatus and method for cooling blades of an electronic system chassis
WO2010054786A1 (de) 2008-11-14 2010-05-20 Knürr AG Verfahren zur kühlluftregelung in geräteschränken und sensor-anordnung
CN101902895A (zh) * 2009-05-27 2010-12-01 鸿富锦精密工业（深圳）有限公司 散热系统
US20110056675A1 (en) 2009-09-09 2011-03-10 International Business Machines Corporation Apparatus and method for adjusting coolant flow resistance through liquid-cooled electronics rack(s)
US8094453B2 (en) * 2009-09-30 2012-01-10 International Business Machines Corporation Compliant conduction rail assembly and method facilitating cooling of an electronics structure
CN105828574B (zh) * 2010-08-26 2018-09-21 阿塞泰克丹麦公司 用于计算机服务器机架的冷却系统
TW201212798A (en) * 2010-09-02 2012-03-16 Hon Hai Prec Ind Co Ltd Computer server cabinet
TWI422318B (zh) 2010-10-29 2014-01-01 Ind Tech Res Inst 數據機房
US8456833B2 (en) 2010-11-02 2013-06-04 International Business Machines Corporation Fluid cooling system and associated fitting assembly for electronic component
TWI392432B (zh) 2010-11-23 2013-04-01 Inventec Corp 一種伺服器機櫃
US8493738B2 (en) * 2011-05-06 2013-07-23 International Business Machines Corporation Cooled electronic system with thermal spreaders coupling electronics cards to cold rails
US9155230B2 (en) * 2011-11-28 2015-10-06 Asetek Danmark A/S Cooling system for a server

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CN105828574B (zh) 2018-09-21
US9907206B2 (en) 2018-02-27
US20180160566A1 (en) 2018-06-07
EP2609800A1 (en) 2013-07-03
EP2609800B1 (en) 2019-11-20
US9089078B2 (en) 2015-07-21
US20150319883A1 (en) 2015-11-05
CN103168509B (zh) 2016-03-23
US20140246178A1 (en) 2014-09-04
HK1187191A1 (zh) 2014-03-28
US10136551B2 (en) 2018-11-20
DK2609800T3 (da) 2020-02-24
WO2012027319A1 (en) 2012-03-01
US8724315B2 (en) 2014-05-13
HK1222973A1 (zh) 2017-07-14
US20140168889A1 (en) 2014-06-19
US20110303394A1 (en) 2011-12-15
ES2769605T3 (es) 2020-06-26
CN105828574A (zh) 2016-08-03
US8749968B1 (en) 2014-06-10
WO2012027319A8 (en) 2012-05-18
CN103168509A (zh) 2013-06-19

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