PL2786647T3 - Układ chłodzenia dla serwera - Google Patents

Układ chłodzenia dla serwera

Info

Publication number
PL2786647T3
PL2786647T3 PL12819130T PL12819130T PL2786647T3 PL 2786647 T3 PL2786647 T3 PL 2786647T3 PL 12819130 T PL12819130 T PL 12819130T PL 12819130 T PL12819130 T PL 12819130T PL 2786647 T3 PL2786647 T3 PL 2786647T3
Authority
PL
Poland
Prior art keywords
server
cooling system
cooling
Prior art date
Application number
PL12819130T
Other languages
English (en)
Inventor
Andre Sloth Eriksen
Original Assignee
Asetek Danmark A/S
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asetek Danmark A/S filed Critical Asetek Danmark A/S
Publication of PL2786647T3 publication Critical patent/PL2786647T3/pl

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1485—Servers; Data center rooms, e.g. 19-inch computer racks
    • H05K7/1488—Cabinets therefor, e.g. chassis or racks or mechanical interfaces between blades and support structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20263—Heat dissipaters releasing heat from coolant
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20772—Liquid cooling without phase change within server blades for removing heat from heat source
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
PL12819130T 2011-11-28 2012-10-23 Układ chłodzenia dla serwera PL2786647T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/304,813 US9155230B2 (en) 2011-11-28 2011-11-28 Cooling system for a server
PCT/IB2012/002702 WO2013080037A2 (en) 2011-11-28 2012-10-23 Cooling system for a server
EP12819130.1A EP2786647B1 (en) 2011-11-28 2012-10-23 Cooling system for a server

Publications (1)

Publication Number Publication Date
PL2786647T3 true PL2786647T3 (pl) 2020-03-31

Family

ID=46199195

Family Applications (1)

Application Number Title Priority Date Filing Date
PL12819130T PL2786647T3 (pl) 2011-11-28 2012-10-23 Układ chłodzenia dla serwera

Country Status (7)

Country Link
US (4) US9155230B2 (pl)
EP (2) EP2786647B1 (pl)
CN (2) CN104054407B (pl)
DK (1) DK2786647T3 (pl)
ES (1) ES2731728T3 (pl)
PL (1) PL2786647T3 (pl)
WO (1) WO2013080037A2 (pl)

Families Citing this family (89)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9943014B2 (en) 2013-03-15 2018-04-10 Coolit Systems, Inc. Manifolded heat exchangers and related systems
US9496200B2 (en) 2011-07-27 2016-11-15 Coolit Systems, Inc. Modular heat-transfer systems
US9453691B2 (en) 2007-08-09 2016-09-27 Coolit Systems, Inc. Fluid heat exchange systems
US8746330B2 (en) 2007-08-09 2014-06-10 Coolit Systems Inc. Fluid heat exchanger configured to provide a split flow
JP5531571B2 (ja) * 2009-11-12 2014-06-25 富士通株式会社 機能拡張ユニットシステム
CN103168509B (zh) * 2010-08-26 2016-03-23 阿塞泰克丹麦公司 用于服务器的液体冷却系统
US9061382B2 (en) 2011-07-25 2015-06-23 International Business Machines Corporation Heat sink structure with a vapor-permeable membrane for two-phase cooling
US8564952B2 (en) 2011-07-25 2013-10-22 International Business Machines Corporation Flow boiling heat sink structure with vapor venting and condensing
US9069532B2 (en) * 2011-07-25 2015-06-30 International Business Machines Corporation Valve controlled, node-level vapor condensation for two-phase heat sink(s)
US10365667B2 (en) 2011-08-11 2019-07-30 Coolit Systems, Inc. Flow-path controllers and related systems
US9155230B2 (en) * 2011-11-28 2015-10-06 Asetek Danmark A/S Cooling system for a server
US9229497B2 (en) 2012-11-08 2016-01-05 Silicon Graphics International Corp. On-blade cold sink for high-density clustered computer system
TWI531795B (zh) 2013-03-15 2016-05-01 水冷系統公司 感測器、多工通信技術及相關系統
US12366870B2 (en) 2013-03-15 2025-07-22 Coolit Systems, Inc. Flow-path controllers and related systems
CN103365385A (zh) * 2013-07-10 2013-10-23 北京百度网讯科技有限公司 用于整机柜的服务器组件及具有其的整机柜
US10201116B1 (en) * 2013-12-02 2019-02-05 Amazon Technologies, Inc. Cooling system for data center rack
JP6160709B2 (ja) * 2013-12-04 2017-07-12 富士通株式会社 混合作動液を用いた冷却装置及び電子装置の冷却装置
EP3130209B1 (en) * 2014-04-11 2021-11-24 Hewlett Packard Enterprise Development LP Liquid coolant supply
WO2016027299A1 (ja) * 2014-08-18 2016-02-25 株式会社Ｍｕｒａｋｕｍｏ システム、情報処理装置およびラック
US20180027696A1 (en) * 2015-03-24 2018-01-25 Hewlett Packard Enterprise Development Lp Liquid cooling with a cooling chamber
US9801313B2 (en) 2015-06-26 2017-10-24 Microsoft Technology Licensing, Llc Underwater container cooling via integrated heat exchanger
US9844167B2 (en) * 2015-06-26 2017-12-12 Microsoft Technology Licensing, Llc Underwater container cooling via external heat exchanger
US9655281B2 (en) 2015-06-26 2017-05-16 Seagate Technology Llc Modular cooling system
US10237999B2 (en) * 2015-10-30 2019-03-19 Hewlett Packard Enterprise Development Lp Configurable node expansion space
US10455735B2 (en) 2016-03-03 2019-10-22 Coolanyp, LLC Self-organizing thermodynamic system
DE102016204175A1 (de) * 2016-03-14 2017-09-14 Thomas-Krenn.AG System, vorzugsweise für eine Temperaturregulierung eines Volumens
FR3057344B1 (fr) * 2016-10-10 2019-05-24 Bull Sas Armoire informatique avec modules de refroidissement liquide
US11574372B2 (en) * 2017-02-08 2023-02-07 Upstream Data Inc. Blockchain mine at oil or gas facility
US9916871B1 (en) 2017-03-16 2018-03-13 International Business Machines Corporation Data storage library with acclimation chamber
US10303376B2 (en) 2017-03-16 2019-05-28 International Business Machines Corporation Data storage library with pass-through connected media acclimation chamber
US10431254B2 (en) 2017-03-16 2019-10-01 International Business Machines Corporation System for providing an acclimation enclosure for a data storage library
US10566023B2 (en) 2017-03-16 2020-02-18 International Business Machines Corporation Data storage library with service mode for protecting data storage drives
US10890955B2 (en) 2017-03-16 2021-01-12 International Business Machines Corporation System for controlling environmental conditions within an automated data storage library
US10395695B2 (en) 2017-03-16 2019-08-27 International Business Machines Corporation Data storage library with media acclimation device and methods of acclimating data storage media
US10418071B2 (en) 2017-03-16 2019-09-17 International Business Machines Corporation Data storage library with positive pressure system
US9940976B1 (en) 2017-03-16 2018-04-10 International Business Machines Corporation Data storage library with component locker for environmental acclimation
US10509421B2 (en) 2017-03-16 2019-12-17 International Business Machines Corproation Method for controlling environmental conditions within an automated data storage library
US9916869B1 (en) 2017-03-16 2018-03-13 International Business Machines Corporation Method for servicing a self-cooled data storage library
US10045457B1 (en) 2017-03-16 2018-08-07 International Business Machines Corporation System for maintaining the environment of a self-cooled data storage library
US10026445B1 (en) 2017-03-16 2018-07-17 International Business Machines Corporation Data storage library with interior access regulation
US10026455B1 (en) 2017-03-16 2018-07-17 International Business Machines Corporation System and method for controlling environmental conditions within an automated data storage library
US11500430B2 (en) 2017-03-16 2022-11-15 International Business Machines Corporation Data storage library with service mode for protecting data storage drives
US10417851B2 (en) 2017-03-16 2019-09-17 International Business Machines Corporation Data storage library with service mode
US10551806B2 (en) 2017-03-16 2020-02-04 International Business Machines Corporation System for providing an access area for a data storage library
US10660240B2 (en) 2017-03-16 2020-05-19 International Business Machines Corporation Method for providing an access area for a data storage library
JP6939034B2 (ja) * 2017-04-05 2021-09-22 富士通株式会社 冷却システム、冷却装置、及び電子システム
JP6888469B2 (ja) * 2017-08-04 2021-06-16 富士通株式会社 情報処理装置
CN107613732B (zh) * 2017-09-28 2024-06-07 深圳兴奇宏科技有限公司 机箱散热结构
US11452243B2 (en) 2017-10-12 2022-09-20 Coolit Systems, Inc. Cooling system, controllers and methods
JP6969721B2 (ja) * 2017-12-30 2021-11-24 ヒタチ・エナジー・スウィツァーランド・アクチェンゲゼルシャフトHitachi Energy Switzerland Ag 変圧冷却回路中でのセンサ利用のためのシステム
US10667437B2 (en) * 2018-04-12 2020-05-26 Baidu Usa Llc Liquid distribution unit design for liquid cooling of electronic racks of a data center
US10925190B2 (en) 2018-06-04 2021-02-16 Baidu Usa Llc Leak detection and response system for liquid cooling of electronic racks of a data center
US11467637B2 (en) * 2018-07-31 2022-10-11 Wuxi Kalannipu Thermal Management Technology Co., Ltd. Modular computer cooling system
US10921070B2 (en) * 2018-12-14 2021-02-16 Quanta Computer Inc. Connector assembly for liquid cooling
US11662037B2 (en) 2019-01-18 2023-05-30 Coolit Systems, Inc. Fluid flow control valve for fluid flow systems, and methods
US11473860B2 (en) 2019-04-25 2022-10-18 Coolit Systems, Inc. Cooling module with leak detector and related systems
US11907029B2 (en) 2019-05-15 2024-02-20 Upstream Data Inc. Portable blockchain mining system and methods of use
US11490546B2 (en) 2019-05-21 2022-11-01 Iceotope Group Limited Cooling system for electronic modules
US11089715B2 (en) * 2019-09-17 2021-08-10 Baidu Usa Llc Cooling chassis design for server liquid cooling of electronic racks of a data center
US11032949B2 (en) * 2019-09-30 2021-06-08 Baidu Usa Llc Method for deploying liquid cooling solution in an air-cooled data center room
CN111077957B (zh) * 2019-11-14 2021-07-30 苏州浪潮智能科技有限公司 一种多途径服务器冷却系统
CA3076653A1 (en) 2020-03-21 2021-09-21 Upstream Data Inc. Portable blockchain mining systems and methods of use
US11330741B2 (en) * 2020-03-26 2022-05-10 Baidu Usa Llc Modular design of blind mate interface for liquid cooling
US11395443B2 (en) 2020-05-11 2022-07-19 Coolit Systems, Inc. Liquid pumping units, and related systems and methods
US11388832B2 (en) * 2020-05-28 2022-07-12 Baidu Usa Llc Blind-mate connection design for liquid-cooled electronic racks
US11445639B2 (en) * 2020-09-24 2022-09-13 Baidu Usa Llc Information technology (IT) cooling system with fluid distribution configuration
US11822398B2 (en) * 2020-11-30 2023-11-21 Nvidia Corporation Intelligent and redundant air-cooled cooling loop for datacenter cooling systems
US11829215B2 (en) * 2020-11-30 2023-11-28 Nvidia Corporation Intelligent and redundant liquid-cooled cooling loop for datacenter cooling systems
EP4068927B1 (en) 2021-04-01 2024-07-03 Ovh Immersion cooling system with dual dielectric cooling liquid circulation
EP4068930B1 (en) 2021-04-01 2024-03-13 Ovh A rack system for housing an electronic device
EP4316219A1 (en) 2021-04-01 2024-02-07 Ovh Scissor structure for cable/tube management of rack-mounted liquid-cooled electronic assemblies
CA3152605A1 (en) 2021-04-01 2022-10-01 Ovh Systems and methods for autonomously activable redundant cooling of a heat generating component
US11924998B2 (en) 2021-04-01 2024-03-05 Ovh Hybrid immersion cooling system for rack-mounted electronic assemblies
CA3151725A1 (en) 2021-04-01 2022-10-01 Ovh Immersion cooling system with dual dielectric cooling liquid circulation
CN113115574B (zh) * 2021-04-19 2021-10-15 佛山市液冷时代科技有限公司 一种数据中心相变传热模组分离式液冷系统及其控制方法
US12457707B2 (en) 2021-04-20 2025-10-28 Nvidia Corporation Quick disconnect blind-mate manifold
US11683910B2 (en) * 2021-04-27 2023-06-20 Quanta Computer Inc. Hot plug redundant pump for cooling system
US11653479B2 (en) * 2021-05-10 2023-05-16 Baidu Usa Llc Modular cooling units and advanced distribution hardware for racks
US11725886B2 (en) 2021-05-20 2023-08-15 Coolit Systems, Inc. Modular fluid heat exchange systems
US11627687B2 (en) * 2021-06-22 2023-04-11 Baidu Usa Llc Multiple phase multiple system architecture
US11622471B2 (en) * 2021-06-24 2023-04-04 Quanta Computer Inc. Cooling method for a cold plate module
US11758693B2 (en) * 2021-06-28 2023-09-12 Baidu Usa Llc Connection module for fluid management in liquid cooled electronics system
US11868189B2 (en) * 2021-09-01 2024-01-09 Quanta Computer Inc. Systems and methods for controlling leaks in liquid cooling systems for computer devices
US20230142683A1 (en) 2021-11-09 2023-05-11 Hoffman Enclosures Inc. Coolant Distribution Unit and Control System
US12200914B2 (en) 2022-01-24 2025-01-14 Coolit Systems, Inc. Smart components, systems and methods for transferring heat
CN217509347U (zh) * 2022-03-16 2022-09-27 广运机械工程股份有限公司 热交换系统
US12089366B2 (en) * 2022-05-27 2024-09-10 Baidu Usa Llc Server and cooling system for enhanced immersion cooling
CN118785646A (zh) * 2023-03-29 2024-10-15 富联精密电子(天津)有限公司 浸没式液冷循环系统及浸没式液冷机柜
CN116528572B (zh) * 2023-06-21 2023-09-12 苏州浪潮智能科技有限公司 单相冷板式液冷系统及其控制方法和电子设备

Family Cites Families (62)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10296928T5 (de) * 2001-06-12 2004-10-07 Liebert Corp Einzel- oder Doppelbuswärmeübertragungssystem
US6981543B2 (en) 2001-09-20 2006-01-03 Intel Corporation Modular capillary pumped loop cooling system
US6700785B2 (en) * 2002-01-04 2004-03-02 Intel Corporation Computer system which locks a server unit subassembly in a selected position in a support frame
US6807056B2 (en) 2002-09-24 2004-10-19 Hitachi, Ltd. Electronic equipment
US6970355B2 (en) 2002-11-20 2005-11-29 International Business Machines Corporation Frame level partial cooling boost for drawer and/or node level processors
JP4199018B2 (ja) 2003-02-14 2008-12-17 株式会社日立製作所 ラックマウントサーバシステム
DE10310282A1 (de) * 2003-03-07 2004-09-16 Rittal Gmbh & Co. Kg Flüssigkeits-Kühlsystem
DE20308158U1 (de) 2003-03-07 2003-07-31 Rittal GmbH & Co. KG, 35745 Herborn Flüssigkeits-Kühlsystem
US6763880B1 (en) 2003-06-26 2004-07-20 Evserv Tech Corporation Liquid cooled radiation module for servers
US6819563B1 (en) 2003-07-02 2004-11-16 International Business Machines Corporation Method and system for cooling electronics racks using pre-cooled air
US7012807B2 (en) 2003-09-30 2006-03-14 International Business Machines Corporation Thermal dissipation assembly and fabrication method for electronics drawer of a multiple-drawer electronics rack
US7971632B2 (en) 2003-11-07 2011-07-05 Asetek A/S Cooling system for a computer system
US20050128705A1 (en) 2003-12-16 2005-06-16 International Business Machines Corporation Composite cold plate assembly
US6896612B1 (en) 2004-01-26 2005-05-24 Sun Microsystems, Inc. Self-cooled electronic equipment enclosure with failure tolerant cooling system and method of operation
US7359197B2 (en) * 2004-04-12 2008-04-15 Nvidia Corporation System for efficiently cooling a processor
US8430156B2 (en) * 2004-04-29 2013-04-30 Hewlett-Packard Development Company, L.P. Liquid loop with multiple pump assembly
US7420804B2 (en) 2004-06-30 2008-09-02 Intel Corporation Liquid cooling system including hot-swappable components
US7380409B2 (en) * 2004-09-30 2008-06-03 International Business Machines Corporation Isolation valve and coolant connect/disconnect assemblies and methods of fabrication for interfacing a liquid cooled electronics subsystem and an electronics housing
US7277282B2 (en) 2004-12-27 2007-10-02 Intel Corporation Integrated circuit cooling system including heat pipes and external heat sink
US7345877B2 (en) * 2005-01-06 2008-03-18 The Boeing Company Cooling apparatus, system, and associated method
US20060187638A1 (en) 2005-02-24 2006-08-24 Vinson Wade D System and method for liquid cooling of an electronic device
CN101228495B (zh) 2005-05-06 2013-03-13 阿塞泰克公司 用于计算机系统的冷却系统
US7438124B2 (en) 2005-10-04 2008-10-21 Delphi Technologies, Inc. Evaporative cooling system for a data-communications cabinet
US7551442B2 (en) * 2005-12-05 2009-06-23 Nvidia Corporation Embedded heat pipe in a hybrid cooling system
US8289710B2 (en) * 2006-02-16 2012-10-16 Liebert Corporation Liquid cooling systems for server applications
JP5208769B2 (ja) 2006-02-16 2013-06-12 クーリギー インコーポレイテッド 取付装置
CA2653806C (en) 2006-06-01 2014-06-03 Exaflop Llc Warm cooling for electronics
US20070297136A1 (en) * 2006-06-23 2007-12-27 Sun Micosystems, Inc. Modular liquid cooling of electronic components while preserving data center integrity
JP4789760B2 (ja) 2006-09-19 2011-10-12 富士通株式会社 電子機器及びラック状装置
US7372698B1 (en) 2006-12-21 2008-05-13 Isothermal Systems Research, Inc. Electronics equipment heat exchanger system
US7525207B2 (en) 2007-02-26 2009-04-28 Google Inc. Water-based data center
US7957132B2 (en) 2007-04-16 2011-06-07 Fried Stephen S Efficiently cool data centers and electronic enclosures using loop heat pipes
US20090027856A1 (en) 2007-07-26 2009-01-29 Mccoy Scott Blade cooling system using wet and dry heat sinks
US9496200B2 (en) 2011-07-27 2016-11-15 Coolit Systems, Inc. Modular heat-transfer systems
US8051672B2 (en) 2007-08-30 2011-11-08 Afco Systems Fluid cooled cabinet for electronic equipment
DE102007045733B3 (de) * 2007-09-25 2009-02-05 Qimonda Ag Speichermodul, Hauptplatine, Computersystem und Wärmeübertragungssystem
US9025330B2 (en) 2007-09-30 2015-05-05 Alcatel Lucent Recirculating gas rack cooling architecture
US7757506B2 (en) * 2007-11-19 2010-07-20 International Business Machines Corporation System and method for facilitating cooling of a liquid-cooled electronics rack
US8387249B2 (en) 2007-11-19 2013-03-05 International Business Machines Corporation Apparatus and method for facilitating servicing of a liquid-cooled electronics rack
US7660109B2 (en) 2007-12-17 2010-02-09 International Business Machines Corporation Apparatus and method for facilitating cooling of an electronics system
US8164901B2 (en) 2008-04-16 2012-04-24 Julius Neudorfer High efficiency heat removal system for rack mounted computer equipment
WO2009131810A2 (en) * 2008-04-21 2009-10-29 Hardcore Computer, Inc. A case and rack system for liquid submersion cooling of electronic devices connected in an array
US7626820B1 (en) * 2008-05-15 2009-12-01 Sun Microsystems, Inc. Thermal transfer technique using heat pipes with integral rack rails
ES2638768T3 (es) 2008-05-21 2017-10-24 Asetek A/S Elemento de interposición térmico de tarjeta gráfica
US7639499B1 (en) 2008-07-07 2009-12-29 International Business Machines Corporation Liquid cooling apparatus and method for facilitating cooling of an electronics system
US20100032140A1 (en) 2008-08-06 2010-02-11 Sun Microsystems, Inc. Liquid cooled rack with optimized liquid flow path driven by electronic cooling demand
US20100085708A1 (en) 2008-10-07 2010-04-08 Liebert Corporation High-efficiency, fluid-cooled ups converter
US7944694B2 (en) * 2008-10-23 2011-05-17 International Business Machines Corporation Liquid cooling apparatus and method for cooling blades of an electronic system chassis
WO2010054786A1 (de) 2008-11-14 2010-05-20 Knürr AG Verfahren zur kühlluftregelung in geräteschränken und sensor-anordnung
CN101902895A (zh) 2009-05-27 2010-12-01 鸿富锦精密工业（深圳）有限公司 散热系统
US20110056675A1 (en) 2009-09-09 2011-03-10 International Business Machines Corporation Apparatus and method for adjusting coolant flow resistance through liquid-cooled electronics rack(s)
US8094453B2 (en) 2009-09-30 2012-01-10 International Business Machines Corporation Compliant conduction rail assembly and method facilitating cooling of an electronics structure
CN103168509B (zh) * 2010-08-26 2016-03-23 阿塞泰克丹麦公司 用于服务器的液体冷却系统
TW201212798A (en) 2010-09-02 2012-03-16 Hon Hai Prec Ind Co Ltd Computer server cabinet
US8432691B2 (en) 2010-10-28 2013-04-30 Asetek A/S Liquid cooling system for an electronic system
US8358505B2 (en) 2010-10-28 2013-01-22 Asetek A/S Integrated liquid cooling system
TWI422318B (zh) * 2010-10-29 2014-01-01 Ind Tech Res Inst 數據機房
US8456833B2 (en) * 2010-11-02 2013-06-04 International Business Machines Corporation Fluid cooling system and associated fitting assembly for electronic component
TWI392432B (zh) * 2010-11-23 2013-04-01 Inventec Corp 一種伺服器機櫃
US8493738B2 (en) 2011-05-06 2013-07-23 International Business Machines Corporation Cooled electronic system with thermal spreaders coupling electronics cards to cold rails
US9155230B2 (en) * 2011-11-28 2015-10-06 Asetek Danmark A/S Cooling system for a server
US9795065B2 (en) * 2015-12-21 2017-10-17 Dell Products, L.P. Integrated air-spring for hydraulic force damping of a rigid liquid cooling subsystem

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EP3531812A1 (en) 2019-08-28
DK2786647T3 (da) 2019-07-15
HK1202212A1 (en) 2015-10-02
WO2013080037A3 (en) 2013-11-07
CN107102711A (zh) 2017-08-29
US9155230B2 (en) 2015-10-06
EP2786647B1 (en) 2019-04-17
ES2731728T3 (es) 2019-11-18
WO2013080037A2 (en) 2013-06-06
US9717166B2 (en) 2017-07-25
EP2786647A2 (en) 2014-10-08
US20150382514A1 (en) 2015-12-31
US20190150322A1 (en) 2019-05-16
US10212857B2 (en) 2019-02-19
US20120147553A1 (en) 2012-06-14
CN104054407B (zh) 2017-07-18
CN104054407A (zh) 2014-09-17
US20170332520A1 (en) 2017-11-16

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