PL2699071T3 - Moduł głowicy do pobierania oraz umieszczania komponentów dedykowanych w technologii SMT - Google Patents

Moduł głowicy do pobierania oraz umieszczania komponentów dedykowanych w technologii SMT

Info

Publication number
PL2699071T3
PL2699071T3 PL13180071T PL13180071T PL2699071T3 PL 2699071 T3 PL2699071 T3 PL 2699071T3 PL 13180071 T PL13180071 T PL 13180071T PL 13180071 T PL13180071 T PL 13180071T PL 2699071 T3 PL2699071 T3 PL 2699071T3
Authority
PL
Poland
Prior art keywords
pick
head module
dedicated components
smt technology
place dedicated
Prior art date
Application number
PL13180071T
Other languages
English (en)
Inventor
Miłosz Włodarczyk
Original Assignee
Włodarczyk Władysław Igloo
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Włodarczyk Władysław Igloo filed Critical Włodarczyk Władysław Igloo
Publication of PL2699071T3 publication Critical patent/PL2699071T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Manipulator (AREA)
  • Automatic Assembly (AREA)
PL13180071T 2012-08-14 2013-08-12 Moduł głowicy do pobierania oraz umieszczania komponentów dedykowanych w technologii SMT PL2699071T3 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PL400384A PL222470B1 (pl) 2012-08-14 2012-08-14 Moduł głowicy do pobierania oraz umieszczania komponentów dedykowanych w technologii SMT
EP13180071.6A EP2699071B1 (en) 2012-08-14 2013-08-12 Head module for pick and place dedicated components in SMT technology

Publications (1)

Publication Number Publication Date
PL2699071T3 true PL2699071T3 (pl) 2017-04-28

Family

ID=48951378

Family Applications (2)

Application Number Title Priority Date Filing Date
PL400384A PL222470B1 (pl) 2012-08-14 2012-08-14 Moduł głowicy do pobierania oraz umieszczania komponentów dedykowanych w technologii SMT
PL13180071T PL2699071T3 (pl) 2012-08-14 2013-08-12 Moduł głowicy do pobierania oraz umieszczania komponentów dedykowanych w technologii SMT

Family Applications Before (1)

Application Number Title Priority Date Filing Date
PL400384A PL222470B1 (pl) 2012-08-14 2012-08-14 Moduł głowicy do pobierania oraz umieszczania komponentów dedykowanych w technologii SMT

Country Status (2)

Country Link
EP (1) EP2699071B1 (pl)
PL (2) PL222470B1 (pl)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9669550B2 (en) * 2014-04-18 2017-06-06 Kla-Tencor Corporation Pick and place device with automatic pick-up-height adjustment and a method and a computer program product to automatically adjust the pick-up-height of a pick and place device
CN104261127A (zh) * 2014-09-10 2015-01-07 苏州赛腾精密电子有限公司 下料取放机构
MY185911A (en) 2014-12-05 2021-06-14 Kla Tencor Corp Apparatus, method and computer program product for defect detection in work pieces
CN104495372A (zh) * 2014-12-16 2015-04-08 苏州慧捷自动化科技有限公司 一种滤波棉真空吸附装置
CN107743583B (zh) 2015-06-05 2023-12-01 科磊股份有限公司 用于至少对半导体装置的侧表面进行检验的设备、方法及计算机程序产品
CN105059928A (zh) * 2015-08-10 2015-11-18 苏州赛腾精密电子股份有限公司 真空管圆周旋转机构
FR3055383B1 (fr) 2016-08-31 2019-11-15 Sigma Clermont Dispositif de transmission mecanique et systeme comprenant un tel dispositif
CN107172875A (zh) * 2017-07-20 2017-09-15 合肥裕朗机电科技有限公司 一种防跑偏可更换吸嘴的贴片机
US11382248B2 (en) 2018-02-26 2022-07-05 Universal Instruments Corporation Dispensing head
CN111788035A (zh) 2018-02-26 2020-10-16 环球仪器公司 分配头、喷嘴及方法
CN109640616B (zh) * 2019-01-11 2024-07-26 博众精工科技股份有限公司 高速高精度贴装头
CN110494034B (zh) * 2019-08-30 2024-04-30 青岛飞梭科技有限公司 多层年轮式旋转气路装置
CN114056992B (zh) * 2020-07-31 2024-12-03 深圳科宏健科技有限公司 一种smt接料机的使用方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10147922A1 (de) * 2001-09-28 2003-04-30 Siemens Dematic Ag Bestückkopf zum Halten von Bauteilen
JP2003163493A (ja) * 2001-11-29 2003-06-06 Juki Corp 電子部品実装装置の装着ヘッド
JP3772808B2 (ja) 2002-08-29 2006-05-10 株式会社村田製作所 部品装着装置
DE10304970B4 (de) * 2003-02-06 2006-08-10 Ina - Drives & Mechatronics Gmbh & Co. Ohg Positioniereinheit mit einem Kraftsensor
US7484782B2 (en) 2005-08-26 2009-02-03 Intellepro, Inc. Multi-axis pick and place assembly
JP4208155B2 (ja) 2006-03-27 2009-01-14 パナソニック株式会社 実装ヘッド、および電子部品実装装置
US8550523B2 (en) 2007-06-22 2013-10-08 Data I/O Corporation Pick and place system

Also Published As

Publication number Publication date
PL400384A1 (pl) 2014-02-17
PL222470B1 (pl) 2016-07-29
EP2699071A3 (en) 2014-10-22
EP2699071A2 (en) 2014-02-19
EP2699071B1 (en) 2016-11-09

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