PL2802020T3 - Wyświetlacz ekranowy LED wysokiej rozdzielczości oraz jego montowana powierzchniowo zespolona lampa LED o super-małej odległości między punktami - Google Patents
Wyświetlacz ekranowy LED wysokiej rozdzielczości oraz jego montowana powierzchniowo zespolona lampa LED o super-małej odległości między punktamiInfo
- Publication number
- PL2802020T3 PL2802020T3 PL13838095T PL13838095T PL2802020T3 PL 2802020 T3 PL2802020 T3 PL 2802020T3 PL 13838095 T PL13838095 T PL 13838095T PL 13838095 T PL13838095 T PL 13838095T PL 2802020 T3 PL2802020 T3 PL 2802020T3
- Authority
- PL
- Poland
- Prior art keywords
- super
- points
- screen display
- high resolution
- short distance
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
- F21V19/0025—Fastening arrangements intended to retain light sources the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/8506—Containers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
- H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
- H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/0198—Manufacture or treatment batch processes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310075976.0A CN103178192B (zh) | 2013-03-11 | 一种高清晰度led显示屏及其超小点间距贴片式led复合灯 | |
| EP13838095.1A EP2802020B1 (en) | 2013-03-11 | 2013-03-26 | High-definition led display screen and surface-mounted led composite lamp with super-small point distance thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PL2802020T3 true PL2802020T3 (pl) | 2017-06-30 |
Family
ID=48637926
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL13838095T PL2802020T3 (pl) | 2013-03-11 | 2013-03-26 | Wyświetlacz ekranowy LED wysokiej rozdzielczości oraz jego montowana powierzchniowo zespolona lampa LED o super-małej odległości między punktami |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9494302B2 (pl) |
| EP (1) | EP2802020B1 (pl) |
| JP (2) | JP2016512344A (pl) |
| PL (1) | PL2802020T3 (pl) |
| TW (1) | TW201435241A (pl) |
| WO (1) | WO2014139189A1 (pl) |
Families Citing this family (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10431567B2 (en) | 2010-11-03 | 2019-10-01 | Cree, Inc. | White ceramic LED package |
| US9831393B2 (en) | 2010-07-30 | 2017-11-28 | Cree Hong Kong Limited | Water resistant surface mount device package |
| US8974077B2 (en) | 2012-07-30 | 2015-03-10 | Ultravision Technologies, Llc | Heat sink for LED light source |
| US9711489B2 (en) * | 2013-05-29 | 2017-07-18 | Cree Huizhou Solid State Lighting Company Limited | Multiple pixel surface mount device package |
| US9195281B2 (en) | 2013-12-31 | 2015-11-24 | Ultravision Technologies, Llc | System and method for a modular multi-panel display |
| US9582237B2 (en) | 2013-12-31 | 2017-02-28 | Ultravision Technologies, Llc | Modular display panels with different pitches |
| US10706770B2 (en) | 2014-07-16 | 2020-07-07 | Ultravision Technologies, Llc | Display system having module display panel with circuitry for bidirectional communication |
| USD780704S1 (en) * | 2014-08-27 | 2017-03-07 | Mitsubishi Electric Corporation | Light source module |
| USD768584S1 (en) * | 2014-11-13 | 2016-10-11 | Mitsubishi Electric Corporation | Light source module |
| CN104867418A (zh) * | 2015-06-11 | 2015-08-26 | 长沙信元电子科技有限公司 | 一种通透型led电子显示屏的像素块 |
| DE102015119653A1 (de) * | 2015-11-13 | 2017-05-18 | Osram Opto Semiconductors Gmbh | Modul für eine Videowand |
| EP3491679B1 (en) | 2016-07-26 | 2023-02-22 | CreeLED, Inc. | Light emitting diodes, components and related methods |
| TWD186014S (zh) * | 2016-09-29 | 2017-10-11 | 新世紀光電股份有限公司 | 發光二極體模組之部分 |
| EP3343544B1 (en) * | 2016-12-28 | 2022-06-15 | Vestel Elektronik Sanayi ve Ticaret A.S. | Method for a display device |
| JP6289718B1 (ja) * | 2017-01-02 | 2018-03-07 | ルーメンス カンパニー リミテッド | Ledディスプレイ装置 |
| CN106876375A (zh) * | 2017-03-28 | 2017-06-20 | 山东晶泰星光电科技有限公司 | 一种集成式rgb‑led显示屏 |
| CN106847800A (zh) * | 2017-03-28 | 2017-06-13 | 山东晶泰星光电科技有限公司 | Qfn表面贴装式rgb‑led封装模组及其制造方法 |
| KR102481946B1 (ko) * | 2017-07-17 | 2022-12-29 | 서울반도체 주식회사 | 디스플레이 장치 |
| CN108305870A (zh) * | 2018-04-02 | 2018-07-20 | 厦门强力巨彩光电科技有限公司 | 一种多像素led灯珠及led显示模组 |
| CN108511431A (zh) | 2018-05-21 | 2018-09-07 | 佛山市国星光电股份有限公司 | 一种led显示单元组及显示面板 |
| US11024785B2 (en) * | 2018-05-25 | 2021-06-01 | Creeled, Inc. | Light-emitting diode packages |
| US11233183B2 (en) | 2018-08-31 | 2022-01-25 | Creeled, Inc. | Light-emitting diodes, light-emitting diode arrays and related devices |
| US11335833B2 (en) * | 2018-08-31 | 2022-05-17 | Creeled, Inc. | Light-emitting diodes, light-emitting diode arrays and related devices |
| USD902448S1 (en) | 2018-08-31 | 2020-11-17 | Cree, Inc. | Light emitting diode package |
| CN109118969B (zh) * | 2018-09-25 | 2024-04-02 | 深圳市奥拓电子股份有限公司 | Led显示模组及led显示屏 |
| US11101411B2 (en) | 2019-06-26 | 2021-08-24 | Creeled, Inc. | Solid-state light emitting devices including light emitting diodes in package structures |
| CN110718160A (zh) * | 2019-10-30 | 2020-01-21 | 惠州市科伦特智能科技有限公司 | 多合一式mini-led灯 |
| US20230317889A1 (en) * | 2020-08-31 | 2023-10-05 | Shenzhen Jufei Optoelectronics Co., Ltd. | Led support, lamp bead and manufacturing method thereof, conductive base, and light-emitting unit module |
| TWD214869S (zh) * | 2021-01-08 | 2021-10-21 | 佳邦科技股份有限公司 | 天線 |
| CN114420826A (zh) * | 2022-01-18 | 2022-04-29 | 桂林博海电子有限公司 | 一种一次注塑成胶的八脚led支架 |
| KR20260045895A (ko) | 2023-10-07 | 2026-04-03 | 라디안트 (광저우) 옵토-엘렉트로닉스 컴퍼니 리미티드 | 광원 모듈 및 표시 장치 |
| WO2025073154A1 (zh) * | 2023-10-07 | 2025-04-10 | 瑞仪(广州)光电子器件有限公司 | 光源模组及显示装置 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61195075U (pl) * | 1985-05-27 | 1986-12-04 | ||
| ES2150706T3 (es) * | 1995-12-29 | 2000-12-01 | Cree Inc | Modulo de pantalla de panel plano de matriz de led de color verdadero con circuitos de activacion. |
| JPH10229221A (ja) * | 1997-02-17 | 1998-08-25 | Kouha:Kk | 発光ダイオード表示装置およびそれを利用した画像表示装置 |
| JP2001024390A (ja) * | 1999-07-09 | 2001-01-26 | Matsushita Electric Ind Co Ltd | 電子部品供給装置及び方法、並びに電子部品実装機 |
| JP2001125541A (ja) * | 1999-10-29 | 2001-05-11 | Seiwa Electric Mfg Co Ltd | Ledユニット駆動回路 |
| US6599768B1 (en) * | 2002-08-20 | 2003-07-29 | United Epitaxy Co., Ltd. | Surface mounting method for high power light emitting diode |
| WO2006016398A1 (ja) * | 2004-08-10 | 2006-02-16 | Renesas Technology Corp. | 発光装置および発光装置の製造方法 |
| JP2006119274A (ja) * | 2004-10-20 | 2006-05-11 | Nec Lighting Ltd | Led表示装置および表示制御方法 |
| JP4973213B2 (ja) * | 2007-01-31 | 2012-07-11 | 三菱電機株式会社 | 光源装置、面状光源装置および表示装置 |
| KR100997198B1 (ko) * | 2008-05-06 | 2010-11-29 | 김민공 | 프레스 단조 방식의 발광다이오드 금속제 하우징 및 금속제하우징을 이용한 발광다이오드 금속제 패키지 |
| JP2010086892A (ja) * | 2008-10-02 | 2010-04-15 | Sony Corp | 面状光源装置及び液晶表示装置組立体 |
| JP4905471B2 (ja) * | 2009-01-15 | 2012-03-28 | 日亜化学工業株式会社 | Led表示装置およびその使用方法 |
| CN101770748A (zh) * | 2010-01-12 | 2010-07-07 | 北京利亚德电子科技有限公司 | Led面板电视显示面板的扫描方法 |
| CN202352251U (zh) * | 2011-11-24 | 2012-07-25 | 深圳市丽晶光电科技股份有限公司 | 一种高密度led全彩点阵模块 |
| CN202549250U (zh) * | 2011-12-23 | 2012-11-21 | 深圳市奥伦德科技有限公司 | 一种高分辨率的led户内显示屏点阵模块 |
| CN102945845B (zh) * | 2012-11-13 | 2015-01-21 | 佛山市国星光电股份有限公司 | 一种显示屏用的led器件及显示模组 |
| US20160154170A1 (en) * | 2014-06-12 | 2016-06-02 | Nthdegree Technologies Worldwide Inc. | Ultra-thin display using thin flexible led light sheet |
-
2013
- 2013-03-26 JP JP2015561897A patent/JP2016512344A/ja active Pending
- 2013-03-26 PL PL13838095T patent/PL2802020T3/pl unknown
- 2013-03-26 EP EP13838095.1A patent/EP2802020B1/en active Active
- 2013-03-26 US US14/382,346 patent/US9494302B2/en active Active
- 2013-03-26 WO PCT/CN2013/073191 patent/WO2014139189A1/zh not_active Ceased
- 2013-08-23 TW TW102130336A patent/TW201435241A/zh unknown
-
2017
- 2017-06-28 JP JP2017002931U patent/JP3213621U/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US9494302B2 (en) | 2016-11-15 |
| EP2802020B1 (en) | 2016-10-05 |
| WO2014139189A1 (zh) | 2014-09-18 |
| US20150204525A1 (en) | 2015-07-23 |
| JP2016512344A (ja) | 2016-04-25 |
| EP2802020A4 (en) | 2015-04-15 |
| TW201435241A (zh) | 2014-09-16 |
| JP3213621U (ja) | 2017-11-24 |
| CN103178192A (zh) | 2013-06-26 |
| EP2802020A1 (en) | 2014-11-12 |
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