PL2812915T3 - DEVICE FOR TREATMENT OF SUBSTRATE - Google Patents
DEVICE FOR TREATMENT OF SUBSTRATEInfo
- Publication number
- PL2812915T3 PL2812915T3 PL13709538T PL13709538T PL2812915T3 PL 2812915 T3 PL2812915 T3 PL 2812915T3 PL 13709538 T PL13709538 T PL 13709538T PL 13709538 T PL13709538 T PL 13709538T PL 2812915 T3 PL2812915 T3 PL 2812915T3
- Authority
- PL
- Poland
- Prior art keywords
- substrate
- treatment
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
- H10P72/3218—Conveying cassettes, containers or carriers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
- H10P72/3311—Horizontal transfer of a batch of workpieces
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
- H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
- H10P72/3211—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102012100929A DE102012100929A1 (en) | 2012-02-06 | 2012-02-06 | Substrate processing system |
| EP13709538.6A EP2812915B1 (en) | 2012-02-06 | 2013-01-17 | Substrate treatment system |
| PCT/IB2013/050414 WO2013118003A1 (en) | 2012-02-06 | 2013-01-17 | Substrate treatment system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PL2812915T3 true PL2812915T3 (en) | 2021-11-22 |
Family
ID=47884424
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL13709538T PL2812915T3 (en) | 2012-02-06 | 2013-01-17 | DEVICE FOR TREATMENT OF SUBSTRATE |
Country Status (12)
| Country | Link |
|---|---|
| US (1) | US10199250B2 (en) |
| EP (2) | EP3916764B1 (en) |
| JP (1) | JP6282983B2 (en) |
| KR (1) | KR102033694B1 (en) |
| CN (1) | CN104115264B (en) |
| DE (1) | DE102012100929A1 (en) |
| ES (1) | ES2882593T3 (en) |
| HU (1) | HUE055426T2 (en) |
| PL (1) | PL2812915T3 (en) |
| PT (1) | PT2812915T (en) |
| TW (1) | TWI512878B (en) |
| WO (1) | WO2013118003A1 (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106531679B (en) * | 2015-09-10 | 2019-10-08 | 北京北方华创微电子装备有限公司 | Bogey and reaction chamber |
| TWI633644B (en) * | 2017-08-17 | 2018-08-21 | Siliconware Precision Industries Co., Ltd. | Printing device |
| DE102018123523A1 (en) * | 2018-09-25 | 2020-03-26 | Meyer Burger (Germany) Gmbh | Process module and system with at least one such process module |
| CN112582498A (en) * | 2019-09-30 | 2021-03-30 | 中国电子科技集团公司第四十八研究所 | Method for continuously producing crystalline silicon solar cells |
| CN113130345B (en) * | 2019-12-31 | 2023-12-08 | 中微半导体设备(上海)股份有限公司 | Substrate processing system and maintenance method |
| CN111063768A (en) * | 2020-01-07 | 2020-04-24 | 晶澳太阳能有限公司 | MAIA downloads storehouse air feeder |
| CN116848629A (en) * | 2021-02-17 | 2023-10-03 | 应用材料公司 | Modular mainframe layout for supporting multiple semiconductor processing modules or chambers |
| DE102023128552A1 (en) * | 2023-10-18 | 2025-04-24 | Aixtron Se | Loading and unloading cycle for a CVD reactor system |
Family Cites Families (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0731539Y2 (en) * | 1989-02-15 | 1995-07-19 | 富士通株式会社 | Substrate processing equipment |
| JP2644912B2 (en) | 1990-08-29 | 1997-08-25 | 株式会社日立製作所 | Vacuum processing apparatus and operating method thereof |
| JPH04154145A (en) * | 1990-10-18 | 1992-05-27 | Fuji Electric Co Ltd | Treatment apparatus of semiconductor wafer |
| JP3965343B2 (en) * | 1994-08-19 | 2007-08-29 | 東京エレクトロン株式会社 | Processing equipment |
| JPH08213446A (en) * | 1994-12-08 | 1996-08-20 | Tokyo Electron Ltd | Processing equipment |
| US6308818B1 (en) * | 1999-08-02 | 2001-10-30 | Asyst Technologies, Inc. | Transport system with integrated transport carrier and directors |
| JP2001135704A (en) | 1999-11-09 | 2001-05-18 | Sharp Corp | Substrate processing apparatus and substrate transfer tray transfer control method |
| JP4753224B2 (en) * | 2000-08-22 | 2011-08-24 | 日本エー・エス・エム株式会社 | Gas line system |
| US6630053B2 (en) | 2000-08-22 | 2003-10-07 | Asm Japan K.K. | Semiconductor processing module and apparatus |
| JP2002141398A (en) * | 2000-11-02 | 2002-05-17 | Kobe Steel Ltd | Apparatus and method of surface treatment |
| JP2002261146A (en) | 2001-03-02 | 2002-09-13 | Hitachi Ltd | Semiconductor integrated circuit device manufacturing method and semiconductor manufacturing device |
| JP2002332570A (en) * | 2001-05-08 | 2002-11-22 | Anelva Corp | Substrate processing equipment |
| JP2003142393A (en) | 2001-11-07 | 2003-05-16 | Tokyo Seimitsu Co Ltd | Electron beam exposure system |
| CN1293621C (en) * | 2002-05-23 | 2007-01-03 | 安内华株式会社 | Substrate processing device and substrate processing method |
| JP2004018215A (en) * | 2002-06-18 | 2004-01-22 | Tokyo Electron Ltd | Heat treatment apparatus and method for flat panel display |
| JP4245387B2 (en) * | 2003-03-19 | 2009-03-25 | 東京エレクトロン株式会社 | Substrate transport apparatus and substrate processing apparatus |
| JP2004349503A (en) * | 2003-05-22 | 2004-12-09 | Tokyo Electron Ltd | Processing system and processing method for object to be processed |
| JP2005142200A (en) | 2003-11-04 | 2005-06-02 | Sharp Corp | Vapor growth apparatus and vapor growth method |
| US20070269297A1 (en) * | 2003-11-10 | 2007-11-22 | Meulen Peter V D | Semiconductor wafer handling and transport |
| JP4376737B2 (en) * | 2004-08-31 | 2009-12-02 | 学校法人東京理科大学 | Non-contact chuck |
| US20070031609A1 (en) * | 2005-07-29 | 2007-02-08 | Ajay Kumar | Chemical vapor deposition chamber with dual frequency bias and method for manufacturing a photomask using the same |
| JP5330721B2 (en) | 2007-10-23 | 2013-10-30 | オルボテック エルティ ソラー，エルエルシー | Processing apparatus and processing method |
| JP4997141B2 (en) * | 2008-02-21 | 2012-08-08 | 株式会社アルバック | Vacuum processing apparatus and substrate temperature control method |
| WO2010042577A2 (en) * | 2008-10-07 | 2010-04-15 | Applied Materials, Inc. | Advanced platform for processing crystalline silicon solar cells |
| JP2010109089A (en) * | 2008-10-29 | 2010-05-13 | Kyocera Corp | Conveyance device, and method of manufacturing film-formed substrate |
| US8246284B2 (en) * | 2009-03-05 | 2012-08-21 | Applied Materials, Inc. | Stacked load-lock apparatus and method for high throughput solar cell manufacturing |
| IT1394811B1 (en) | 2009-07-08 | 2012-07-13 | Applied Materials Inc | APPARATUS AND PROCEDURE FOR THE MANIPULATION OF DAMAGED SUBSTRATES IN SUBSTRATE PROCESSING SYSTEMS |
| JP5402542B2 (en) | 2009-11-06 | 2014-01-29 | 村田機械株式会社 | Non-contact holding device and transfer device |
| TWI436831B (en) * | 2009-12-10 | 2014-05-11 | 沃博提克Ｌｔ太陽公司 | Spray head assembly for vacuum processing unit |
| US20110245957A1 (en) * | 2010-04-06 | 2011-10-06 | Applied Materials, Inc. | Advanced platform for processing crystalline silicon solar cells |
| DE102010016512A1 (en) * | 2010-04-19 | 2011-10-20 | Roth & Rau Ag | Flow-through system e.g. diffusion furnace, for heat treatment of glass panes in glass industry, has planar glass substrates comprising transport layers arranged one above other in process chamber, where substrates are processed by chamber |
| JP5452349B2 (en) * | 2010-05-11 | 2014-03-26 | 東京エレクトロン株式会社 | To-be-processed object conveying method, to-be-treated object conveying apparatus, and program |
| WO2011148924A1 (en) | 2010-05-24 | 2011-12-01 | 株式会社アルバック | Film forming device |
| KR101329303B1 (en) * | 2010-06-17 | 2013-11-20 | 세메스 주식회사 | Substrates processing apparatus for loading/unloading of substrates |
| DE102010017497A1 (en) * | 2010-06-21 | 2011-12-22 | Roth & Rau Ag | Loading and/or unloading device for substrate processing equipment, has conveyor comprising centering device, where equipment exhibits control for movement of conveyor, centering device, elements, lifting and lowering device and array |
| US20130108406A1 (en) * | 2011-11-02 | 2013-05-02 | Varian Semiconductor Equipment Associates, Inc. | High-throughput workpiece handling |
-
2012
- 2012-02-06 DE DE102012100929A patent/DE102012100929A1/en not_active Ceased
-
2013
- 2013-01-17 US US14/376,913 patent/US10199250B2/en active Active
- 2013-01-17 ES ES13709538T patent/ES2882593T3/en active Active
- 2013-01-17 KR KR1020147023259A patent/KR102033694B1/en active Active
- 2013-01-17 PT PT137095386T patent/PT2812915T/en unknown
- 2013-01-17 EP EP21177601.8A patent/EP3916764B1/en active Active
- 2013-01-17 HU HUE13709538A patent/HUE055426T2/en unknown
- 2013-01-17 PL PL13709538T patent/PL2812915T3/en unknown
- 2013-01-17 CN CN201380008076.2A patent/CN104115264B/en active Active
- 2013-01-17 WO PCT/IB2013/050414 patent/WO2013118003A1/en not_active Ceased
- 2013-01-17 JP JP2014556152A patent/JP6282983B2/en active Active
- 2013-01-17 EP EP13709538.6A patent/EP2812915B1/en active Active
- 2013-01-24 TW TW102102646A patent/TWI512878B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| TW201349374A (en) | 2013-12-01 |
| WO2013118003A1 (en) | 2013-08-15 |
| TWI512878B (en) | 2015-12-11 |
| KR102033694B1 (en) | 2019-10-17 |
| CN104115264B (en) | 2017-03-22 |
| JP2015512152A (en) | 2015-04-23 |
| US20140369791A1 (en) | 2014-12-18 |
| EP2812915A1 (en) | 2014-12-17 |
| EP2812915B1 (en) | 2021-07-07 |
| JP6282983B2 (en) | 2018-02-21 |
| KR20140129038A (en) | 2014-11-06 |
| US10199250B2 (en) | 2019-02-05 |
| PT2812915T (en) | 2021-08-19 |
| DE102012100929A1 (en) | 2013-08-08 |
| HUE055426T2 (en) | 2021-11-29 |
| ES2882593T3 (en) | 2021-12-02 |
| CN104115264A (en) | 2014-10-22 |
| EP3916764A1 (en) | 2021-12-01 |
| EP3916764B1 (en) | 2022-09-14 |
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