PL2812915T3 - Urządzenie do obróbki substratu - Google Patents
Urządzenie do obróbki substratuInfo
- Publication number
- PL2812915T3 PL2812915T3 PL13709538T PL13709538T PL2812915T3 PL 2812915 T3 PL2812915 T3 PL 2812915T3 PL 13709538 T PL13709538 T PL 13709538T PL 13709538 T PL13709538 T PL 13709538T PL 2812915 T3 PL2812915 T3 PL 2812915T3
- Authority
- PL
- Poland
- Prior art keywords
- substrate
- treatment
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
- H10P72/3218—Conveying cassettes, containers or carriers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
- H10P72/3311—Horizontal transfer of a batch of workpieces
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
- H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
- H10P72/3211—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102012100929A DE102012100929A1 (de) | 2012-02-06 | 2012-02-06 | Substratbearbeitungsanlage |
| EP13709538.6A EP2812915B1 (de) | 2012-02-06 | 2013-01-17 | Substratbearbeitungsanlage |
| PCT/IB2013/050414 WO2013118003A1 (de) | 2012-02-06 | 2013-01-17 | Substratbearbeitungsanlage |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PL2812915T3 true PL2812915T3 (pl) | 2021-11-22 |
Family
ID=47884424
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL13709538T PL2812915T3 (pl) | 2012-02-06 | 2013-01-17 | Urządzenie do obróbki substratu |
Country Status (12)
| Country | Link |
|---|---|
| US (1) | US10199250B2 (pl) |
| EP (2) | EP2812915B1 (pl) |
| JP (1) | JP6282983B2 (pl) |
| KR (1) | KR102033694B1 (pl) |
| CN (1) | CN104115264B (pl) |
| DE (1) | DE102012100929A1 (pl) |
| ES (1) | ES2882593T3 (pl) |
| HU (1) | HUE055426T2 (pl) |
| PL (1) | PL2812915T3 (pl) |
| PT (1) | PT2812915T (pl) |
| TW (1) | TWI512878B (pl) |
| WO (1) | WO2013118003A1 (pl) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106531679B (zh) * | 2015-09-10 | 2019-10-08 | 北京北方华创微电子装备有限公司 | 承载装置及反应腔室 |
| TWI633644B (zh) * | 2017-08-17 | 2018-08-21 | Siliconware Precision Industries Co., Ltd. | 打印設備 |
| DE102018123523A1 (de) * | 2018-09-25 | 2020-03-26 | Meyer Burger (Germany) Gmbh | Prozessmodul und Anlage mit wenigstens einem solchen Prozessmodul |
| CN112582498A (zh) * | 2019-09-30 | 2021-03-30 | 中国电子科技集团公司第四十八研究所 | 一种连续式生产晶体硅太阳能电池的方法 |
| CN113130345B (zh) * | 2019-12-31 | 2023-12-08 | 中微半导体设备(上海)股份有限公司 | 基片处理系统及其维护方法 |
| CN111063768A (zh) * | 2020-01-07 | 2020-04-24 | 晶澳太阳能有限公司 | 一种maia下载仓供气装置 |
| CN116848629A (zh) * | 2021-02-17 | 2023-10-03 | 应用材料公司 | 用于支持多个半导体处理模块或腔室的模块化主机布局 |
| DE102023128552A1 (de) * | 2023-10-18 | 2025-04-24 | Aixtron Se | Be- und Entladezyklus für ein CVD-Reaktorsystem |
Family Cites Families (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0731539Y2 (ja) * | 1989-02-15 | 1995-07-19 | 富士通株式会社 | 基板処理装置 |
| JP2644912B2 (ja) * | 1990-08-29 | 1997-08-25 | 株式会社日立製作所 | 真空処理装置及びその運転方法 |
| JPH04154145A (ja) * | 1990-10-18 | 1992-05-27 | Fuji Electric Co Ltd | 半導体ウェハ処理装置 |
| JP3965343B2 (ja) * | 1994-08-19 | 2007-08-29 | 東京エレクトロン株式会社 | 処理装置 |
| JPH08213446A (ja) * | 1994-12-08 | 1996-08-20 | Tokyo Electron Ltd | 処理装置 |
| US6308818B1 (en) * | 1999-08-02 | 2001-10-30 | Asyst Technologies, Inc. | Transport system with integrated transport carrier and directors |
| JP2001135704A (ja) * | 1999-11-09 | 2001-05-18 | Sharp Corp | 基板処理装置及び基板搬送用トレイの搬送制御方法 |
| JP4753224B2 (ja) * | 2000-08-22 | 2011-08-24 | 日本エー・エス・エム株式会社 | ガスラインシステム |
| US6630053B2 (en) | 2000-08-22 | 2003-10-07 | Asm Japan K.K. | Semiconductor processing module and apparatus |
| JP2002141398A (ja) * | 2000-11-02 | 2002-05-17 | Kobe Steel Ltd | 表面処理装置および表面処理方法 |
| JP2002261146A (ja) | 2001-03-02 | 2002-09-13 | Hitachi Ltd | 半導体集積回路装置の製造方法および半導体製造装置 |
| JP2002332570A (ja) | 2001-05-08 | 2002-11-22 | Anelva Corp | 基板処理装置 |
| JP2003142393A (ja) | 2001-11-07 | 2003-05-16 | Tokyo Seimitsu Co Ltd | 電子ビーム露光装置 |
| JP4369866B2 (ja) * | 2002-05-23 | 2009-11-25 | キヤノンアネルバ株式会社 | 基板処理装置及び処理方法 |
| JP2004018215A (ja) * | 2002-06-18 | 2004-01-22 | Tokyo Electron Ltd | フラット・パネル・ディスプレイ用熱処理装置及び熱処理方法 |
| JP4245387B2 (ja) | 2003-03-19 | 2009-03-25 | 東京エレクトロン株式会社 | 基板搬送装置及び基板処理装置 |
| JP2004349503A (ja) * | 2003-05-22 | 2004-12-09 | Tokyo Electron Ltd | 被処理体の処理システム及び処理方法 |
| JP2005142200A (ja) | 2003-11-04 | 2005-06-02 | Sharp Corp | 気相成長装置および気相成長方法 |
| US20070269297A1 (en) * | 2003-11-10 | 2007-11-22 | Meulen Peter V D | Semiconductor wafer handling and transport |
| JP4376737B2 (ja) * | 2004-08-31 | 2009-12-02 | 学校法人東京理科大学 | 非接触チャック |
| US20070031609A1 (en) | 2005-07-29 | 2007-02-08 | Ajay Kumar | Chemical vapor deposition chamber with dual frequency bias and method for manufacturing a photomask using the same |
| JP5330721B2 (ja) | 2007-10-23 | 2013-10-30 | オルボテック エルティ ソラー，エルエルシー | 処理装置および処理方法 |
| JP4997141B2 (ja) * | 2008-02-21 | 2012-08-08 | 株式会社アルバック | 真空処理装置、基板の温度制御方法 |
| TW201027784A (en) * | 2008-10-07 | 2010-07-16 | Applied Materials Inc | Advanced platform for processing crystalline silicon solar cells |
| JP2010109089A (ja) * | 2008-10-29 | 2010-05-13 | Kyocera Corp | 搬送装置および成膜基板の製造方法 |
| US8246284B2 (en) * | 2009-03-05 | 2012-08-21 | Applied Materials, Inc. | Stacked load-lock apparatus and method for high throughput solar cell manufacturing |
| IT1394811B1 (it) | 2009-07-08 | 2012-07-13 | Applied Materials Inc | Apparato e procedimento per la manipolazione di substrati danneggiati in sistemi di lavorazione substrati |
| JP5402542B2 (ja) | 2009-11-06 | 2014-01-29 | 村田機械株式会社 | 非接触保持装置及び移載装置 |
| JP5835722B2 (ja) * | 2009-12-10 | 2015-12-24 | オルボテック エルティ ソラー，エルエルシー | 自動順位付け多方向直列型処理装置 |
| US20110245957A1 (en) | 2010-04-06 | 2011-10-06 | Applied Materials, Inc. | Advanced platform for processing crystalline silicon solar cells |
| DE102010016512A1 (de) * | 2010-04-19 | 2011-10-20 | Roth & Rau Ag | Mehrtagen-Rollenofen |
| JP5452349B2 (ja) * | 2010-05-11 | 2014-03-26 | 東京エレクトロン株式会社 | 被処理体の搬送方法、被処理体の搬送装置、及び、プログラム |
| WO2011148924A1 (ja) | 2010-05-24 | 2011-12-01 | 株式会社アルバック | 成膜装置 |
| KR101329303B1 (ko) * | 2010-06-17 | 2013-11-20 | 세메스 주식회사 | 기판들의 로딩 및 언로딩을 위한 기판 처리 장치 |
| DE102010017497A1 (de) * | 2010-06-21 | 2011-12-22 | Roth & Rau Ag | Vorrichtung und Verfahren zum Be-und Entladen von Substratträgerarrays |
| US20130108406A1 (en) * | 2011-11-02 | 2013-05-02 | Varian Semiconductor Equipment Associates, Inc. | High-throughput workpiece handling |
-
2012
- 2012-02-06 DE DE102012100929A patent/DE102012100929A1/de not_active Ceased
-
2013
- 2013-01-17 ES ES13709538T patent/ES2882593T3/es active Active
- 2013-01-17 HU HUE13709538A patent/HUE055426T2/hu unknown
- 2013-01-17 CN CN201380008076.2A patent/CN104115264B/zh active Active
- 2013-01-17 KR KR1020147023259A patent/KR102033694B1/ko active Active
- 2013-01-17 US US14/376,913 patent/US10199250B2/en active Active
- 2013-01-17 WO PCT/IB2013/050414 patent/WO2013118003A1/de not_active Ceased
- 2013-01-17 EP EP13709538.6A patent/EP2812915B1/de active Active
- 2013-01-17 PT PT137095386T patent/PT2812915T/pt unknown
- 2013-01-17 PL PL13709538T patent/PL2812915T3/pl unknown
- 2013-01-17 JP JP2014556152A patent/JP6282983B2/ja active Active
- 2013-01-17 EP EP21177601.8A patent/EP3916764B1/de active Active
- 2013-01-24 TW TW102102646A patent/TWI512878B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| TW201349374A (zh) | 2013-12-01 |
| US20140369791A1 (en) | 2014-12-18 |
| WO2013118003A1 (de) | 2013-08-15 |
| EP2812915B1 (de) | 2021-07-07 |
| PT2812915T (pt) | 2021-08-19 |
| CN104115264B (zh) | 2017-03-22 |
| EP3916764B1 (de) | 2022-09-14 |
| CN104115264A (zh) | 2014-10-22 |
| EP3916764A1 (de) | 2021-12-01 |
| KR20140129038A (ko) | 2014-11-06 |
| US10199250B2 (en) | 2019-02-05 |
| ES2882593T3 (es) | 2021-12-02 |
| JP2015512152A (ja) | 2015-04-23 |
| DE102012100929A1 (de) | 2013-08-08 |
| JP6282983B2 (ja) | 2018-02-21 |
| TWI512878B (zh) | 2015-12-11 |
| KR102033694B1 (ko) | 2019-10-17 |
| HUE055426T2 (hu) | 2021-11-29 |
| EP2812915A1 (de) | 2014-12-17 |
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