PL3031566T3 - Bezołowiowy stop lutowniczy - Google Patents

Bezołowiowy stop lutowniczy

Info

Publication number
PL3031566T3
PL3031566T3 PL14833782T PL14833782T PL3031566T3 PL 3031566 T3 PL3031566 T3 PL 3031566T3 PL 14833782 T PL14833782 T PL 14833782T PL 14833782 T PL14833782 T PL 14833782T PL 3031566 T3 PL3031566 T3 PL 3031566T3
Authority
PL
Poland
Prior art keywords
lead
free solder
solder alloy
alloy
free
Prior art date
Application number
PL14833782T
Other languages
English (en)
Inventor
Ken Tachibana
Hikaru Nomura
Kyu-Oh Lee
Original Assignee
Senju Metal Industry Co., Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co., Ltd filed Critical Senju Metal Industry Co., Ltd
Publication of PL3031566T3 publication Critical patent/PL3031566T3/pl

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/264—Bi as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B32B15/018—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of a noble metal or a noble metal alloy
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C12/00—Alloys based on antimony or bismuth
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/38—Conductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Chemically Coating (AREA)
PL14833782T 2013-08-05 2014-08-01 Bezołowiowy stop lutowniczy PL3031566T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/959,224 US20150037087A1 (en) 2013-08-05 2013-08-05 Lead-Free Solder Alloy
EP14833782.7A EP3031566B1 (en) 2013-08-05 2014-08-01 Lead-free solder alloy
PCT/JP2014/070374 WO2015019966A1 (ja) 2013-08-05 2014-08-01 鉛フリーはんだ合金

Publications (1)

Publication Number Publication Date
PL3031566T3 true PL3031566T3 (pl) 2019-01-31

Family

ID=52427800

Family Applications (1)

Application Number Title Priority Date Filing Date
PL14833782T PL3031566T3 (pl) 2013-08-05 2014-08-01 Bezołowiowy stop lutowniczy

Country Status (8)

Country Link
US (1) US20150037087A1 (pl)
EP (1) EP3031566B1 (pl)
JP (1) JP5679094B1 (pl)
KR (1) KR102002675B1 (pl)
CN (1) CN105451928A (pl)
PL (1) PL3031566T3 (pl)
TW (1) TWI604062B (pl)
WO (1) WO2015019966A1 (pl)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2016294430B2 (en) 2015-07-15 2018-11-29 Cabot Corporation Elastomer composite reinforced with silica and products containing same
JP6730833B2 (ja) * 2016-03-31 2020-07-29 株式会社タムラ製作所 はんだ合金およびはんだ組成物
CN106180939A (zh) * 2016-08-05 2016-12-07 苏州锡友微连电子科技有限公司 激光回流焊用的焊膏
CN106216872B (zh) * 2016-08-11 2019-03-12 北京康普锡威科技有限公司 一种SnBiSb系低温无铅焊料及其制备方法
EP3696850A3 (en) * 2016-09-12 2020-11-11 Interflux Electronics N.V. Method of soldering an electronic component to a substrate with the use of a solder paste comprising a lead-free solder alloy consisting of sn, bi and at least one of sb and mn
JP6477965B1 (ja) 2018-03-08 2019-03-06 千住金属工業株式会社 はんだ合金、はんだペースト、はんだボール、やに入りはんだおよびはんだ継手
JP6804126B1 (ja) * 2019-04-11 2020-12-23 株式会社日本スペリア社 鉛フリーはんだ合金及びはんだ接合部
JP6998994B2 (ja) * 2020-07-03 2022-02-10 株式会社タムラ製作所 はんだ合金およびはんだ組成物
JP7835370B2 (ja) * 2020-09-30 2026-03-25 株式会社日本スペリア社 鉛フリーはんだ合金及びはんだ接合部
WO2022070910A1 (ja) * 2020-10-01 2022-04-07 アートビーム有限会社 低温半田、低温半田の製造方法、および低温半田被覆リード線
JP7887121B2 (ja) * 2021-11-27 2026-07-09 守弘 岡田 低温半田、低温半田の製造方法、および低温半田被覆リード線
CN115383349B (zh) * 2022-10-09 2023-11-07 云南锡业集团（控股）有限责任公司研发中心 微合金化调控微观结构获得高韧性无铅锡铋焊料的方法
CN116493805A (zh) * 2023-03-27 2023-07-28 大连理工大学 一种In和Sb强化的Sn24-x-yBi18InxSby低温无铅焊料及其制备方法

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06102579B2 (ja) * 1986-04-24 1994-12-14 日本電信電話株式会社 セラミツク用はんだ
US4941929A (en) * 1989-08-24 1990-07-17 E. I. Du Pont De Nemours And Company Solder paste formulation containing stannous fluoride
US5411703A (en) * 1993-06-16 1995-05-02 International Business Machines Corporation Lead-free, tin, antimony, bismtuh, copper solder alloy
JP2681742B2 (ja) 1993-07-28 1997-11-26 株式会社日本スペリア社 無鉛はんだ合金
EP0787819B1 (de) * 1996-01-31 1999-12-22 LEYBOLD MATERIALS GmbH Sputtertarget aus einer Zinn- oder Zinn-Basislegierung
EP1009202B1 (en) * 1997-06-04 2007-10-17 Ibiden Co., Ltd. Soldering member for printed wiring boards
US6156132A (en) * 1998-02-05 2000-12-05 Fuji Electric Co., Ltd. Solder alloys
JP3353686B2 (ja) * 1998-02-05 2002-12-03 富士電機株式会社 はんだ合金
JP3829475B2 (ja) 1998-05-13 2006-10-04 株式会社村田製作所 Ｃｕ系母材接合用のはんだ組成物
KR100310150B1 (ko) * 1999-07-26 2001-09-29 윤종용 전자렌지의 트랜스포머용 코일의 수지성형방법
JP4338854B2 (ja) * 1999-11-25 2009-10-07 三井金属鉱業株式会社 スズ−ビスマス系無鉛はんだ
US20040241039A1 (en) * 2000-10-27 2004-12-02 H-Technologies Group High temperature lead-free solder compositions
JP2002180226A (ja) * 2000-12-12 2002-06-26 Totoku Electric Co Ltd 無鉛錫合金はんだめっき線
EP1266975A1 (de) * 2001-06-12 2002-12-18 ESEC Trading SA Bleifreies Lötmittel
TW592872B (en) * 2001-06-28 2004-06-21 Senju Metal Industry Co Lead-free solder alloy
JP2004017093A (ja) 2002-06-17 2004-01-22 Toshiba Corp 鉛フリーはんだ合金、及びこれを用いた鉛フリーはんだペースト
US6825564B2 (en) * 2002-08-21 2004-11-30 Micron Technology, Inc. Nickel bonding cap over copper metalized bondpads
US20060060639A1 (en) * 2004-09-21 2006-03-23 Byrne Tiffany A Doped contact formations
US8887980B2 (en) * 2005-06-10 2014-11-18 Senju Metal Industry Co., Ltd. Method of soldering portions plated by electroless Ni plating
JP2007090407A (ja) 2005-09-30 2007-04-12 Toshiba Corp 電子部品の接合材料、プリント回路配線基板、及び電子機器
CN1927525B (zh) * 2006-08-11 2010-11-24 北京有色金属研究总院 一种无银的锡铋铜系无铅焊料及其制备方法
JPWO2008023452A1 (ja) * 2006-08-25 2010-01-07 住友ベークライト株式会社 接着テープ、接合体および半導体パッケージ
KR20080015927A (ko) * 2008-01-09 2008-02-20 센주긴조쿠고교 가부시키가이샤 무전해 Ｎｉ 도금부의 납땜 방법
US7980863B1 (en) * 2008-02-14 2011-07-19 Metrospec Technology, Llc Printed circuit board flexible interconnect design
CN101348875A (zh) * 2008-06-04 2009-01-21 厦门市及时雨焊料有限公司 一种锡铋铜型低温无铅焊料合金
JP5245568B2 (ja) * 2008-06-23 2013-07-24 新日鉄住金マテリアルズ株式会社 無鉛ハンダ合金、ハンダボール及びハンダバンプを有する電子部材
JP5169871B2 (ja) * 2009-01-26 2013-03-27 富士通株式会社 はんだ、はんだ付け方法及び半導体装置
JP5584427B2 (ja) * 2009-04-14 2014-09-03 新日鉄住金マテリアルズ株式会社 無鉛ハンダ合金、ハンダボール及びハンダバンプを有する電子部材
KR20130137122A (ko) * 2010-06-30 2013-12-16 센주긴조쿠고교 가부시키가이샤 Ｂｉ-Ｓｎ계 고온 땜납 합금
TW201210733A (en) * 2010-08-26 2012-03-16 Dynajoin Corp Variable melting point solders
CN102029479A (zh) * 2010-12-29 2011-04-27 广州有色金属研究院 一种低银无铅焊料合金及其制备方法和装置
JP5724411B2 (ja) * 2011-01-31 2015-05-27 富士通株式会社 はんだ、はんだ付け方法及び半導体装置
JP2013000744A (ja) * 2011-06-10 2013-01-07 Nihon Superior Co Ltd 鉛フリーはんだ合金及び当該はんだを用いたはんだ接合部
MX2014001248A (es) * 2011-08-02 2014-10-24 Alpha Metals Aleacion de soldadura con alta tenacidad al impacto.
JP2014146652A (ja) * 2013-01-28 2014-08-14 Toppan Printing Co Ltd 配線基板およびその製造方法

Also Published As

Publication number Publication date
JP5679094B1 (ja) 2015-03-04
US20150037087A1 (en) 2015-02-05
WO2015019966A1 (ja) 2015-02-12
TWI604062B (zh) 2017-11-01
TW201522655A (zh) 2015-06-16
JPWO2015019966A1 (ja) 2017-03-02
EP3031566B1 (en) 2018-06-20
KR20160040655A (ko) 2016-04-14
EP3031566A4 (en) 2017-05-10
CN105451928A (zh) 2016-03-30
KR102002675B1 (ko) 2019-07-23
EP3031566A1 (en) 2016-06-15

Similar Documents

Publication Publication Date Title
SG11201603421PA (en) Lead-free, silver-free solder alloys
SG11201508575XA (en) Lead-free solder alloy
SG11201608933SA (en) Lead-free solder alloy
PL2945772T3 (pl) Stopy lutownicze
GB201502723D0 (en) Solder alloy
EP3027350B8 (en) Brazing alloys
EP3056578A4 (en) Copper alloy
EP3031566A4 (en) Lead-free solder alloy
SG11201505623XA (en) Pb-FREE SOLDER ALLOY
EP3000554A4 (en) Solder paste
SG11201408766YA (en) Lead-free solder ball
PL3597356T3 (pl) Stop lutowniczy
EP2937432A4 (en) LEAD-FREE MEASUREMENT ALLOY
GB201320170D0 (en) Metal component forming
EP3077151A4 (en) Zinc-based lead-free solder compositions
PT3006582T (pt) Fio de liga de cobre
GB201410093D0 (en) Solder flux
PL3159435T3 (pl) Dodatek do elektrolitów do stopu srebro-palladowego
SG11201600900SA (en) Lead-free solder alloy
GB201312000D0 (en) Alloy
PL2992120T3 (pl) Kompozycja stopu
EP2992553A4 (en) Lead frame construct for lead-free solder connections
GB201411157D0 (en) Silver alloy compositions and processes
SG11201606845TA (en) Brazing and soldering alloy wires
EP2974818A4 (en) SOLDER ALLOY AND SEAL BASED THEREON