PL3117465T3 - Heterozłączowy tranzystor polowy - Google Patents
Heterozłączowy tranzystor polowyInfo
- Publication number
- PL3117465T3 PL3117465T3 PL15717017.6T PL15717017T PL3117465T3 PL 3117465 T3 PL3117465 T3 PL 3117465T3 PL 15717017 T PL15717017 T PL 15717017T PL 3117465 T3 PL3117465 T3 PL 3117465T3
- Authority
- PL
- Poland
- Prior art keywords
- field effect
- effect transistor
- heterojunction field
- heterojunction
- transistor
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/40—FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels
- H10D30/47—FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels having two-dimensional [2D] charge carrier gas channels, e.g. nanoribbon FETs or high electron mobility transistors [HEMT]
- H10D30/471—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT]
- H10D30/473—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT] having confinement of carriers by multiple heterojunctions, e.g. quantum well HEMT
- H10D30/4732—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT] having confinement of carriers by multiple heterojunctions, e.g. quantum well HEMT using Group III-V semiconductor material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/80—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/015—Manufacture or treatment of FETs having heterojunction interface channels or heterojunction gate electrodes, e.g. HEMT
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/13—Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
- H10D62/149—Source or drain regions of field-effect devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/40—Crystalline structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/85—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
- H10D62/8503—Nitride Group III-V materials, e.g. AlN or GaN
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/85—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
- H10D62/854—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs further characterised by the dopants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/24—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using chemical vapour deposition [CVD]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
- H10P14/3414—Deposited materials, e.g. layers characterised by the chemical composition being group IIIA-VIA materials
- H10P14/3416—Nitrides
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3466—Crystal orientation
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR1452132A FR3018629B1 (fr) | 2014-03-14 | 2014-03-14 | Structure semiconductrice formant transistor hemt |
| PCT/FR2015/050600 WO2015136218A1 (fr) | 2014-03-14 | 2015-03-10 | Transistor a effet de champ et a heterojonction. |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PL3117465T3 true PL3117465T3 (pl) | 2022-11-28 |
Family
ID=51014442
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL15717017.6T PL3117465T3 (pl) | 2014-03-14 | 2015-03-10 | Heterozłączowy tranzystor polowy |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US10340376B2 (pl) |
| EP (1) | EP3117465B1 (pl) |
| JP (1) | JP6933466B2 (pl) |
| KR (1) | KR102329663B1 (pl) |
| ES (1) | ES2927683T3 (pl) |
| FR (1) | FR3018629B1 (pl) |
| PL (1) | PL3117465T3 (pl) |
| RU (1) | RU2686575C2 (pl) |
| TW (1) | TWI675480B (pl) |
| WO (1) | WO2015136218A1 (pl) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6627408B2 (ja) * | 2015-10-21 | 2020-01-08 | 住友電気工業株式会社 | 半導体装置及び半導体装置の製造方法 |
| US10388753B1 (en) * | 2017-03-31 | 2019-08-20 | National Technology & Engineering Solutions Of Sandia, Llc | Regrowth method for fabricating wide-bandgap transistors, and devices made thereby |
| JP7013710B2 (ja) * | 2017-08-07 | 2022-02-01 | 住友電気工業株式会社 | 窒化物半導体トランジスタの製造方法 |
| CN107742644B (zh) * | 2017-10-30 | 2024-05-28 | 中山大学 | 一种高性能常关型的GaN场效应晶体管及其制备方法 |
| JP7099255B2 (ja) * | 2018-11-01 | 2022-07-12 | 富士通株式会社 | 化合物半導体装置、高周波増幅器及び電源装置 |
| US10964803B2 (en) | 2018-11-19 | 2021-03-30 | Texas Instruments Incorporated | Gallium nitride transistor with a doped region |
| JP2021144993A (ja) | 2020-03-10 | 2021-09-24 | 富士通株式会社 | 半導体装置 |
| US11978790B2 (en) | 2020-12-01 | 2024-05-07 | Texas Instruments Incorporated | Normally-on gallium nitride based transistor with p-type gate |
| JP7620203B2 (ja) * | 2021-04-22 | 2025-01-23 | 富士通株式会社 | 半導体装置、半導体装置の製造方法及び電子装置 |
| JP7687940B2 (ja) * | 2021-12-14 | 2025-06-03 | 株式会社東芝 | 半導体装置 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001135575A (ja) * | 1999-03-12 | 2001-05-18 | Sumitomo Chem Co Ltd | 3−5族化合物半導体 |
| JP4742399B2 (ja) * | 1999-03-12 | 2011-08-10 | 住友化学株式会社 | 3−5族化合物半導体の製造方法 |
| JP3518455B2 (ja) * | 1999-12-15 | 2004-04-12 | 日亜化学工業株式会社 | 窒化物半導体基板の作製方法 |
| JP3430206B2 (ja) * | 2000-06-16 | 2003-07-28 | 学校法人 名城大学 | 半導体素子の製造方法及び半導体素子 |
| US7432142B2 (en) * | 2004-05-20 | 2008-10-07 | Cree, Inc. | Methods of fabricating nitride-based transistors having regrown ohmic contact regions |
| JP2006013006A (ja) * | 2004-06-23 | 2006-01-12 | Shin Etsu Handotai Co Ltd | 半導体複合基板及びそれを用いた化合物半導体素子 |
| JP2008085215A (ja) * | 2006-09-28 | 2008-04-10 | Oki Electric Ind Co Ltd | 半導体装置の製造方法 |
| JP2008124262A (ja) * | 2006-11-13 | 2008-05-29 | Oki Electric Ind Co Ltd | 選択再成長を用いたAlGaN/GaN−HEMTの製造方法 |
| US8017933B2 (en) * | 2008-06-30 | 2011-09-13 | Intel Corporation | Compositionally-graded quantum-well channels for semiconductor devices |
| WO2010118087A1 (en) * | 2009-04-08 | 2010-10-14 | Efficient Power Conversion Corporation | Enhancement mode gan hemt device and method for fabricating the same |
| JP5702058B2 (ja) * | 2009-08-28 | 2015-04-15 | 日本碍子株式会社 | 半導体素子用エピタキシャル基板、半導体素子、および、半導体素子用エピタキシャル基板の作製方法 |
| KR101890749B1 (ko) * | 2011-10-27 | 2018-08-23 | 삼성전자주식회사 | 전극구조체, 이를 포함하는 질화갈륨계 반도체소자 및 이들의 제조방법 |
| JP5881383B2 (ja) * | 2011-11-17 | 2016-03-09 | 株式会社豊田中央研究所 | 半導体装置とその製造方法 |
| US10164038B2 (en) * | 2013-01-30 | 2018-12-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of implanting dopants into a group III-nitride structure and device formed |
| RU136238U1 (ru) * | 2013-07-04 | 2013-12-27 | Открытое акционерное общество "Научно-производственное предприятие "Пульсар" | Гетероструктурный модулировано-легированный полевой транзистор |
| US9159822B2 (en) * | 2014-02-24 | 2015-10-13 | International Business Machines Corporation | III-V semiconductor device having self-aligned contacts |
-
2014
- 2014-03-14 FR FR1452132A patent/FR3018629B1/fr active Active
-
2015
- 2015-03-10 PL PL15717017.6T patent/PL3117465T3/pl unknown
- 2015-03-10 JP JP2016574503A patent/JP6933466B2/ja active Active
- 2015-03-10 ES ES15717017T patent/ES2927683T3/es active Active
- 2015-03-10 RU RU2016140219A patent/RU2686575C2/ru active
- 2015-03-10 US US15/126,027 patent/US10340376B2/en active Active
- 2015-03-10 WO PCT/FR2015/050600 patent/WO2015136218A1/fr not_active Ceased
- 2015-03-10 EP EP15717017.6A patent/EP3117465B1/fr active Active
- 2015-03-10 KR KR1020167028540A patent/KR102329663B1/ko active Active
- 2015-03-13 TW TW104108102A patent/TWI675480B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| WO2015136218A1 (fr) | 2015-09-17 |
| KR102329663B1 (ko) | 2021-11-22 |
| RU2686575C2 (ru) | 2019-04-29 |
| JP2017514316A (ja) | 2017-06-01 |
| TWI675480B (zh) | 2019-10-21 |
| JP6933466B2 (ja) | 2021-09-08 |
| US20170092751A1 (en) | 2017-03-30 |
| RU2016140219A (ru) | 2018-04-17 |
| US10340376B2 (en) | 2019-07-02 |
| KR20160132108A (ko) | 2016-11-16 |
| FR3018629B1 (fr) | 2022-10-28 |
| TW201539742A (zh) | 2015-10-16 |
| FR3018629A1 (fr) | 2015-09-18 |
| RU2016140219A3 (pl) | 2018-10-31 |
| EP3117465A1 (fr) | 2017-01-18 |
| ES2927683T3 (es) | 2022-11-10 |
| EP3117465B1 (fr) | 2022-07-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DK3142721T3 (da) | Kanyleanordning | |
| DK3183051T3 (da) | Væske-til-luftmembranenergivekslere | |
| DK3134402T3 (da) | 4-amino-imidazoquinolinforbindelser | |
| DK3006072T3 (da) | Karadgang | |
| PL3171891T3 (pl) | Sposób | |
| DK3066730T3 (da) | Køleindretning | |
| DK3164088T3 (da) | Forbedret aterektomiindretning | |
| DK3119396T3 (da) | Muscarinreceptoragonister | |
| EP3126132C0 (en) | EMBOSSING-LAMINATING DEVICE | |
| PL3117465T3 (pl) | Heterozłączowy tranzystor polowy | |
| DK3110442T3 (da) | Modificerede meningokok-fhbp-polypeptider | |
| EP3147544C0 (en) | SEALING DEVICE | |
| DK3183340T3 (da) | Termolabile exonukleaser | |
| FR3030114B1 (fr) | Transistor hemt | |
| DE102014001423A8 (de) | Belüftungsvorrichtung | |
| DE112015001664A5 (de) | Betätigungsaktuator | |
| PL3644626T3 (pl) | Urządzenie głośnikowe | |
| DK3147601T3 (da) | Køleanaordning | |
| DK3102256T3 (da) | Injektionsapparat | |
| DK3102257T3 (da) | Injektionsapparat | |
| DK3154703T3 (da) | Fuldkappe-snekkecentrifuge | |
| DK3110439T3 (da) | Pcsk9-vacciner | |
| DE102014000623A8 (de) | Halbhohlnietelement | |
| DE112014006700A5 (de) | Transportvorrichtung | |
| DK3009858T3 (da) | Skyradar |