PL3126402T3 - Metoda wykonywania połączenia klejowego inicjowanego plazmą - Google Patents
Metoda wykonywania połączenia klejowego inicjowanego plazmąInfo
- Publication number
- PL3126402T3 PL3126402T3 PL15713323T PL15713323T PL3126402T3 PL 3126402 T3 PL3126402 T3 PL 3126402T3 PL 15713323 T PL15713323 T PL 15713323T PL 15713323 T PL15713323 T PL 15713323T PL 3126402 T3 PL3126402 T3 PL 3126402T3
- Authority
- PL
- Poland
- Prior art keywords
- plasma
- adhesive bonding
- initiated adhesive
- initiated
- bonding
- Prior art date
Links
- 238000004026 adhesive bonding Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/08—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers using foamed adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/52—Polymerisation initiated by wave energy or particle radiation by electric discharge, e.g. voltolisation
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0091—Complexes with metal-heteroatom-bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2421/00—Presence of unspecified rubber
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2475/00—Presence of polyurethane
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102014206220.9A DE102014206220A1 (de) | 2014-04-01 | 2014-04-01 | Verfahren zur Plasma-initiierten Verklebung |
| PCT/EP2015/056701 WO2015150251A1 (de) | 2014-04-01 | 2015-03-27 | Verfahren zur plasma-initiierten verklebung |
| EP15713323.2A EP3126402B1 (de) | 2014-04-01 | 2015-03-27 | Verfahren zur plasma-initiierten verklebung |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PL3126402T3 true PL3126402T3 (pl) | 2018-10-31 |
Family
ID=52780541
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL15713323T PL3126402T3 (pl) | 2014-04-01 | 2015-03-27 | Metoda wykonywania połączenia klejowego inicjowanego plazmą |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US10899947B2 (pl) |
| EP (1) | EP3126402B1 (pl) |
| JP (1) | JP6537526B2 (pl) |
| KR (1) | KR102050479B1 (pl) |
| CN (1) | CN106133082B (pl) |
| DE (1) | DE102014206220A1 (pl) |
| PL (1) | PL3126402T3 (pl) |
| WO (1) | WO2015150251A1 (pl) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102015009764A1 (de) * | 2015-07-31 | 2017-02-02 | Tesa Se | Reaktives Klebstofffilm-System zur Verklebung unpolarer Oberflächen |
| DE102016223783A1 (de) * | 2016-11-30 | 2018-05-30 | Tesa Se | Applikator für plasmainitiierbare Klebebänder mit Faltmechanismus |
| DE102019209513A1 (de) | 2019-06-28 | 2020-12-31 | Tesa Se | UV-härtender reaktiver Klebstoff |
| DE102020208059A1 (de) | 2020-06-29 | 2021-12-30 | Tesa Se | Lagerstabiles reaktives haftklebeband |
| DE102020210893B4 (de) | 2020-08-28 | 2022-12-08 | Tesa Se | Verfahren zur Herstellung von versiegelten Klebebändern mit aushärtbaren Klebemassen, versiegeltes Klebeband und Verwendung |
| DE102020215764A1 (de) * | 2020-12-11 | 2022-06-15 | Karl Wörwag Lack- Und Farbenfabrik Gmbh & Co. Kg | Verfahren zum Aufbringen einer Klebefolie |
| DE102021125429A1 (de) | 2021-09-30 | 2023-03-30 | Tesa Se | Lichthärtender reaktiver Klebstofffilm |
| DE102022105737A1 (de) | 2022-03-11 | 2023-09-14 | Tesa Se | Aushärtbare Klebemasse mit verbesserter Stanzbarkeit und verbesserten Schockeigenschaften |
| DE102022105738A1 (de) | 2022-03-11 | 2023-09-14 | Tesa Se | Aushärtbare Klebemasse mit verbesserter Stanzbarkeit |
| DE102022124902A1 (de) | 2022-09-28 | 2024-03-28 | Tesa Se | Kationisch härtbare Klebemasse mit Indikation der Haltefestigkeit |
| DE102022124904A1 (de) | 2022-09-28 | 2024-03-28 | Tesa Se | Aushärtbare Haftklebemasse mit verbesserten Klebeeigenschaften |
| DE102022124903A1 (de) | 2022-09-28 | 2024-03-28 | Tesa Se | Kationisch härtbare Klebemasse mit definierter Färbung im ausgehärteten Zustand |
| DE102022129681A1 (de) | 2022-11-10 | 2024-05-16 | Tesa Se | Greifvorrichtung mit integrierter Strahlungsaktivierung |
| DE102023104901B4 (de) | 2023-02-28 | 2026-01-15 | Tesa Se | Vorrichtung und Verfahren zur UV-Strahlungsaktivierung von bahnförmigen Klebebändern |
| DE102023110590A1 (de) | 2023-04-25 | 2024-10-31 | Tesa Se | Reaktives Haftklebeelement |
| DE102023111054A1 (de) | 2023-04-28 | 2024-10-31 | Tesa Se | Kationisch härtbare Klebmasse, insbesondere zur Verklebung von metallischen Substraten |
| DE102023111055A1 (de) | 2023-04-28 | 2024-10-31 | Tesa Se | Chemikalienbeständiges, reaktives Haftklebeband |
| DE102023111057A1 (de) | 2023-04-28 | 2024-10-31 | Tesa Se | Chemikalienbeständiges, reaktives Haftklebeband |
| DE102023135599A1 (de) | 2023-12-18 | 2025-06-18 | Tesa Se | Aushärtbare Haftklebemasse mit hoher Verklebungsfestigkeit und guter Klebkraft im ausgehärteten Zustand |
| EP4578922A1 (en) | 2023-12-27 | 2025-07-02 | Tesa Se | Adhesive bonding stack and self-adhesive tape therefore |
| CN120230493A (zh) | 2023-12-28 | 2025-07-01 | 德莎欧洲股份公司 | 固化性电绝缘带 |
| DE102024103441A1 (de) | 2024-02-07 | 2025-08-07 | Tesa Se | Lichthärtender reaktiver Klebstofffilm auf Basis von (Meth)Acrylat-funktionalisiertem Polyurethan |
| DE102024117266A1 (de) | 2024-06-19 | 2025-12-24 | Tesa Se | Lichthärtender reaktiver Klebstofffilm mit verbesserter Lagerstabilität nach Lichteinwirkung |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4212719A (en) | 1978-08-18 | 1980-07-15 | The Regents Of The University Of California | Method of plasma initiated polymerization |
| IT1157273B (it) * | 1982-05-07 | 1987-02-11 | Anic Spa | Composizioni termoplastiche a base di polimeri organici non polari e zeoliti in forma acida, dotate di tenace adesione a metalli ed oggetti compositi ottenibili mediante le medesime |
| US4705612A (en) | 1985-02-08 | 1987-11-10 | Terumo Kabushiki Kaisha | Method for plasma-initiated polymerization |
| US4898899A (en) * | 1987-12-25 | 1990-02-06 | Toagosei Chemical Industry Co. | Adhesive composition |
| JPH02263880A (ja) * | 1989-04-04 | 1990-10-26 | Daiabondo Kogyo Kk | 接着剤組成物 |
| CA2048232A1 (en) * | 1990-09-05 | 1992-03-06 | Jerry W. Williams | Energy curable pressure-sensitive compositions |
| DE4242059C1 (de) * | 1992-12-13 | 1994-03-10 | Bayerische Motoren Werke Ag | Verfahren zum thermischen Verbinden von Kunststoff-Formkörpern mit weiteren Kunststoffkomponenten mittels einer durch Plasmapolymerisation aufgetragenen Zwischenschicht |
| JP3695874B2 (ja) * | 1997-01-29 | 2005-09-14 | 三井化学株式会社 | 半導体ウエハのダイシング方法及び該方法に用いる粘着フィルム |
| JP4418992B2 (ja) * | 1997-07-30 | 2010-02-24 | 株式会社スリーボンド | 暗反応硬化組成物の硬化方法 |
| JP3968880B2 (ja) * | 1998-07-28 | 2007-08-29 | 三菱化学株式会社 | 顔料及びその分散体 |
| DE19914953A1 (de) * | 1999-04-01 | 2000-10-05 | Basf Ag | Verfahren der radikalisch initiierten wässrigen Emulsionspolymerisation |
| GB0010684D0 (en) * | 2000-05-03 | 2000-06-28 | Int Aluminium Holdings Ltd | Adhesive curing apparatus and method |
| JP2003240941A (ja) * | 2002-02-19 | 2003-08-27 | Shin Etsu Polymer Co Ltd | 近赤外線遮断部材及びその製造方法 |
| JP4645075B2 (ja) * | 2004-06-25 | 2011-03-09 | 東洋インキ製造株式会社 | 硬化型粘接着材料 |
| DE602006004313D1 (de) * | 2005-02-22 | 2009-01-29 | Asahi Glass Co Ltd | Haftklebemasse, haftklebefilm sowie optisches filter |
| CN101213267A (zh) * | 2005-05-10 | 2008-07-02 | 株式会社日本触媒 | 含有近红外线吸收剂的压敏粘合剂组合物 |
| JP4862335B2 (ja) * | 2005-09-28 | 2012-01-25 | 凸版印刷株式会社 | 電磁波シールド性光透過部材の製造方法 |
| JP2009019176A (ja) * | 2007-07-13 | 2009-01-29 | Toyo Ink Mfg Co Ltd | 帯電防止粘着剤組成物およびそれを用いてなる粘着シート |
| DE102008023252A1 (de) * | 2008-05-13 | 2009-11-19 | Tesa Se | Hotmelt-Verfahren zur Herstellung eines chemisch vernetzten Polyurethanfilms |
| DE102010044114A1 (de) * | 2010-11-18 | 2012-05-24 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zum Verbinden von Substraten und damit erhältliche Verbundstruktur |
| JP6123152B2 (ja) | 2010-12-08 | 2017-05-10 | 味の素株式会社 | 樹脂組成物 |
| DE112012001999A5 (de) * | 2011-05-06 | 2014-03-27 | Tesa Se | Verfahren zur Erhöhung der adhäsiven Eigenschaften von Haftklebemassen auf Untergründen mittels Plasmabehandlung |
| GB2497114B (en) * | 2011-12-01 | 2015-02-18 | Spinnaker Int Ltd | Adhesive composition |
| JP2013258332A (ja) * | 2012-06-13 | 2013-12-26 | Fujifilm Corp | 半導体装置製造用仮接着剤、並びに、それを用いた接着性支持体、及び、半導体装置の製造方法 |
-
2014
- 2014-04-01 DE DE102014206220.9A patent/DE102014206220A1/de not_active Withdrawn
-
2015
- 2015-03-27 PL PL15713323T patent/PL3126402T3/pl unknown
- 2015-03-27 KR KR1020167030177A patent/KR102050479B1/ko active Active
- 2015-03-27 US US15/128,330 patent/US10899947B2/en active Active
- 2015-03-27 CN CN201580017838.4A patent/CN106133082B/zh active Active
- 2015-03-27 WO PCT/EP2015/056701 patent/WO2015150251A1/de not_active Ceased
- 2015-03-27 JP JP2016560497A patent/JP6537526B2/ja active Active
- 2015-03-27 EP EP15713323.2A patent/EP3126402B1/de active Active
Also Published As
| Publication number | Publication date |
|---|---|
| DE102014206220A1 (de) | 2015-10-01 |
| CN106133082A (zh) | 2016-11-16 |
| WO2015150251A1 (de) | 2015-10-08 |
| KR102050479B1 (ko) | 2019-11-29 |
| EP3126402A1 (de) | 2017-02-08 |
| KR20160140829A (ko) | 2016-12-07 |
| JP6537526B2 (ja) | 2019-07-03 |
| US20170114250A1 (en) | 2017-04-27 |
| US10899947B2 (en) | 2021-01-26 |
| CN106133082B (zh) | 2019-08-09 |
| JP2017512875A (ja) | 2017-05-25 |
| EP3126402B1 (de) | 2018-05-02 |
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