PL3160219T3 - Sposób i urządzenie do umieszczania elektronicznych komponentów - Google Patents

Sposób i urządzenie do umieszczania elektronicznych komponentów

Info

Publication number
PL3160219T3
PL3160219T3 PL16180010T PL16180010T PL3160219T3 PL 3160219 T3 PL3160219 T3 PL 3160219T3 PL 16180010 T PL16180010 T PL 16180010T PL 16180010 T PL16180010 T PL 16180010T PL 3160219 T3 PL3160219 T3 PL 3160219T3
Authority
PL
Poland
Prior art keywords
electronic components
placing electronic
placing
components
electronic
Prior art date
Application number
PL16180010T
Other languages
English (en)
Inventor
Udo Hofmann
Wolfram Sinn
Sergei Richter
Original Assignee
Ersa Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ersa Gmbh filed Critical Ersa Gmbh
Publication of PL3160219T3 publication Critical patent/PL3160219T3/pl

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/70—Determining position or orientation of objects or cameras
    • G06T7/73—Determining position or orientation of objects or cameras using feature-based methods
    • G06T7/74—Determining position or orientation of objects or cameras using feature-based methods involving reference images or patches
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0053—Arrangements for assisting the manual mounting of components, e.g. special tables or light spots indicating the place for mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0486—Replacement and removal of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0818—Setup of monitoring devices prior to starting mounting operations; Teaching of monitoring devices for specific products; Compensation of drifts during operation, e.g. due to temperature shifts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/085—Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level
    • H05K13/0853—Determination of transport trajectories inside mounting machines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/089—Calibration, teaching or correction of mechanical systems, e.g. of the mounting head
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30141—Printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Supply And Installment Of Electrical Components (AREA)
PL16180010T 2015-10-23 2016-07-18 Sposób i urządzenie do umieszczania elektronicznych komponentów PL3160219T3 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102015220746.3A DE102015220746A1 (de) 2015-10-23 2015-10-23 Verfahren und Vorrichtung zur Platzierung elektronischer Bauteile
EP16180010.7A EP3160219B1 (de) 2015-10-23 2016-07-18 Verfahren und vorrichtung zur platzierung elektronischer bauteile

Publications (1)

Publication Number Publication Date
PL3160219T3 true PL3160219T3 (pl) 2019-02-28

Family

ID=56684448

Family Applications (1)

Application Number Title Priority Date Filing Date
PL16180010T PL3160219T3 (pl) 2015-10-23 2016-07-18 Sposób i urządzenie do umieszczania elektronicznych komponentów

Country Status (5)

Country Link
US (1) US10217211B2 (pl)
EP (1) EP3160219B1 (pl)
CN (1) CN106879185B (pl)
DE (1) DE102015220746A1 (pl)
PL (1) PL3160219T3 (pl)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6522644B2 (ja) * 2014-11-11 2019-05-29 株式会社Ｆｕｊｉ 電子部品装着機の制御装置及びその制御装置へのデータ入力装置
US10338006B2 (en) * 2017-06-15 2019-07-02 Asm Technology Singapore Pte Ltd Method and apparatus for aligning and inspecting electronic components
JP7148108B2 (ja) * 2017-07-06 2022-10-05 メイショウ株式会社 部品実装装置及び部品実装用プログラム
WO2019009095A1 (ja) * 2017-07-06 2019-01-10 メイショウ株式会社 部品実装装置及び部品実装用プログラム
US11529742B2 (en) 2019-10-21 2022-12-20 Silicon Laboratories Inc. Control of low-cost robotics and method therefor
US11878432B2 (en) * 2019-10-21 2024-01-23 Silicon Laboratories Inc. Low-cost robotics for placement of integrated circuit and method therefor
CN114927001B (zh) * 2022-04-19 2023-09-26 天津二建建筑工程有限公司 一种视频监控方法、系统、智能终端及存储介质

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0152879B1 (ko) * 1995-10-10 1998-12-15 이희종 표면실장기의 부품인식방법 및 장치
DE19857263A1 (de) * 1998-12-11 2000-03-16 Peter Gammelin Verfahren und Vorrichtung zum Positionieren von Bauelementen auf Trägern
US6634091B1 (en) * 2000-02-15 2003-10-21 Samsung Techwin Co., Ltd. Part mounter
ATE423392T1 (de) * 2000-03-10 2009-03-15 Infotech Ag Verfahren und vorrichtung zum justieren eines bauelementes auf einem substrat unter verwendung von digitaler merkmaltrennung
JP4045838B2 (ja) * 2002-04-12 2008-02-13 松下電器産業株式会社 部品装着管理方法
WO2004086840A2 (en) * 2003-03-28 2004-10-07 Assembleon N.V. Method of placing at least one component on at least one substrate and apparatus therefore
DE10325179A1 (de) * 2003-06-04 2004-12-23 Marconi Communications Gmbh Verfahren zum Montieren einer Schaltung
US7706595B2 (en) * 2003-11-07 2010-04-27 Cyberoptics Corporation Pick and place machine with workpiece motion inspection
JP4165538B2 (ja) * 2004-07-21 2008-10-15 オムロン株式会社 部品実装検査方法および部品実装検査装置
CN101185102A (zh) * 2005-06-02 2008-05-21 松下电器产业株式会社 元件自动示教装置
JP2007173801A (ja) * 2005-12-22 2007-07-05 Unaxis Internatl Trading Ltd フリップチップを基板に取り付ける方法
JP4367524B2 (ja) * 2007-05-22 2009-11-18 パナソニック株式会社 電子部品実装システムおよび電子部品実装方法
DE102008033903A1 (de) * 2008-07-18 2010-01-21 Suss Microtec Test Systems Gmbh Vorrichtung und Verfahren zur Montage mehrerer Halbleiterbauelemente auf einem Zielsubstrat
JP5018812B2 (ja) * 2009-03-16 2012-09-05 パナソニック株式会社 スクリーン印刷機及びスクリーン印刷方法
JP5246064B2 (ja) * 2009-06-29 2013-07-24 パナソニック株式会社 電子部品実装方法
JP5745045B2 (ja) * 2010-06-30 2015-07-08 ケーエルエー−テンカー コーポレイション 入力媒体及び出力媒体の区画内に電子デバイスを配置する方法及び装置
JP5408153B2 (ja) * 2011-02-21 2014-02-05 パナソニック株式会社 電子部品実装装置および電子部品実装装置における画像読取り方法
CH705802B1 (de) * 2011-11-25 2016-04-15 Esec Ag Einrichtung für die Montage von Halbleiterchips.
JP5830644B2 (ja) * 2011-12-06 2015-12-09 パナソニックＩｐマネジメント株式会社 下受けピン配置判定装置および下受けピン配置判定方法
TWI421972B (zh) * 2011-12-08 2014-01-01 財團法人金屬工業研究發展中心 無標記異空間基板組裝對位方法及系統
JP5781975B2 (ja) * 2012-03-30 2015-09-24 ヤマハ発動機株式会社 電子部品の装着方法及び電子部品の装着装置
WO2014030326A1 (ja) * 2012-08-22 2014-02-27 パナソニック株式会社 部品実装装置及び部品実装方法
US9162880B2 (en) * 2012-09-07 2015-10-20 LuxVue Technology Corporation Mass transfer tool
WO2014041665A1 (ja) * 2012-09-13 2014-03-20 株式会社日立製作所 プリント基板設計検証システム、プリント基板設計検証方法及び記録媒体
JP5884015B2 (ja) * 2012-11-19 2016-03-15 パナソニックＩｐマネジメント株式会社 電子部品装着システム
US9661793B2 (en) * 2012-11-19 2017-05-23 Panasonic Intellectual Property Management Co., Ltd. Electronic component mounting system and electronic component mounting method
WO2014157358A1 (ja) * 2013-03-28 2014-10-02 株式会社日立国際電気 基板処理装置、半導体装置の製造方法及び記録媒体
DE102013207598A1 (de) * 2013-04-25 2014-10-30 Finetech Gmbh & Co.Kg Platziervorrichtung und Platzierverfahren
JP6285275B2 (ja) * 2014-04-30 2018-02-28 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6426984B2 (ja) * 2014-11-18 2018-11-21 キヤノン株式会社 リソグラフィ装置および物品製造方法
WO2016135915A1 (ja) * 2015-02-26 2016-09-01 富士機械製造株式会社 部品実装機

Also Published As

Publication number Publication date
EP3160219A1 (de) 2017-04-26
US20170116720A1 (en) 2017-04-27
CN106879185B (zh) 2020-05-19
DE102015220746A1 (de) 2017-04-27
US10217211B2 (en) 2019-02-26
EP3160219B1 (de) 2018-09-12
CN106879185A (zh) 2017-06-20

Similar Documents

Publication Publication Date Title
IL276708A (en) Electronic inhaler and components thereof
PL3748467T3 (pl) Urządzenie elektroniczne i sposób jego działania
ZA201804421B (en) An electronic transaction method and apparatus
ZA201803066B (en) Electronic devices and method for direct communication
IL251127A0 (en) Electronic inhaler and components thereof
SG11201802020WA (en) Device and method for self-adjustment of a component-handling device for electronic components
ZA201706395B (en) Imaging method, imaging device, and electronic device
EP3335188A4 (en) Method and electronic device for providing content
SG11201609273UA (en) Electronic device and method
SG11201901161RA (en) Electronic device housing and method for producing same
SG10201504081PA (en) Method and apparatus for resin-sealing electronic components
EP2926464A4 (en) ELECTRONIC DEVICE AND METHOD FOR CONTROLLING THEREOF
GB201612114D0 (en) Input device and electronic apparatus
EP3352449A4 (en) Electronic device and photographing method
HUE039157T2 (hu) Ikonmozgató eljárás és berendezés és elektronikus készülék
GB201809204D0 (en) System and method for facilitating electronic transacrions
PL3160219T3 (pl) Sposób i urządzenie do umieszczania elektronicznych komponentów
SG10201504806YA (en) Device And Method For Turning An Elevated Structure
EP3379733A4 (en) Electronic device and operation method therefor
TWI563427B (en) Automatic calibration method and electronic apparatus
GB201711531D0 (en) Electronic device and electronic apparatus
EP3182773A4 (en) Positioning method and electronic device
EP3236667A4 (en) Electronic device and method
IL287058A (en) Method and device for closure
HUE053342T2 (hu) Eljárás és berendezés határszint meghatározáshoz