PL3187964T3 - Układ rozpraszania ciepła - Google Patents

Układ rozpraszania ciepła

Info

Publication number
PL3187964T3
PL3187964T3 PL16165274T PL16165274T PL3187964T3 PL 3187964 T3 PL3187964 T3 PL 3187964T3 PL 16165274 T PL16165274 T PL 16165274T PL 16165274 T PL16165274 T PL 16165274T PL 3187964 T3 PL3187964 T3 PL 3187964T3
Authority
PL
Poland
Prior art keywords
heat dissipation
dissipation system
heat
dissipation
Prior art date
Application number
PL16165274T
Other languages
English (en)
Inventor
Cheng-Lung Chen
Ching-Chi Wu
Original Assignee
Msi Computer (Shenzhen) Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Msi Computer (Shenzhen) Co., Ltd. filed Critical Msi Computer (Shenzhen) Co., Ltd.
Publication of PL3187964T3 publication Critical patent/PL3187964T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1675—Miscellaneous details related to the relative movement between the different enclosures or enclosure parts
    • G06F1/1681—Details related solely to hinges
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/43—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing gases, e.g. forced air cooling

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
PL16165274T 2015-12-30 2016-04-14 Układ rozpraszania ciepła PL3187964T3 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW104221183U TWM519270U (zh) 2015-12-30 2015-12-30 散熱系統
EP16165274.8A EP3187964B1 (en) 2015-12-30 2016-04-14 Heat dissipation system

Publications (1)

Publication Number Publication Date
PL3187964T3 true PL3187964T3 (pl) 2018-09-28

Family

ID=56086745

Family Applications (1)

Application Number Title Priority Date Filing Date
PL16165274T PL3187964T3 (pl) 2015-12-30 2016-04-14 Układ rozpraszania ciepła

Country Status (6)

Country Link
US (1) US20170196122A1 (pl)
EP (1) EP3187964B1 (pl)
CN (1) CN205726812U (pl)
ES (1) ES2668043T3 (pl)
PL (1) PL3187964T3 (pl)
TW (1) TWM519270U (pl)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6649854B2 (ja) * 2016-07-21 2020-02-19 レノボ・シンガポール・プライベート・リミテッド 電子機器
TWI636357B (zh) * 2017-05-24 2018-09-21 微星科技股份有限公司 散熱器組件及包含其的主機板組件
TWI637257B (zh) * 2017-05-24 2018-10-01 微星科技股份有限公司 電子裝置及其散熱裝置
TWI666543B (zh) * 2018-03-15 2019-07-21 英研智能移動股份有限公司 可變橋接的散熱模組及其應用的電子裝置
CN113196207A (zh) 2018-12-18 2021-07-30 康普技术有限责任公司 用于模块化电子装置的热管理
TWI770899B (zh) * 2021-03-25 2022-07-11 微星科技股份有限公司 可攜式電子裝置的散熱系統

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08204373A (ja) * 1995-01-27 1996-08-09 Diamond Electric Mfg Co Ltd 放熱装置
US5910883A (en) * 1997-08-06 1999-06-08 International Business Machines Corporation Hinge incorporating a helically coiled heat pipe for a laptop computer
US7529756B1 (en) * 1998-07-21 2009-05-05 West Services, Inc. System and method for processing formatted text documents in a database
US6137683A (en) * 1999-10-01 2000-10-24 Compal Electronics, Inc. Heat-dissipating device for an electronic component
CN101727151B (zh) * 2008-10-14 2012-11-21 富准精密工业(深圳)有限公司 便携式电脑及其导热枢纽
CN101776941B (zh) * 2009-01-08 2013-03-13 富准精密工业(深圳)有限公司 散热装置
US8405997B2 (en) * 2009-06-30 2013-03-26 Kabushiki Kaisha Toshiba Electronic apparatus
CN102449759B (zh) * 2011-09-30 2013-08-28 华为技术有限公司 一种散热器
US9243444B2 (en) * 2012-06-29 2016-01-26 The Intellectual Gorilla Gmbh Fire rated door
CN203243662U (zh) * 2013-04-24 2013-10-16 微星科技股份有限公司 散热系统

Also Published As

Publication number Publication date
ES2668043T3 (es) 2018-05-16
US20170196122A1 (en) 2017-07-06
EP3187964A1 (en) 2017-07-05
EP3187964B1 (en) 2018-04-11
CN205726812U (zh) 2016-11-23
TWM519270U (zh) 2016-03-21

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