PL3380649T3 - Kompozycja kąpieli galwanicznej i sposób bezprądowego powlekania palladem - Google Patents

Kompozycja kąpieli galwanicznej i sposób bezprądowego powlekania palladem

Info

Publication number
PL3380649T3
PL3380649T3 PL16801528T PL16801528T PL3380649T3 PL 3380649 T3 PL3380649 T3 PL 3380649T3 PL 16801528 T PL16801528 T PL 16801528T PL 16801528 T PL16801528 T PL 16801528T PL 3380649 T3 PL3380649 T3 PL 3380649T3
Authority
PL
Poland
Prior art keywords
composition
electroplating bath
electroless palladium
palladium coating
coating
Prior art date
Application number
PL16801528T
Other languages
English (en)
Inventor
Andreas Walter
Christof Suchentrunk
Thomas Beck
Gerhard Steinberger
Holger BERA
Heiko Brunner
Bernd Froese
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Publication of PL3380649T3 publication Critical patent/PL3380649T3/pl

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
    • C23C18/1642—Substrates other than metallic, e.g. inorganic or organic or non-conductive semiconductor
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C23C18/1683—Control of electrolyte composition, e.g. measurement, adjustment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/187—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating means therefor, e.g. baths, apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1651—Two or more layers only obtained by electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/072—Electroless plating, e.g. finish plating or initial plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0736—Methods for applying liquids, e.g. spraying

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrochemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
PL16801528T 2015-11-27 2016-11-28 Kompozycja kąpieli galwanicznej i sposób bezprądowego powlekania palladem PL3380649T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP15196799 2015-11-27
EP16801528.7A EP3380649B1 (en) 2015-11-27 2016-11-28 Plating bath composition and method for electroless plating of palladium
PCT/EP2016/079008 WO2017089610A1 (en) 2015-11-27 2016-11-28 Plating bath composition and method for electroless plating of palladium

Publications (1)

Publication Number Publication Date
PL3380649T3 true PL3380649T3 (pl) 2020-05-18

Family

ID=54707661

Family Applications (1)

Application Number Title Priority Date Filing Date
PL16801528T PL3380649T3 (pl) 2015-11-27 2016-11-28 Kompozycja kąpieli galwanicznej i sposób bezprądowego powlekania palladem

Country Status (9)

Country Link
US (1) US10513780B2 (pl)
EP (1) EP3380649B1 (pl)
JP (1) JP6991139B2 (pl)
KR (1) KR102070536B1 (pl)
CN (1) CN108291307B (pl)
PL (1) PL3380649T3 (pl)
PT (1) PT3380649T (pl)
TW (1) TWI707061B (pl)
WO (1) WO2017089610A1 (pl)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102614202B1 (ko) * 2014-12-17 2023-12-14 아토테크 도이칠란트 게엠베하 운트 콤파니 카게 팔라듐의 무전해 도금을 위한 도금 배쓰 조성물 및 방법
JP7149061B2 (ja) * 2017-10-06 2022-10-06 上村工業株式会社 無電解パラジウムめっき液
CN114086160A (zh) * 2021-11-10 2022-02-25 江苏艾森半导体材料股份有限公司 一种铜表面化学镀钯活化液及其应用
CN116497346A (zh) * 2023-05-22 2023-07-28 深圳市富利特科技有限公司 一种用于离子钯的还原溶液及其制备方法及用途

Family Cites Families (34)

* Cited by examiner, † Cited by third party
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GB1180891A (en) * 1967-06-19 1970-02-11 Mobil Oil Corp Electroless Deposition of Metals
US3649308A (en) * 1970-05-21 1972-03-14 Shipley Co Stabilized electroless plating solutions
DE2028950B2 (de) * 1970-06-12 1976-05-13 Shipley Co., Inc., Newton, Mass. (V.SLA.) Waessrige loesung zum stromlosen abschneiden von nickel, kobalt oder legierungen davon
GB1315212A (en) * 1970-07-31 1973-05-02 Shipley Co Electroless nickel and or cobalt plating solutions
US3663242A (en) * 1970-09-25 1972-05-16 Shipley Co Stabilized electroless plating solutions
US3661597A (en) * 1971-05-20 1972-05-09 Shipley Co Electroless copper plating
US4265943A (en) * 1978-11-27 1981-05-05 Macdermid Incorporated Method and composition for continuous electroless copper deposition using a hypophosphite reducing agent in the presence of cobalt or nickel ions
US4255194A (en) * 1979-01-15 1981-03-10 Mine Safety Appliances Company Palladium alloy baths for the electroless deposition
US4623554A (en) * 1985-03-08 1986-11-18 International Business Machines Corp. Method for controlling plating rate in an electroless plating system
US4790912A (en) * 1985-06-06 1988-12-13 Techno-Instruments Investments Ltd. Selective plating process for the electrolytic coating of circuit boards without an electroless metal coating
JPH02170982A (ja) * 1988-12-23 1990-07-02 Kawasaki Steel Corp 簡易表面処理用電解質ペースト
JPH0539580A (ja) * 1991-08-02 1993-02-19 Okuno Seiyaku Kogyo Kk 無電解パラジウムめつき液
US5882736A (en) 1993-05-13 1999-03-16 Atotech Deutschland Gmbh palladium layers deposition process
JPH08264372A (ja) * 1995-03-17 1996-10-11 Taiyo Yuden Co Ltd 無電解メッキ膜付電子部品の製造方法
JP3051683B2 (ja) * 1996-12-10 2000-06-12 栄電子工業株式会社 無電解金めっき方法
JP3365718B2 (ja) * 1996-12-26 2003-01-14 メルテックス株式会社 無電解めっき用の触媒液
JP2007009250A (ja) 2005-06-29 2007-01-18 Daiken Kagaku Kogyo Kk 電子部品の結線方法及び電子部品
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EP2535929A1 (en) * 2011-06-14 2012-12-19 Atotech Deutschland GmbH Wire bondable surface for microelectronic devices
EP2581470B1 (en) 2011-10-12 2016-09-28 ATOTECH Deutschland GmbH Electroless palladium plating bath composition
EP2639335B1 (en) * 2012-03-14 2015-09-16 Atotech Deutschland GmbH Alkaline plating bath for electroless deposition of cobalt alloys
EP2671969A1 (en) * 2012-06-04 2013-12-11 ATOTECH Deutschland GmbH Plating bath for electroless deposition of nickel layers
EP2740818B1 (en) 2012-12-05 2016-03-30 ATOTECH Deutschland GmbH Method for manufacture of wire bondable and solderable surfaces on noble metal electrodes
EP2801640A1 (en) * 2013-05-08 2014-11-12 ATOTECH Deutschland GmbH Galvanic nickel or nickel alloy electroplating bath for depositing a semi-bright nickel or nickel alloy
EP2887779A1 (en) * 2013-12-20 2015-06-24 ATOTECH Deutschland GmbH Silver wire bonding on printed circuit boards and IC-substrates
EP2910666A1 (en) * 2014-02-21 2015-08-26 ATOTECH Deutschland GmbH Pre-treatment process for electroless plating
JP6347853B2 (ja) 2014-04-10 2018-06-27 アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングＡｔｏｔｅｃｈ Ｄｅｕｔｓｃｈｌａｎｄ ＧｍｂＨ パラジウムの無電解めっきのためのめっき浴組成物及び方法
EP3034650B1 (en) * 2014-12-16 2017-06-21 ATOTECH Deutschland GmbH Plating bath compositions for electroless plating of metals and metal alloys
KR102614202B1 (ko) * 2014-12-17 2023-12-14 아토테크 도이칠란트 게엠베하 운트 콤파니 카게 팔라듐의 무전해 도금을 위한 도금 배쓰 조성물 및 방법
JP6664400B2 (ja) * 2014-12-17 2020-03-13 アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングＡｔｏｔｅｃｈ Ｄｅｕｔｓｃｈｌａｎｄ ＧｍｂＨ パラジウム無電解めっき用のめっき浴組成物およびパラジウムの無電解めっき方法
WO2016150879A1 (en) * 2015-03-20 2016-09-29 Atotech Deutschland Gmbh Activation method for silicon substrates
TWI649449B (zh) * 2015-11-27 2019-02-01 德國艾托特克公司 鈀之電鍍浴組合物及無電電鍍方法

Also Published As

Publication number Publication date
PT3380649T (pt) 2020-02-03
EP3380649B1 (en) 2019-10-30
KR102070536B1 (ko) 2020-01-29
KR20180081819A (ko) 2018-07-17
US20180340260A1 (en) 2018-11-29
JP6991139B2 (ja) 2022-01-12
TWI707061B (zh) 2020-10-11
EP3380649A1 (en) 2018-10-03
TW201723226A (zh) 2017-07-01
CN108291307B (zh) 2020-02-14
US10513780B2 (en) 2019-12-24
JP2019500493A (ja) 2019-01-10
WO2017089610A1 (en) 2017-06-01
CN108291307A (zh) 2018-07-17

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