PL3642396T3 - Kąpiel do powlekania elektrolitycznego niklem do osadzania dekoracyjnej powłoki niklowej na podłożu - Google Patents

Kąpiel do powlekania elektrolitycznego niklem do osadzania dekoracyjnej powłoki niklowej na podłożu

Info

Publication number
PL3642396T3
PL3642396T3 PL18730008T PL18730008T PL3642396T3 PL 3642396 T3 PL3642396 T3 PL 3642396T3 PL 18730008 T PL18730008 T PL 18730008T PL 18730008 T PL18730008 T PL 18730008T PL 3642396 T3 PL3642396 T3 PL 3642396T3
Authority
PL
Poland
Prior art keywords
nickel
depositing
substrate
electroplating bath
decorative
Prior art date
Application number
PL18730008T
Other languages
English (en)
Polish (pl)
Inventor
Philipp Wachter
Rajasekaran Neelamegam
Philip Hartmann
Klaus-Dieter Schulz
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Publication of PL3642396T3 publication Critical patent/PL3642396T3/pl

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C25D3/14—Electroplating: Baths therefor from solutions of nickel or cobalt from baths containing acetylenic or heterocyclic compounds
    • C25D3/16—Acetylenic compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
PL18730008T 2017-06-23 2018-06-18 Kąpiel do powlekania elektrolitycznego niklem do osadzania dekoracyjnej powłoki niklowej na podłożu PL3642396T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP17177732 2017-06-23
PCT/EP2018/066090 WO2018234229A1 (en) 2017-06-23 2018-06-18 NICKEL ELECTROPLACING BATH FOR DEPOSITION OF A DECORATIVE NICKEL COATING ON A SUBSTRATE
EP18730008.2A EP3642396B1 (en) 2017-06-23 2018-06-18 Nickel electroplating bath for depositing a decorative nickel coating on a substrate

Publications (1)

Publication Number Publication Date
PL3642396T3 true PL3642396T3 (pl) 2021-12-27

Family

ID=59215623

Family Applications (1)

Application Number Title Priority Date Filing Date
PL18730008T PL3642396T3 (pl) 2017-06-23 2018-06-18 Kąpiel do powlekania elektrolitycznego niklem do osadzania dekoracyjnej powłoki niklowej na podłożu

Country Status (10)

Country Link
EP (2) EP3642396B1 (es)
JP (2) JP7536452B2 (es)
CN (2) CN121538691A (es)
DK (1) DK3642396T3 (es)
ES (1) ES2890664T3 (es)
HU (1) HUE056778T2 (es)
PL (1) PL3642396T3 (es)
PT (1) PT3642396T (es)
TW (1) TWI762661B (es)
WO (1) WO2018234229A1 (es)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7551647B2 (ja) * 2019-04-15 2024-09-17 アトテック ドイチェランド ゲーエムベーハー ウント コ カーゲー 半光沢ニッケル又は半光沢ニッケル合金コーティングを析出するためのガルバニックニッケル又はニッケル合金電気めっき浴
CN116083987A (zh) * 2022-11-25 2023-05-09 盐城吉瓦新材料科技有限公司 一种具有保护层的电镀金刚线及其制备工艺
US20250137156A1 (en) * 2023-10-26 2025-05-01 Macdermid Enthone Inc. Boric acid-free satin nickel

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1541118A (en) * 1976-12-03 1979-02-21 Bnf Metals Tech Centre Nickel plating
JPS5562188A (en) * 1978-06-19 1980-05-10 Oosakashi Bright black nickel electroplating bath
DD154615B1 (de) * 1980-11-20 1987-11-25 Hans U Galgon Elektrolyt zur galvanischen adscheidung glaenzender goldlegierungen
JPS5881988A (ja) * 1981-11-06 1983-05-17 C Uyemura & Co Ltd 梨地状めつき用添加剤
JPS61163289A (ja) * 1985-01-14 1986-07-23 Nippon Kagaku Sangyo Kk ニツケル及びニツケル合金による黒色電気めつき浴
JPS63171892A (ja) * 1988-01-13 1988-07-15 C Uyemura & Co Ltd 電気めっき方法
JPH09157884A (ja) * 1995-12-12 1997-06-17 Dipsol Chem Co Ltd 非酸性ニッケルめっき浴及び該めっき浴を用いためっき方法
EP0785296B1 (en) * 1995-12-29 2000-03-15 AT&T Corp. Electroplating of nickel on nickel ferrite devices
JP4737790B2 (ja) * 1999-10-01 2011-08-03 株式会社シミズ ほう酸を含まないニッケルめっき浴
JP3261676B2 (ja) * 1999-12-16 2002-03-04 東京都 電気ニッケルめっき浴。
JP4455896B2 (ja) 2004-02-05 2010-04-21 学校法人神奈川大学 めっき液
JP4666134B2 (ja) 2004-09-13 2011-04-06 株式会社村田製作所 ニッケルめっき浴、及び電子部品
US20060096868A1 (en) 2004-11-10 2006-05-11 Siona Bunce Nickel electroplating bath designed to replace monovalent copper strike solutions
TW200934895A (en) * 2008-02-04 2009-08-16 Magtech Technology Co Ltd Nickel plating method with low contamination and high utilization rate
US20110114498A1 (en) * 2009-11-18 2011-05-19 Tremmel Robert A Semi-Bright Nickel Plating Bath and Method of Using Same
JP5675303B2 (ja) * 2010-11-30 2015-02-25 日東光学株式会社 ニッケルめっき浴およびこれを用いた電鋳型の製造方法
JP2012162786A (ja) 2011-02-09 2012-08-30 Kanto Gakuin 電気ニッケルめっき浴、電気ニッケルめっき方法及び電気ニッケルめっき製品
CN103132114B (zh) * 2013-03-21 2016-02-10 湖南特力液压有限公司 耐磨工件及其耐磨镀层的制造方法
EP2801640A1 (en) * 2013-05-08 2014-11-12 ATOTECH Deutschland GmbH Galvanic nickel or nickel alloy electroplating bath for depositing a semi-bright nickel or nickel alloy
JP6195745B2 (ja) * 2013-06-19 2017-09-13 地方独立行政法人東京都立産業技術研究センター 電気ニッケルめっき液、めっき液の製造方法および電気めっき方法
DE102013113129A1 (de) * 2013-11-27 2015-05-28 RIAG Oberflächentechnik AG Verfahren zur galvanischen Abscheidung von Nickel und entsprechender Elektrolyt
DE102014207778B3 (de) * 2014-04-25 2015-05-21 Kiesow Dr. Brinkmann GmbH & Co. KG Verwendung einer Mischung zur Verwendung in einem galvanischen Bad oder eines galvanischen Bades zur Herstellung einer Glanznickelschicht sowie Verfahren zur Herstellung eines Artikels mit einer Glanznickelschicht
DE102014118614A1 (de) * 2014-12-15 2016-06-16 Harting Kgaa Borsäurefreies Nickel-Bad
KR101693514B1 (ko) * 2015-12-24 2017-01-06 주식회사 포스코 전기강판용 Fe-Ni-P 합금 다층 강판 및 이의 제조방법

Also Published As

Publication number Publication date
TW201905243A (zh) 2019-02-01
WO2018234229A1 (en) 2018-12-27
EP3642396A1 (en) 2020-04-29
JP7723696B2 (ja) 2025-08-14
ES2890664T3 (es) 2022-01-21
CN121538691A (zh) 2026-02-17
JP2020524746A (ja) 2020-08-20
TWI762661B (zh) 2022-05-01
JP2023090747A (ja) 2023-06-29
EP3933072A1 (en) 2022-01-05
HUE056778T2 (hu) 2022-03-28
JP7536452B2 (ja) 2024-08-20
EP3642396B1 (en) 2021-07-28
DK3642396T3 (da) 2021-10-11
CN110785516A (zh) 2020-02-11
PT3642396T (pt) 2021-09-10

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